APA-Zitierstil (7. Ausg.)

Hofmann, L. (2017). 3D-wafer level packaging approaches for MEMS by using cu-based high aspect ratio through silicon vias.

Chicago-Zitierstil (17. Ausg.)

Hofmann, Lutz. 3D-wafer Level Packaging Approaches for MEMS by Using Cu-based High Aspect Ratio Through Silicon Vias. Chemnitz, 2017.

MLA-Zitierstil (9. Ausg.)

Hofmann, Lutz. 3D-wafer Level Packaging Approaches for MEMS by Using Cu-based High Aspect Ratio Through Silicon Vias. 2017.