Encyclopedia of thermal packaging: thermal packaging tools
The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve "correct by design" thermal packaging solutions. The four sets in the Encyclopedia...
Gespeichert in:
Format: | Elektronisch E-Book |
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Sprache: | English |
Veröffentlicht: |
Singapore
World Scientific Pub. Co.
c2015
|
Schlagworte: | |
Online-Zugang: | FHN01 Volltext |
Zusammenfassung: | The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve "correct by design" thermal packaging solutions. The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging "learning curve", the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, product managers, as well as to researchers in thermal management of electronic and photonic components and systems. It is most beneficial to undergraduate and graduate students studying mechanical, electrical and electronic engineering |
Beschreibung: | [1295] p. ill. (some col.), ports. (some col.) |
ISBN: | 9789814327664 |
Internformat
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520 | |a The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve "correct by design" thermal packaging solutions. The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging "learning curve", the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, product managers, as well as to researchers in thermal management of electronic and photonic components and systems. It is most beneficial to undergraduate and graduate students studying mechanical, electrical and electronic engineering | ||
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discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
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illustrated | Illustrated |
indexdate | 2024-07-10T07:57:53Z |
institution | BVB |
isbn | 9789814327664 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030036252 |
oclc_num | 1012732671 |
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owner | DE-92 |
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physical | [1295] p. ill. (some col.), ports. (some col.) |
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publishDate | 2015 |
publishDateSearch | 2015 |
publishDateSort | 2015 |
publisher | World Scientific Pub. Co. |
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spelling | Encyclopedia of thermal packaging thermal packaging tools editor-in-chief, Avram Bar-Cohen Singapore World Scientific Pub. Co. c2015 [1295] p. ill. (some col.), ports. (some col.) txt rdacontent c rdamedia cr rdacarrier The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve "correct by design" thermal packaging solutions. The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging "learning curve", the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, product managers, as well as to researchers in thermal management of electronic and photonic components and systems. It is most beneficial to undergraduate and graduate students studying mechanical, electrical and electronic engineering Electronic packaging Insulation (Heat) Bar-Cohen, Avram 1946- Sonstige oth Erscheint auch als Druck-Ausgabe 9789814313841 Erscheint auch als Druck-Ausgabe 9789814327602 Erscheint auch als Druck-Ausgabe 9789814327633 Erscheint auch als Druck-Ausgabe 9789814327657 Erscheint auch als Druck-Ausgabe 9789814583435 http://www.worldscientific.com/worldscibooks/10.1142/7969#t=toc Verlag URL des Erstveroeffentlichers Volltext |
spellingShingle | Encyclopedia of thermal packaging thermal packaging tools Electronic packaging Insulation (Heat) |
title | Encyclopedia of thermal packaging thermal packaging tools |
title_auth | Encyclopedia of thermal packaging thermal packaging tools |
title_exact_search | Encyclopedia of thermal packaging thermal packaging tools |
title_full | Encyclopedia of thermal packaging thermal packaging tools editor-in-chief, Avram Bar-Cohen |
title_fullStr | Encyclopedia of thermal packaging thermal packaging tools editor-in-chief, Avram Bar-Cohen |
title_full_unstemmed | Encyclopedia of thermal packaging thermal packaging tools editor-in-chief, Avram Bar-Cohen |
title_short | Encyclopedia of thermal packaging |
title_sort | encyclopedia of thermal packaging thermal packaging tools |
title_sub | thermal packaging tools |
topic | Electronic packaging Insulation (Heat) |
topic_facet | Electronic packaging Insulation (Heat) |
url | http://www.worldscientific.com/worldscibooks/10.1142/7969#t=toc |
work_keys_str_mv | AT barcohenavram encyclopediaofthermalpackagingthermalpackagingtools |