Design and modeling for 3D ICs and interposers:
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the silicon via (TSV) and glass via (TGV) technology,...
Gespeichert in:
| 1. Verfasser: | |
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| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Singapore
World Scientific Pub. Co.
c2014
|
| Schriftenreihe: | WSPC series in advanced integration and packaging
v. 2 |
| Schlagworte: | |
| Online-Zugang: | FHN01 Volltext |
| Zusammenfassung: | 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the silicon via (TSV) and glass via (TGV) technology, the book introduces 3D ICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution |
| Beschreibung: | xxi, 354 p. ill. (some col.) |
| ISBN: | 9789814508605 |
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Datensatz im Suchindex
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| author | Swaminathan, Madhavan |
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| dewey-full | 621.3815 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815 |
| dewey-search | 621.3815 |
| dewey-sort | 3621.3815 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV044639444 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T07:57:55Z |
| institution | BVB |
| isbn | 9789814508605 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030037417 |
| oclc_num | 1012683726 |
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| owner | DE-92 |
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| physical | xxi, 354 p. ill. (some col.) |
| psigel | ZDB-124-WOP ZDB-124-WOP FHN_PDA_WOP |
| publishDate | 2014 |
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| publisher | World Scientific Pub. Co. |
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| series2 | WSPC series in advanced integration and packaging |
| spelling | Swaminathan, Madhavan Verfasser aut Design and modeling for 3D ICs and interposers Madhavan Swaminathan and Ki Jin Han Singapore World Scientific Pub. Co. c2014 xxi, 354 p. ill. (some col.) txt rdacontent c rdamedia cr rdacarrier WSPC series in advanced integration and packaging v. 2 3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the silicon via (TSV) and glass via (TGV) technology, the book introduces 3D ICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution Three-dimensional integrated circuits Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf Dreidimensionale Integration (DE-588)4218841-6 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 s Dreidimensionale Integration (DE-588)4218841-6 s 1\p DE-604 Han, Ki Jin Sonstige oth Erscheint auch als Druck-Ausgabe 9789814508599 http://www.worldscientific.com/worldscibooks/10.1142/8814#t=toc Verlag URL des Erstveroeffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Swaminathan, Madhavan Design and modeling for 3D ICs and interposers Three-dimensional integrated circuits Integrierte Schaltung (DE-588)4027242-4 gnd Dreidimensionale Integration (DE-588)4218841-6 gnd |
| subject_GND | (DE-588)4027242-4 (DE-588)4218841-6 |
| title | Design and modeling for 3D ICs and interposers |
| title_auth | Design and modeling for 3D ICs and interposers |
| title_exact_search | Design and modeling for 3D ICs and interposers |
| title_full | Design and modeling for 3D ICs and interposers Madhavan Swaminathan and Ki Jin Han |
| title_fullStr | Design and modeling for 3D ICs and interposers Madhavan Swaminathan and Ki Jin Han |
| title_full_unstemmed | Design and modeling for 3D ICs and interposers Madhavan Swaminathan and Ki Jin Han |
| title_short | Design and modeling for 3D ICs and interposers |
| title_sort | design and modeling for 3d ics and interposers |
| topic | Three-dimensional integrated circuits Integrierte Schaltung (DE-588)4027242-4 gnd Dreidimensionale Integration (DE-588)4218841-6 gnd |
| topic_facet | Three-dimensional integrated circuits Integrierte Schaltung Dreidimensionale Integration |
| url | http://www.worldscientific.com/worldscibooks/10.1142/8814#t=toc |
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