High performance design automation for multi-chip modules and packages:
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs)...
Saved in:
| Format: | Electronic eBook |
|---|---|
| Language: | English |
| Published: |
Singapore
World Scientific Pub. Co.
c1996
|
| Series: | Selected topics in electronics and systems
vol. 5 |
| Subjects: | |
| Online Access: | FHN01 Volltext |
| Summary: | Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages |
| Physical Description: | x, 254 p. ill |
| ISBN: | 9789812830852 |
Staff View
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| 520 | |a Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages | ||
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| id | DE-604.BV044636836 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T07:57:50Z |
| institution | BVB |
| isbn | 9789812830852 |
| language | English |
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| physical | x, 254 p. ill |
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| publishDate | 1996 |
| publishDateSearch | 1996 |
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| publisher | World Scientific Pub. Co. |
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| series2 | Selected topics in electronics and systems |
| spelling | High performance design automation for multi-chip modules and packages editor, Jun-Dong Cho ; co-editor, Paul D. Franzon Singapore World Scientific Pub. Co. c1996 x, 254 p. ill txt rdacontent c rdamedia cr rdacarrier Selected topics in electronics and systems vol. 5 Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages Electronic packaging / Design / Data processing Multichip modules (Microelectronics) / Design / Data processing Computer-aided design Cho, Jun-Dong Sonstige oth Franzon, Paul D. Sonstige oth Erscheint auch als Druck-Ausgabe 9789810223076 Erscheint auch als Druck-Ausgabe 9810223072 http://www.worldscientific.com/worldscibooks/10.1142/2793#t=toc Verlag URL des Erstveroeffentlichers Volltext |
| spellingShingle | High performance design automation for multi-chip modules and packages Electronic packaging / Design / Data processing Multichip modules (Microelectronics) / Design / Data processing Computer-aided design |
| title | High performance design automation for multi-chip modules and packages |
| title_auth | High performance design automation for multi-chip modules and packages |
| title_exact_search | High performance design automation for multi-chip modules and packages |
| title_full | High performance design automation for multi-chip modules and packages editor, Jun-Dong Cho ; co-editor, Paul D. Franzon |
| title_fullStr | High performance design automation for multi-chip modules and packages editor, Jun-Dong Cho ; co-editor, Paul D. Franzon |
| title_full_unstemmed | High performance design automation for multi-chip modules and packages editor, Jun-Dong Cho ; co-editor, Paul D. Franzon |
| title_short | High performance design automation for multi-chip modules and packages |
| title_sort | high performance design automation for multi chip modules and packages |
| topic | Electronic packaging / Design / Data processing Multichip modules (Microelectronics) / Design / Data processing Computer-aided design |
| topic_facet | Electronic packaging / Design / Data processing Multichip modules (Microelectronics) / Design / Data processing Computer-aided design |
| url | http://www.worldscientific.com/worldscibooks/10.1142/2793#t=toc |
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