Cooling of microelectronic and nanoelectronic equipment: advances and emerging research
To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectr...
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Singapore
World Scientific Pub. Co.
c2015
|
| Schriftenreihe: | WSPC series in advanced integration and packaging
vol. 3 |
| Schlagworte: | |
| Online-Zugang: | FHN01 Volltext |
| Zusammenfassung: | To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging |
| Beschreibung: | x, 460 p. ill. (some col.) |
| ISBN: | 9789814579797 |
Internformat
MARC
| LEADER | 00000nmm a2200000zcb4500 | ||
|---|---|---|---|
| 001 | BV044640315 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 171120s2015 |||| o||u| ||||||eng d | ||
| 020 | |a 9789814579797 |9 978-981-4579-79-7 | ||
| 024 | 7 | |a 10.1142/9067 |2 doi | |
| 035 | |a (ZDB-124-WOP)00006138 | ||
| 035 | |a (OCoLC)988732343 | ||
| 035 | |a (DE-599)BVBBV044640315 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-92 | ||
| 082 | 0 | |a 621.38 |2 22 | |
| 245 | 1 | 0 | |a Cooling of microelectronic and nanoelectronic equipment |b advances and emerging research |c editors, Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia |
| 264 | 1 | |a Singapore |b World Scientific Pub. Co. |c c2015 | |
| 300 | |a x, 460 p. |b ill. (some col.) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a WSPC series in advanced integration and packaging |v vol. 3 | |
| 520 | |a To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging | ||
| 650 | 4 | |a Electric machinery / Cooling | |
| 650 | 4 | |a Microelectronics | |
| 650 | 4 | |a Nanoelectronics | |
| 650 | 0 | 7 | |a Kühlung |0 (DE-588)4132435-3 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Mikroelektronik |0 (DE-588)4039207-7 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Kühlung |0 (DE-588)4132435-3 |D s |
| 689 | 0 | 1 | |a Mikroelektronik |0 (DE-588)4039207-7 |D s |
| 689 | 0 | |8 1\p |5 DE-604 | |
| 700 | 1 | |a Iyengar, Madhusudan |e Sonstige |4 oth | |
| 700 | 1 | |a Geisler, Karl J. L. |e Sonstige |4 oth | |
| 700 | 1 | |a Sammakia, Bahgat |d 1952- |e Sonstige |4 oth | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9789814579780 |
| 856 | 4 | 0 | |u http://www.worldscientific.com/worldscibooks/10.1142/9067#t=toc |x Verlag |z URL des Erstveroeffentlichers |3 Volltext |
| 912 | |a ZDB-124-WOP | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030038288 | ||
| 883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
| 966 | e | |u http://www.worldscientific.com/worldscibooks/10.1142/9067#t=toc |l FHN01 |p ZDB-124-WOP |q FHN_PDA_WOP |x Verlag |3 Volltext | |
Datensatz im Suchindex
| _version_ | 1804178059922767872 |
|---|---|
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV044640315 |
| collection | ZDB-124-WOP |
| ctrlnum | (ZDB-124-WOP)00006138 (OCoLC)988732343 (DE-599)BVBBV044640315 |
| dewey-full | 621.38 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.38 |
| dewey-search | 621.38 |
| dewey-sort | 3621.38 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02730nmm a2200493zcb4500</leader><controlfield tag="001">BV044640315</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">171120s2015 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9789814579797</subfield><subfield code="9">978-981-4579-79-7</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1142/9067</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-124-WOP)00006138</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)988732343</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV044640315</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-92</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.38</subfield><subfield code="2">22</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Cooling of microelectronic and nanoelectronic equipment</subfield><subfield code="b">advances and emerging research</subfield><subfield code="c">editors, Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Singapore</subfield><subfield code="b">World Scientific Pub. Co.</subfield><subfield code="c">c2015</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">x, 460 p.</subfield><subfield code="b">ill. (some col.)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">WSPC series in advanced integration and packaging</subfield><subfield code="v">vol. 3</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electric machinery / Cooling</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nanoelectronics</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Kühlung</subfield><subfield code="0">(DE-588)4132435-3</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Kühlung</subfield><subfield code="0">(DE-588)4132435-3</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Iyengar, Madhusudan</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Geisler, Karl J. L.