Three-dimensional molded interconnect devices (3D-MID): materials, Manufacturing, assembly, and applications for injection molded circuit carriers
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Munich ; Cincinnati, OH
Hanser
[2014]
|
| Schlagworte: | |
| Online-Zugang: | FAW01 Volltext |
| Beschreibung: | Translated from the German Includes bibliographical references and index |
| Beschreibung: | 1 online resource (xii, 356 pages) color illustrations |
| ISBN: | 9781569905524 1569905525 9781680157277 1680157272 9781569905517 1569905517 |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
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| 003 | DE-604 | ||
| 005 | 20180131 | ||
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| 008 | 170630s2014 |||| o||u| ||||||eng d | ||
| 020 | |a 9781569905524 |9 978-1-56990-552-4 | ||
| 020 | |a 1569905525 |9 1-56990-552-5 | ||
| 020 | |a 9781680157277 |9 978-1-68015-727-7 | ||
| 020 | |a 1680157272 |9 1-68015-727-2 | ||
| 020 | |a 9781569905517 |9 978-1-56990-551-7 | ||
| 020 | |a 1569905517 |9 1-56990-551-7 | ||
| 035 | |a (ZDB-33-ESD)ocn891586550 | ||
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| 041 | 0 | |a eng | |
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| 082 | 0 | |a 621.3815 |2 23 | |
| 084 | |a ZN 4120 |0 (DE-625)157353: |2 rvk | ||
| 100 | 1 | |a Franke, Jörg |e Verfasser |4 aut | |
| 240 | 1 | 0 | |a Räumliche elektronische Baugruppen (3D-MID) |
| 245 | 1 | 0 | |a Three-dimensional molded interconnect devices (3D-MID) |b materials, Manufacturing, assembly, and applications for injection molded circuit carriers |c Jörg Franke |
| 264 | 1 | |a Munich ; Cincinnati, OH |b Hanser |c [2014] | |
| 264 | 4 | |c © 2014 | |
| 300 | |a 1 online resource (xii, 356 pages) |b color illustrations | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 500 | |a Translated from the German | ||
| 500 | |a Includes bibliographical references and index | ||
| 650 | 4 | |a Interconnects (Integrated circuit technology) |x Design and construction | |
| 650 | 4 | |a Injection molding of plastics | |
| 650 | 0 | 7 | |a Dreidimensionaler spritzgegossener Schaltungsträger |0 (DE-588)4550503-2 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Dreidimensionaler spritzgegossener Schaltungsträger |0 (DE-588)4550503-2 |D s |
| 689 | 0 | |8 1\p |5 DE-604 | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 9781569905517 |
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Datensatz im Suchindex
| _version_ | 1804177660870393856 |
|---|---|
| any_adam_object | |
| author | Franke, Jörg |
| author_facet | Franke, Jörg |
| author_role | aut |
| author_sort | Franke, Jörg |
| author_variant | j f jf |
| building | Verbundindex |
| bvnumber | BV044389527 |
| classification_rvk | ZN 4120 |
| collection | ZDB-33-ESD ZDB-33-EBS |
| ctrlnum | (ZDB-33-ESD)ocn891586550 (OCoLC)891586550 (DE-599)BVBBV044389527 |
| dewey-full | 621.3815 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815 |
| dewey-search | 621.3815 |
| dewey-sort | 3621.3815 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV044389527 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T07:51:37Z |
| institution | BVB |
| isbn | 9781569905524 1569905525 9781680157277 1680157272 9781569905517 1569905517 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029791749 |
| oclc_num | 891586550 |
| open_access_boolean | |
| owner | DE-1046 |
| owner_facet | DE-1046 |
| physical | 1 online resource (xii, 356 pages) color illustrations |
| psigel | ZDB-33-ESD ZDB-33-EBS ZDB-33-ESD FAW_PDA_ESD |
| publishDate | 2014 |
| publishDateSearch | 2014 |
| publishDateSort | 2014 |
| publisher | Hanser |
| record_format | marc |
| spelling | Franke, Jörg Verfasser aut Räumliche elektronische Baugruppen (3D-MID) Three-dimensional molded interconnect devices (3D-MID) materials, Manufacturing, assembly, and applications for injection molded circuit carriers Jörg Franke Munich ; Cincinnati, OH Hanser [2014] © 2014 1 online resource (xii, 356 pages) color illustrations txt rdacontent c rdamedia cr rdacarrier Translated from the German Includes bibliographical references and index Interconnects (Integrated circuit technology) Design and construction Injection molding of plastics Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd rswk-swf Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 s 1\p DE-604 Erscheint auch als Druck-Ausgabe 9781569905517 http://www.sciencedirect.com/science/book/9781569905517 Verlag URL des Erstveröffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Franke, Jörg Three-dimensional molded interconnect devices (3D-MID) materials, Manufacturing, assembly, and applications for injection molded circuit carriers Interconnects (Integrated circuit technology) Design and construction Injection molding of plastics Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd |
| subject_GND | (DE-588)4550503-2 |
| title | Three-dimensional molded interconnect devices (3D-MID) materials, Manufacturing, assembly, and applications for injection molded circuit carriers |
| title_alt | Räumliche elektronische Baugruppen (3D-MID) |
| title_auth | Three-dimensional molded interconnect devices (3D-MID) materials, Manufacturing, assembly, and applications for injection molded circuit carriers |
| title_exact_search | Three-dimensional molded interconnect devices (3D-MID) materials, Manufacturing, assembly, and applications for injection molded circuit carriers |
| title_full | Three-dimensional molded interconnect devices (3D-MID) materials, Manufacturing, assembly, and applications for injection molded circuit carriers Jörg Franke |
| title_fullStr | Three-dimensional molded interconnect devices (3D-MID) materials, Manufacturing, assembly, and applications for injection molded circuit carriers Jörg Franke |
| title_full_unstemmed | Three-dimensional molded interconnect devices (3D-MID) materials, Manufacturing, assembly, and applications for injection molded circuit carriers Jörg Franke |
| title_short | Three-dimensional molded interconnect devices (3D-MID) |
| title_sort | three dimensional molded interconnect devices 3d mid materials manufacturing assembly and applications for injection molded circuit carriers |
| title_sub | materials, Manufacturing, assembly, and applications for injection molded circuit carriers |
| topic | Interconnects (Integrated circuit technology) Design and construction Injection molding of plastics Dreidimensionaler spritzgegossener Schaltungsträger (DE-588)4550503-2 gnd |
| topic_facet | Interconnects (Integrated circuit technology) Design and construction Injection molding of plastics Dreidimensionaler spritzgegossener Schaltungsträger |
| url | http://www.sciencedirect.com/science/book/9781569905517 |
| work_keys_str_mv | AT frankejorg raumlicheelektronischebaugruppen3dmid AT frankejorg threedimensionalmoldedinterconnectdevices3dmidmaterialsmanufacturingassemblyandapplicationsforinjectionmoldedcircuitcarriers |