Physical design for 3D integrated circuits:
Gespeichert in:
| Format: | Buch |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Boca Raton, Fla.
Taylor & Francis Group, CRC Press
[2016]
|
| Schriftenreihe: | Devices, circuits, and systems
|
| Schlagworte: | |
| Beschreibung: | XVIII, 397 Seiten Illustrationen, Diagramme |
| ISBN: | 9781498710367 |
Internformat
MARC
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| 264 | 1 | |a Boca Raton, Fla. |b Taylor & Francis Group, CRC Press |c [2016] | |
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| 700 | 1 | |a Tan, Chuan Seng |e Sonstige |0 (DE-588)1082509418 |4 oth | |
| 700 | 1 | |a Iniewski, Krzysztof |d 1960- |e Sonstige |0 (DE-588)13647425X |4 oth | |
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Datensatz im Suchindex
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| id | DE-604.BV044537703 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T07:55:19Z |
| institution | BVB |
| isbn | 9781498710367 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029936838 |
| oclc_num | 1011408542 |
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| owner_facet | DE-29T |
| physical | XVIII, 397 Seiten Illustrationen, Diagramme |
| publishDate | 2016 |
| publishDateSearch | 2016 |
| publishDateSort | 2016 |
| publisher | Taylor & Francis Group, CRC Press |
| record_format | marc |
| series2 | Devices, circuits, and systems |
| spelling | Physical design for 3D integrated circuits edited by Aida Todri-Sanial, CNRS-LIRMM, France, Chuan Seng Tan, Nanyang Technological University, Singapore, Krzysztof Iniewski, managing editor, Emerging Technologies CMOS Inc., Vancouver, British Columbia, Canada Boca Raton, Fla. Taylor & Francis Group, CRC Press [2016] XVIII, 397 Seiten Illustrationen, Diagramme txt rdacontent n rdamedia nc rdacarrier Devices, circuits, and systems Three-dimensional integrated circuits / Design and construction Todri-Sanial, Aida Sonstige (DE-588)1082509280 oth Tan, Chuan Seng Sonstige (DE-588)1082509418 oth Iniewski, Krzysztof 1960- Sonstige (DE-588)13647425X oth |
| spellingShingle | Physical design for 3D integrated circuits Three-dimensional integrated circuits / Design and construction |
| title | Physical design for 3D integrated circuits |
| title_auth | Physical design for 3D integrated circuits |
| title_exact_search | Physical design for 3D integrated circuits |
| title_full | Physical design for 3D integrated circuits edited by Aida Todri-Sanial, CNRS-LIRMM, France, Chuan Seng Tan, Nanyang Technological University, Singapore, Krzysztof Iniewski, managing editor, Emerging Technologies CMOS Inc., Vancouver, British Columbia, Canada |
| title_fullStr | Physical design for 3D integrated circuits edited by Aida Todri-Sanial, CNRS-LIRMM, France, Chuan Seng Tan, Nanyang Technological University, Singapore, Krzysztof Iniewski, managing editor, Emerging Technologies CMOS Inc., Vancouver, British Columbia, Canada |
| title_full_unstemmed | Physical design for 3D integrated circuits edited by Aida Todri-Sanial, CNRS-LIRMM, France, Chuan Seng Tan, Nanyang Technological University, Singapore, Krzysztof Iniewski, managing editor, Emerging Technologies CMOS Inc., Vancouver, British Columbia, Canada |
| title_short | Physical design for 3D integrated circuits |
| title_sort | physical design for 3d integrated circuits |
| topic | Three-dimensional integrated circuits / Design and construction |
| topic_facet | Three-dimensional integrated circuits / Design and construction |
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