</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Sammakia, Bahgat</subfield><subfield code="d">1952-</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">9789814579780</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">http://www.worldscientific.com/worldscibooks/10.1142/9067#t=toc</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveroeffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-124-WOP</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030038288</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">http://www.worldscientific.com/worldscibooks/10.1142/9067#t=toc</subfield><subfield code="l">FHN01</subfield><subfield code="p">ZDB-124-WOP</subfield><subfield code="q">FHN_PDA_WOP</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV044640315 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T07:57:57Z |
| institution | BVB |
| isbn | 9789814579797 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030038288 |
| oclc_num | 988732343 |
| open_access_boolean | |
| owner | DE-92 |
| owner_facet | DE-92 |
| physical | x, 460 p. ill. (some col.) |
| psigel | ZDB-124-WOP ZDB-124-WOP FHN_PDA_WOP |
| publishDate | 2015 |
| publishDateSearch | 2015 |
| publishDateSort | 2015 |
| publisher | World Scientific Pub. Co. |
| record_format | marc |
| series2 | WSPC series in advanced integration and packaging |
| spelling | Cooling of microelectronic and nanoelectronic equipment advances and emerging research editors, Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia Singapore World Scientific Pub. Co. c2015 x, 460 p. ill. (some col.) txt rdacontent c rdamedia cr rdacarrier WSPC series in advanced integration and packaging vol. 3 To celebrate Professor Avi Bar-Cohen's 65th birthday, this unique volume is a collection of recent advances and emerging research from various luminaries and experts in the field. Cutting-edge technologies and research related to thermal management and thermal packaging of micro- and nanoelectronics are covered, including enhanced heat transfer, heat sinks, liquid cooling, phase change materials, synthetic jets, computational heat transfer, electronics reliability, 3D packaging, thermoelectrics, data centers, and solid state lighting. This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging Electric machinery / Cooling Microelectronics Nanoelectronics Kühlung (DE-588)4132435-3 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Kühlung (DE-588)4132435-3 s Mikroelektronik (DE-588)4039207-7 s 1\p DE-604 Iyengar, Madhusudan Sonstige oth Geisler, Karl J. L. Sonstige oth Sammakia, Bahgat 1952- Sonstige oth Erscheint auch als Druck-Ausgabe 9789814579780 http://www.worldscientific.com/worldscibooks/10.1142/9067#t=toc Verlag URL des Erstveroeffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Cooling of microelectronic and nanoelectronic equipment advances and emerging research Electric machinery / Cooling Microelectronics Nanoelectronics Kühlung (DE-588)4132435-3 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| subject_GND | (DE-588)4132435-3 (DE-588)4039207-7 |
| title | Cooling of microelectronic and nanoelectronic equipment advances and emerging research |
| title_auth | Cooling of microelectronic and nanoelectronic equipment advances and emerging research |
| title_exact_search | Cooling of microelectronic and nanoelectronic equipment advances and emerging research |
| title_full | Cooling of microelectronic and nanoelectronic equipment advances and emerging research editors, Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia |
| title_fullStr | Cooling of microelectronic and nanoelectronic equipment advances and emerging research editors, Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia |
| title_full_unstemmed | Cooling of microelectronic and nanoelectronic equipment advances and emerging research editors, Madhusudan Iyengar, Karl J.L. Geisler, Bahgat Sammakia |
| title_short | Cooling of microelectronic and nanoelectronic equipment |
| title_sort | cooling of microelectronic and nanoelectronic equipment advances and emerging research |
| title_sub | advances and emerging research |
| topic | Electric machinery / Cooling Microelectronics Nanoelectronics Kühlung (DE-588)4132435-3 gnd Mikroelektronik (DE-588)4039207-7 gnd |
| topic_facet | Electric machinery / Cooling Microelectronics Nanoelectronics Kühlung Mikroelektronik |
| url | http://www.worldscientific.com/worldscibooks/10.1142/9067#t=toc |
| work_keys_str_mv | AT iyengarmadhusudan coolingofmicroelectronicandnanoelectronicequipmentadvancesandemergingresearch AT geislerkarljl coolingofmicroelectronicandnanoelectronicequipmentadvancesandemergingresearch AT sammakiabahgat coolingofmicroelectronicandnanoelectronicequipmentadvancesandemergingresearch |