Lead-free solder interconnect reliability:
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Materials Park, OH
ASM International
2005
|
| Schlagworte: | |
| Beschreibung: | x, 292 p. |
| ISBN: | 0871708167 |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV044841556 | ||
| 003 | DE-604 | ||
| 005 | 20180305 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 180305s2005 |||| o||u| ||||||eng d | ||
| 020 | |a 0871708167 |9 0-87170-816-7 | ||
| 035 | |a (ZDB-38-ESG)ebr10320384 | ||
| 035 | |a (OCoLC)729262390 | ||
| 035 | |a (DE-599)BVBBV044841556 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 082 | 0 | |a 621.381/046 |2 22 | |
| 245 | 1 | 0 | |a Lead-free solder interconnect reliability |c edited by Dongkai Shangguan |
| 264 | 1 | |a Materials Park, OH |b ASM International |c 2005 | |
| 300 | |a x, 292 p. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 505 | 8 | |a Includes bibliographical references and index | |
| 650 | 4 | |a Microelectronic packaging |x Reliability | |
| 650 | 4 | |a Solder and soldering | |
| 650 | 4 | |a Lead-free electronics manufacturing processes | |
| 700 | 1 | |a Shangguan, Dongkai |d 1963- |e Sonstige |4 oth | |
| 912 | |a ZDB-38-ESG | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030236418 | ||
Datensatz im Suchindex
| _version_ | 1804178350476886016 |
|---|---|
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV044841556 |
| collection | ZDB-38-ESG |
| contents | Includes bibliographical references and index |
| ctrlnum | (ZDB-38-ESG)ebr10320384 (OCoLC)729262390 (DE-599)BVBBV044841556 |
| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV044841556 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:02:35Z |
| institution | BVB |
| isbn | 0871708167 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030236418 |
| oclc_num | 729262390 |
| open_access_boolean | |
| physical | x, 292 p. |
| psigel | ZDB-38-ESG |
| publishDate | 2005 |
| publishDateSearch | 2005 |
| publishDateSort | 2005 |
| publisher | ASM International |
| record_format | marc |
| spelling | Lead-free solder interconnect reliability edited by Dongkai Shangguan Materials Park, OH ASM International 2005 x, 292 p. txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index Microelectronic packaging Reliability Solder and soldering Lead-free electronics manufacturing processes Shangguan, Dongkai 1963- Sonstige oth |
| spellingShingle | Lead-free solder interconnect reliability Includes bibliographical references and index Microelectronic packaging Reliability Solder and soldering Lead-free electronics manufacturing processes |
| title | Lead-free solder interconnect reliability |
| title_auth | Lead-free solder interconnect reliability |
| title_exact_search | Lead-free solder interconnect reliability |
| title_full | Lead-free solder interconnect reliability edited by Dongkai Shangguan |
| title_fullStr | Lead-free solder interconnect reliability edited by Dongkai Shangguan |
| title_full_unstemmed | Lead-free solder interconnect reliability edited by Dongkai Shangguan |
| title_short | Lead-free solder interconnect reliability |
| title_sort | lead free solder interconnect reliability |
| topic | Microelectronic packaging Reliability Solder and soldering Lead-free electronics manufacturing processes |
| topic_facet | Microelectronic packaging Reliability Solder and soldering Lead-free electronics manufacturing processes |
| work_keys_str_mv | AT shangguandongkai leadfreesolderinterconnectreliability |