SiP system-in-package design and simulation: mentor EE flow advanced design guide
Gespeichert in:
1. Verfasser: | |
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Format: | Buch |
Sprache: | English |
Veröffentlicht: |
Singapore
Wiley
2017
|
Schlagworte: | |
Online-Zugang: | Inhaltsverzeichnis |
Beschreibung: | Includes bibliographical references and index |
Beschreibung: | xvii, 477 Seiten Illustrationen |
ISBN: | 9781119045939 |
Internformat
MARC
LEADER | 00000nam a2200000 c 4500 | ||
---|---|---|---|
001 | BV044528637 | ||
003 | DE-604 | ||
005 | 20181114 | ||
007 | t | ||
008 | 171010s2017 si a||| |||| 00||| eng d | ||
010 | |a 017007232 | ||
020 | |a 9781119045939 |9 978-1-119-04593-9 | ||
035 | |a (OCoLC)1031431284 | ||
035 | |a (DE-599)BVBBV044528637 | ||
040 | |a DE-604 |b ger |e rda | ||
041 | 0 | |a eng | |
044 | |a si |c SG | ||
049 | |a DE-703 |a DE-83 | ||
050 | 0 | |a TK7874 | |
082 | 0 | |a 621.3815 |2 23 | |
084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
100 | 1 | |a Li, Suny |d 1974- |e Verfasser |0 (DE-588)1142391205 |4 aut | |
245 | 1 | 0 | |a SiP system-in-package design and simulation |b mentor EE flow advanced design guide |c Suny Li (Li Yang), SiP/PCB technical specialist, Beijing, China |
264 | 1 | |a Singapore |b Wiley |c 2017 | |
300 | |a xvii, 477 Seiten |b Illustrationen | ||
336 | |b txt |2 rdacontent | ||
337 | |b n |2 rdamedia | ||
338 | |b nc |2 rdacarrier | ||
500 | |a Includes bibliographical references and index | ||
650 | 4 | |a Integrated circuits |x Design and construction | |
650 | 4 | |a Multichip modules (Microelectronics) |x Design and construction | |
650 | 0 | 7 | |a Elektronische Baugruppe |0 (DE-588)4014350-8 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a System-in-Package |0 (DE-588)7520794-1 |2 gnd |9 rswk-swf |
689 | 0 | 0 | |a Elektronische Baugruppe |0 (DE-588)4014350-8 |D s |
689 | 0 | 1 | |a System-in-Package |0 (DE-588)7520794-1 |D s |
689 | 0 | |5 DE-604 | |
776 | 0 | 8 | |i Erscheint auch als |n Online-Ausgabe, PDF |z 978-1-119-04601-1 |
776 | 0 | 8 | |i Erscheint auch als |n Online-Ausgabe, EPUB |z 978-1-119-04600-4 |
856 | 4 | 2 | |m LoC Fremddatenuebernahme |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=029927963&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Inhaltsverzeichnis |
999 | |a oai:aleph.bib-bvb.de:BVB01-029927963 |
Datensatz im Suchindex
_version_ | 1804177877679210496 |
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adam_text | SIP-SYSTEM IN PACKAGE DESIGN AND SIMULATION
/ LI, SUNYYYD1974-YYEAUTHOR
: 2017
TABLE OF CONTENTS / INHALTSVERZEICHNIS
SIP DESIGN AND SIMULATION PLATFORM
BASIC KNOWLEDGE OF PACKAGE
SIP PRODUCTION PROCESS
NEW PACKAGE TECHNOLOGIES
SIP DESIGN AND SIMULATION FLOW
CENTRAL LIBRARY
SCHEMATIC INPUT
MULTI-BOARD PROJECT MANAGEMENT AND SCHEMATIC CONCURRENT DESIGN
LAYOUT CREATION AND SETTING
CONSTRAINT RULES MANAGEMENT
WIRE BOND DESIGN
CAVITY AND CHIP STACK DESIGN
FLIPCHIP AND RDL DESIGN
ROUTE AND PLANE
EMBEDDED PASSIVES DESIGN
RF CIRCUIT DESIGN
LAYOUT CONCURRENT DESIGN
3D REAL-TIME DRC
DESIGN REVIEW
MANUFACTURE DATA OUTPUT
SIP SIMULATION TECHNOLOGY
DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
|
any_adam_object | 1 |
author | Li, Suny 1974- |
author_GND | (DE-588)1142391205 |
author_facet | Li, Suny 1974- |
author_role | aut |
author_sort | Li, Suny 1974- |
author_variant | s l sl |
building | Verbundindex |
bvnumber | BV044528637 |
callnumber-first | T - Technology |
callnumber-label | TK7874 |
callnumber-raw | TK7874 |
callnumber-search | TK7874 |
callnumber-sort | TK 47874 |
callnumber-subject | TK - Electrical and Nuclear Engineering |
