Materials for high-density electronic packaging and interconnection: report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council
Gespeichert in:
| Körperschaft: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Washington, D.C.
National Academy Press
1990
|
| Schlagworte: | |
| Beschreibung: | "NMAB-449." |
| Beschreibung: | xiv, 139 p. |
| ISBN: | 030904233X |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV044831910 | ||
| 003 | DE-604 | ||
| 005 | 20180305 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 180305s1990 |||| o||u| ||||||eng d | ||
| 020 | |a 030904233X |9 0-309-04233-X | ||
| 035 | |a (ZDB-38-ESG)ebr10060398 | ||
| 035 | |a (OCoLC)70773031 | ||
| 035 | |a (DE-599)BVBBV044831910 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 082 | 0 | |a 621.381/046 |2 20 | |
| 110 | 2 | |a National Research Council (U.S.) |b Committee on Materials for High-Density Electronic Packaging |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Materials for high-density electronic packaging and interconnection |b report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council |
| 264 | 1 | |a Washington, D.C. |b National Academy Press |c 1990 | |
| 300 | |a xiv, 139 p. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 500 | |a "NMAB-449." | ||
| 505 | 8 | |a Includes bibliographical references | |
| 650 | 4 | |a Electronic packaging |x Materials | |
| 650 | 4 | |a Electrical engineering |x Materials | |
| 912 | |a ZDB-38-ESG | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030226773 | ||
Datensatz im Suchindex
| _version_ | 1804178333363077120 |
|---|---|
| any_adam_object | |
| author_corporate | National Research Council (U.S.) Committee on Materials for High-Density Electronic Packaging |
| author_corporate_role | aut |
| author_facet | National Research Council (U.S.) Committee on Materials for High-Density Electronic Packaging |
| author_sort | National Research Council (U.S.) Committee on Materials for High-Density Electronic Packaging |
| building | Verbundindex |
| bvnumber | BV044831910 |
| collection | ZDB-38-ESG |
| contents | Includes bibliographical references |
| ctrlnum | (ZDB-38-ESG)ebr10060398 (OCoLC)70773031 (DE-599)BVBBV044831910 |
| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>01255nmm a2200325zc 4500</leader><controlfield tag="001">BV044831910</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20180305 </controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">180305s1990 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">030904233X</subfield><subfield code="9">0-309-04233-X</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-38-ESG)ebr10060398</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)70773031</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV044831910</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381/046</subfield><subfield code="2">20</subfield></datafield><datafield tag="110" ind1="2" ind2=" "><subfield code="a">National Research Council (U.S.)</subfield><subfield code="b">Committee on Materials for High-Density Electronic Packaging</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Materials for high-density electronic packaging and interconnection</subfield><subfield code="b">report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Washington, D.C.</subfield><subfield code="b">National Academy Press</subfield><subfield code="c">1990</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">xiv, 139 p.</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">"NMAB-449."</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Includes bibliographical references</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic packaging</subfield><subfield code="x">Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electrical engineering</subfield><subfield code="x">Materials</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-38-ESG</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030226773</subfield></datafield></record></collection> |
| id | DE-604.BV044831910 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T08:02:18Z |
| institution | BVB |
| isbn | 030904233X |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030226773 |
| oclc_num | 70773031 |
| open_access_boolean | |
| physical | xiv, 139 p. |
| psigel | ZDB-38-ESG |
| publishDate | 1990 |
| publishDateSearch | 1990 |
| publishDateSort | 1990 |
| publisher | National Academy Press |
| record_format | marc |
| spelling | National Research Council (U.S.) Committee on Materials for High-Density Electronic Packaging Verfasser aut Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council Washington, D.C. National Academy Press 1990 xiv, 139 p. txt rdacontent c rdamedia cr rdacarrier "NMAB-449." Includes bibliographical references Electronic packaging Materials Electrical engineering Materials |
| spellingShingle | Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council Includes bibliographical references Electronic packaging Materials Electrical engineering Materials |
| title | Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council |
| title_auth | Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council |
| title_exact_search | Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council |
| title_full | Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council |
| title_fullStr | Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council |
| title_full_unstemmed | Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council |
| title_short | Materials for high-density electronic packaging and interconnection |
| title_sort | materials for high density electronic packaging and interconnection report of the committee on materials for high density electronic packaging national materials advisory board commission on engineering and technical systems national research council |
| title_sub | report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council |
| topic | Electronic packaging Materials Electrical engineering Materials |
| topic_facet | Electronic packaging Materials Electrical engineering Materials |
| work_keys_str_mv | AT nationalresearchcounciluscommitteeonmaterialsforhighdensityelectronicpackaging materialsforhighdensityelectronicpackagingandinterconnectionreportofthecommitteeonmaterialsforhighdensityelectronicpackagingnationalmaterialsadvisoryboardcommissiononengineeringandtechnicalsystemsnationalresearchcouncil |