Materials for advanced packaging:
Gespeichert in:
Weitere Verfasser: | , |
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Format: | Buch |
Sprache: | English |
Veröffentlicht: |
Cham
Springer
[2017]
|
Ausgabe: | Second edition |
Schlagworte: | |
Beschreibung: | xvi, 969 Seiten Illustrationen, Diagramme |
ISBN: | 9783319450971 |
Internformat
MARC
LEADER | 00000nam a2200000zc 4500 | ||
---|---|---|---|
001 | BV044419560 | ||
003 | DE-604 | ||
005 | 20190716 | ||
007 | t | ||
008 | 170720s2017 a||| |||| 00||| eng d | ||
020 | |a 9783319450971 |c Print |9 978-3-319-45097-1 | ||
035 | |a (OCoLC)1002276004 | ||
035 | |a (DE-599)BVBBV044419560 | ||
040 | |a DE-604 |b ger |e rda | ||
041 | 0 | |a eng | |
049 | |a DE-29T |a DE-703 |a DE-M347 |a DE-83 | ||
082 | 0 | |a 621.381 |2 23 | |
084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
245 | 1 | 0 | |a Materials for advanced packaging |c Daniel Lu, C. P. Wong, editors |
250 | |a Second edition | ||
264 | 1 | |a Cham |b Springer |c [2017] | |
264 | 4 | |c © 2017 | |
300 | |a xvi, 969 Seiten |b Illustrationen, Diagramme | ||
336 | |b txt |2 rdacontent | ||
337 | |b n |2 rdamedia | ||
338 | |b nc |2 rdacarrier | ||
650 | 4 | |a Engineering | |
650 | 4 | |a Nanotechnology | |
650 | 4 | |a Electronics | |
650 | 4 | |a Microelectronics | |
650 | 4 | |a Electronic circuits | |
650 | 4 | |a Optical materials | |
650 | 4 | |a Electronic materials | |
650 | 4 | |a Metals | |
650 | 4 | |a Electronics and Microelectronics, Instrumentation | |
650 | 4 | |a Nanotechnology and Microengineering | |
650 | 4 | |a Metallic Materials | |
650 | 4 | |a Optical and Electronic Materials | |
650 | 4 | |a Circuits and Systems | |
650 | 4 | |a Ingenieurwissenschaften | |
650 | 0 | 7 | |a Mikroelektronik |0 (DE-588)4039207-7 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Verbindungstechnik |0 (DE-588)4129183-9 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Werkstoff |0 (DE-588)4065579-9 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Gehäuse |0 (DE-588)4156307-4 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |2 gnd |9 rswk-swf |
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689 | 0 | 4 | |a Gehäuse |0 (DE-588)4156307-4 |D s |
689 | 0 | |5 DE-604 | |
700 | 1 | |a Lu, Daniel |4 edt | |
700 | 1 | |a Wong, C. P. |4 edt | |
776 | 0 | 8 | |i Erscheint auch als |n Online-Ausgabe, eBook |z 978-3-319-45098-8 |
999 | |a oai:aleph.bib-bvb.de:BVB01-029821192 |
Datensatz im Suchindex
_version_ | 1804177713967136768 |
---|---|
any_adam_object | |
author2 | Lu, Daniel Wong, C. P. |
author2_role | edt edt |
author2_variant | d l dl c p w cp cpw |
author_facet | Lu, Daniel Wong, C. P. |
building | Verbundindex |
bvnumber | BV044419560 |
classification_rvk | ZN 4192 |
ctrlnum | (OCoLC)1002276004 (DE-599)BVBBV044419560 |
dewey-full | 621.381 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.381 |
dewey-search | 621.381 |
dewey-sort | 3621.381 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
edition | Second edition |
format | Book |
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id | DE-604.BV044419560 |
illustrated | Illustrated |
indexdate | 2024-07-10T07:52:28Z |
institution | BVB |
isbn | 9783319450971 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029821192 |
oclc_num | 1002276004 |
open_access_boolean | |
owner | DE-29T DE-703 DE-M347 DE-83 |
owner_facet | DE-29T DE-703 DE-M347 DE-83 |
physical | xvi, 969 Seiten Illustrationen, Diagramme |
publishDate | 2017 |
publishDateSearch | 2017 |
publishDateSort | 2017 |
publisher | Springer |
record_format | marc |
spelling | Materials for advanced packaging Daniel Lu, C. P. Wong, editors Second edition Cham Springer [2017] © 2017 xvi, 969 Seiten Illustrationen, Diagramme txt rdacontent n rdamedia nc rdacarrier Engineering Nanotechnology Electronics Microelectronics Electronic circuits Optical materials Electronic materials Metals Electronics and Microelectronics, Instrumentation Nanotechnology and Microengineering Metallic Materials Optical and Electronic Materials Circuits and Systems Ingenieurwissenschaften Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Verbindungstechnik (DE-588)4129183-9 gnd rswk-swf Werkstoff (DE-588)4065579-9 gnd rswk-swf Gehäuse (DE-588)4156307-4 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 s Werkstoff (DE-588)4065579-9 s Integrierte Schaltung (DE-588)4027242-4 s Verbindungstechnik (DE-588)4129183-9 s Gehäuse (DE-588)4156307-4 s DE-604 Lu, Daniel edt Wong, C. P. edt Erscheint auch als Online-Ausgabe, eBook 978-3-319-45098-8 |
spellingShingle | Materials for advanced packaging Engineering Nanotechnology Electronics Microelectronics Electronic circuits Optical materials Electronic materials Metals Electronics and Microelectronics, Instrumentation Nanotechnology and Microengineering Metallic Materials Optical and Electronic Materials Circuits and Systems Ingenieurwissenschaften Mikroelektronik (DE-588)4039207-7 gnd Verbindungstechnik (DE-588)4129183-9 gnd Werkstoff (DE-588)4065579-9 gnd Gehäuse (DE-588)4156307-4 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
subject_GND | (DE-588)4039207-7 (DE-588)4129183-9 (DE-588)4065579-9 (DE-588)4156307-4 (DE-588)4027242-4 |
title | Materials for advanced packaging |
title_auth | Materials for advanced packaging |
title_exact_search | Materials for advanced packaging |
title_full | Materials for advanced packaging Daniel Lu, C. P. Wong, editors |
title_fullStr | Materials for advanced packaging Daniel Lu, C. P. Wong, editors |
title_full_unstemmed | Materials for advanced packaging Daniel Lu, C. P. Wong, editors |
title_short | Materials for advanced packaging |
title_sort | materials for advanced packaging |
topic | Engineering Nanotechnology Electronics Microelectronics Electronic circuits Optical materials Electronic materials Metals Electronics and Microelectronics, Instrumentation Nanotechnology and Microengineering Metallic Materials Optical and Electronic Materials Circuits and Systems Ingenieurwissenschaften Mikroelektronik (DE-588)4039207-7 gnd Verbindungstechnik (DE-588)4129183-9 gnd Werkstoff (DE-588)4065579-9 gnd Gehäuse (DE-588)4156307-4 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
topic_facet | Engineering Nanotechnology Electronics Microelectronics Electronic circuits Optical materials Electronic materials Metals Electronics and Microelectronics, Instrumentation Nanotechnology and Microengineering Metallic Materials Optical and Electronic Materials Circuits and Systems Ingenieurwissenschaften Mikroelektronik Verbindungstechnik Werkstoff Gehäuse Integrierte Schaltung |
work_keys_str_mv | AT ludaniel materialsforadvancedpackaging AT wongcp materialsforadvancedpackaging |