classification_rvk | ZN 4192 |
ctrlnum | (OCoLC)1031431284 (DE-599)BVBBV044528637 |
dewey-full | 621.3815 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.3815 |
dewey-search | 621.3815 |
dewey-sort | 3621.3815 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Book |
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id | DE-604.BV044528637 |
illustrated | Illustrated |
indexdate | 2024-07-10T07:55:04Z |
institution | BVB |
isbn | 9781119045939 |
language | English |
lccn | 017007232 |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029927963 |
oclc_num | 1031431284 |
open_access_boolean | |
owner | DE-703 DE-83 |
owner_facet | DE-703 DE-83 |
physical | xvii, 477 Seiten Illustrationen |
publishDate | 2017 |
publishDateSearch | 2017 |
publishDateSort | 2017 |
publisher | Wiley |
record_format | marc |
spelling | Li, Suny 1974- Verfasser (DE-588)1142391205 aut SiP system-in-package design and simulation mentor EE flow advanced design guide Suny Li (Li Yang), SiP/PCB technical specialist, Beijing, China Singapore Wiley 2017 xvii, 477 Seiten Illustrationen txt rdacontent n rdamedia nc rdacarrier Includes bibliographical references and index Integrated circuits Design and construction Multichip modules (Microelectronics) Design and construction Elektronische Baugruppe (DE-588)4014350-8 gnd rswk-swf System-in-Package (DE-588)7520794-1 gnd rswk-swf Elektronische Baugruppe (DE-588)4014350-8 s System-in-Package (DE-588)7520794-1 s DE-604 Erscheint auch als Online-Ausgabe, PDF 978-1-119-04601-1 Erscheint auch als Online-Ausgabe, EPUB 978-1-119-04600-4 LoC Fremddatenuebernahme application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=029927963&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
spellingShingle | Li, Suny 1974- SiP system-in-package design and simulation mentor EE flow advanced design guide Integrated circuits Design and construction Multichip modules (Microelectronics) Design and construction Elektronische Baugruppe (DE-588)4014350-8 gnd System-in-Package (DE-588)7520794-1 gnd |
subject_GND | (DE-588)4014350-8 (DE-588)7520794-1 |
title | SiP system-in-package design and simulation mentor EE flow advanced design guide |
title_auth | SiP system-in-package design and simulation mentor EE flow advanced design guide |
title_exact_search | SiP system-in-package design and simulation mentor EE flow advanced design guide |
title_full | SiP system-in-package design and simulation mentor EE flow advanced design guide Suny Li (Li Yang), SiP/PCB technical specialist, Beijing, China |
title_fullStr | SiP system-in-package design and simulation mentor EE flow advanced design guide Suny Li (Li Yang), SiP/PCB technical specialist, Beijing, China |
title_full_unstemmed | SiP system-in-package design and simulation mentor EE flow advanced design guide Suny Li (Li Yang), SiP/PCB technical specialist, Beijing, China |
title_short | SiP system-in-package design and simulation |
title_sort | sip system in package design and simulation mentor ee flow advanced design guide |
title_sub | mentor EE flow advanced design guide |
topic | Integrated circuits Design and construction Multichip modules (Microelectronics) Design and construction Elektronische Baugruppe (DE-588)4014350-8 gnd System-in-Package (DE-588)7520794-1 gnd |
topic_facet | Integrated circuits Design and construction Multichip modules (Microelectronics) Design and construction Elektronische Baugruppe System-in-Package |
url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=029927963&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
work_keys_str_mv | AT lisuny sipsysteminpackagedesignandsimulationmentoreeflowadvanceddesignguide |