High performance design automation for multi-chip modules and packages:
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs)...
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Singapore
World Scientific Pub. Co.
c1996
|
| Schriftenreihe: | Selected topics in electronics and systems
vol. 5 |
| Schlagworte: | |
| Online-Zugang: | FHN01 Volltext |
| Zusammenfassung: | Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages |
| Beschreibung: | x, 254 p. ill |
| ISBN: | 9789812830852 |
Internformat
MARC
| LEADER | 00000nmm a2200000zcb4500 | ||
|---|---|---|---|
| 001 | BV044636836 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 171120s1996 |||| o||u| ||||||eng d | ||
| 020 | |a 9789812830852 |9 978-981-283-085-2 | ||
| 024 | 7 | |a 10.1142/2793 |2 doi | |
| 035 | |a (ZDB-124-WOP)00004792 | ||
| 035 | |a (OCoLC)1012729588 | ||
| 035 | |a (DE-599)BVBBV044636836 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-92 | ||
| 082 | 0 | |a 621.381/046 |2 22 | |
| 245 | 1 | 0 | |a High performance design automation for multi-chip modules and packages |c editor, Jun-Dong Cho ; co-editor, Paul D. Franzon |
| 264 | 1 | |a Singapore |b World Scientific Pub. Co. |c c1996 | |
| 300 | |a x, 254 p. |b ill | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a Selected topics in electronics and systems |v vol. 5 | |
| 520 | |a Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages | ||
| 650 | 4 | |a Electronic packaging / Design / Data processing | |
| 650 | 4 | |a Multichip modules (Microelectronics) / Design / Data processing | |
| 650 | 4 | |a Computer-aided design | |
| 700 | 1 | |a Cho, Jun-Dong |e Sonstige |4 oth | |
| 700 | 1 | |a Franzon, Paul D. |e Sonstige |4 oth | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9789810223076 |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9810223072 |
| 856 | 4 | 0 | |u http://www.worldscientific.com/worldscibooks/10.1142/2793#t=toc |x Verlag |z URL des Erstveroeffentlichers |3 Volltext |
| 912 | |a ZDB-124-WOP | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-030034809 | ||
| 966 | e | |u http://www.worldscientific.com/worldscibooks/10.1142/2793#t=toc |l FHN01 |p ZDB-124-WOP |q FHN_PDA_WOP |x Verlag |3 Volltext | |
Datensatz im Suchindex
| _version_ | 1804178051614900224 |
|---|---|
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV044636836 |
| collection | ZDB-124-WOP |
| ctrlnum | (ZDB-124-WOP)00004792 (OCoLC)1012729588 (DE-599)BVBBV044636836 |
| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02652nmm a2200421zcb4500</leader><controlfield tag="001">BV044636836</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">171120s1996 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9789812830852</subfield><subfield code="9">978-981-283-085-2</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1142/2793</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-124-WOP)00004792</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)1012729588</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV044636836</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-92</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381/046</subfield><subfield code="2">22</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">High performance design automation for multi-chip modules and packages</subfield><subfield code="c">editor, Jun-Dong Cho ; co-editor, Paul D. Franzon</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Singapore</subfield><subfield code="b">World Scientific Pub. Co.</subfield><subfield code="c">c1996</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">x, 254 p.</subfield><subfield code="b">ill</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Selected topics in electronics and systems</subfield><subfield code="v">vol. 5</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic packaging / Design / Data processing</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Multichip modules (Microelectronics) / Design / Data processing</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Computer-aided design</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Cho, Jun-Dong</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Franzon, Paul D.</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">9789810223076</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">9810223072</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">http://www.worldscientific.com/worldscibooks/10.1142/2793#t=toc</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveroeffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-124-WOP</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-030034809</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">http://www.worldscientific.com/worldscibooks/10.1142/2793#t=toc</subfield><subfield code="l">FHN01</subfield><subfield code="p">ZDB-124-WOP</subfield><subfield code="q">FHN_PDA_WOP</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV044636836 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T07:57:50Z |
| institution | BVB |
| isbn | 9789812830852 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-030034809 |
| oclc_num | 1012729588 |
| open_access_boolean | |
| owner | DE-92 |
| owner_facet | DE-92 |
| physical | x, 254 p. ill |
| psigel | ZDB-124-WOP ZDB-124-WOP FHN_PDA_WOP |
| publishDate | 1996 |
| publishDateSearch | 1996 |
| publishDateSort | 1996 |
| publisher | World Scientific Pub. Co. |
| record_format | marc |
| series2 | Selected topics in electronics and systems |
| spelling | High performance design automation for multi-chip modules and packages editor, Jun-Dong Cho ; co-editor, Paul D. Franzon Singapore World Scientific Pub. Co. c1996 x, 254 p. ill txt rdacontent c rdamedia cr rdacarrier Selected topics in electronics and systems vol. 5 Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages Electronic packaging / Design / Data processing Multichip modules (Microelectronics) / Design / Data processing Computer-aided design Cho, Jun-Dong Sonstige oth Franzon, Paul D. Sonstige oth Erscheint auch als Druck-Ausgabe 9789810223076 Erscheint auch als Druck-Ausgabe 9810223072 http://www.worldscientific.com/worldscibooks/10.1142/2793#t=toc Verlag URL des Erstveroeffentlichers Volltext |
| spellingShingle | High performance design automation for multi-chip modules and packages Electronic packaging / Design / Data processing Multichip modules (Microelectronics) / Design / Data processing Computer-aided design |
| title | High performance design automation for multi-chip modules and packages |
| title_auth | High performance design automation for multi-chip modules and packages |
| title_exact_search | High performance design automation for multi-chip modules and packages |
| title_full | High performance design automation for multi-chip modules and packages editor, Jun-Dong Cho ; co-editor, Paul D. Franzon |
| title_fullStr | High performance design automation for multi-chip modules and packages editor, Jun-Dong Cho ; co-editor, Paul D. Franzon |
| title_full_unstemmed | High performance design automation for multi-chip modules and packages editor, Jun-Dong Cho ; co-editor, Paul D. Franzon |
| title_short | High performance design automation for multi-chip modules and packages |
| title_sort | high performance design automation for multi chip modules and packages |
| topic | Electronic packaging / Design / Data processing Multichip modules (Microelectronics) / Design / Data processing Computer-aided design |
| topic_facet | Electronic packaging / Design / Data processing Multichip modules (Microelectronics) / Design / Data processing Computer-aided design |
| url | http://www.worldscientific.com/worldscibooks/10.1142/2793#t=toc |
| work_keys_str_mv | AT chojundong highperformancedesignautomationformultichipmodulesandpackages AT franzonpauld highperformancedesignautomationformultichipmodulesandpackages |