The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve "correct by design" thermal packaging solutions. The four sets in the Encyclopedia...

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Bibliographic Details

Format:	Electronic eBook
Language:	English
Published:	Singapore World Scientific Pub. Co. c2015
Subjects:	Electronic packaging Insulation (Heat)
Online Access:	FHN01 Volltext
Summary:	The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve "correct by design" thermal packaging solutions. The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging "learning curve", the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, product managers, as well as to researchers in thermal management of electronic and photonic components and systems. It is most beneficial to undergraduate and graduate students studying mechanical, electrical and electronic engineering
Physical Description:	[1295] p. ill. (some col.), ports. (some col.)
ISBN:	9789814327664