ESD testing: from components to systems
With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the read...
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1. Verfasser: | |
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Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
Chichester, West Sussex
Wiley
[2017]
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Schriftenreihe: | ESD series
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Schlagworte: | |
Online-Zugang: | FHR01 FRO01 UBG01 FHR01 Volltext |
Zusammenfassung: | With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the reader in the new tests, test models, and techniques in the characterization of semiconductor components for ESD, EOS, and latchup. Key features: -Provides understanding and knowledge of ESD models and specifications including human body model (HBM), machine model (MM), charged device model (CDM), charged board model (CBM), cable discharge events (CDE), human metal model (HMM), IEC 61000-4-2 and IEC 61000-4-5. -Discusses new testing methodologies such as transmission line pulse (TLP), to very fast transmission line pulse (VF-TLP), and future methods of long pulse TLP, to ultra-fast TLP (UF-TLP). -Describes both conventional testing and new testing techniques for both chip and system level evaluation. -Addresses EOS testing, electromagnetic compatibility (EMC) scanning, to current reconstruction methods. -Discusses latchup characterization and testing methodologies for evaluation of semiconductor technology to product testing. ESD Testing: From Components to Systems is part of the authors' series of books on electrostatic discharge (ESD) protection; this book will be an invaluable reference for the professional semiconductor chip and system-level ESD and EOS test engineer. Semiconductor device and process development, circuit designers, quality, reliability and failure analysis engineers will also find it an essential reference. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, semiconductor testing and experimental work |
Beschreibung: | 1 Online-Ressource (xxiv, 297 Seiten) |
ISBN: | 9781118707128 1118707125 |
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520 | |a With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the reader in the new tests, test models, and techniques in the characterization of semiconductor components for ESD, EOS, and latchup. Key features: -Provides understanding and knowledge of ESD models and specifications including human body model (HBM), machine model (MM), charged device model (CDM), charged board model (CBM), cable discharge events (CDE), human metal model (HMM), IEC 61000-4-2 and IEC 61000-4-5. -Discusses new testing methodologies such as transmission line pulse (TLP), to very fast transmission line pulse (VF-TLP), and future methods of long pulse TLP, to ultra-fast TLP (UF-TLP). -Describes both conventional testing and new testing techniques for both chip and system level evaluation. -Addresses EOS testing, electromagnetic compatibility (EMC) scanning, to current reconstruction methods. -Discusses latchup characterization and testing methodologies for evaluation of semiconductor technology to product testing. ESD Testing: From Components to Systems is part of the authors' series of books on electrostatic discharge (ESD) protection; this book will be an invaluable reference for the professional semiconductor chip and system-level ESD and EOS test engineer. Semiconductor device and process development, circuit designers, quality, reliability and failure analysis engineers will also find it an essential reference. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, semiconductor testing and experimental work | ||
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Datensatz im Suchindex
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any_adam_object | |
author | Voldman, Steven H. |
author_GND | (DE-588)1046025996 |
author_facet | Voldman, Steven H. |
author_role | aut |
author_sort | Voldman, Steven H. |
author_variant | s h v sh shv |
building | Verbundindex |
bvnumber | BV044289106 |
collection | ZDB-35-WIC |
contents | Includes bibliographical references and index Human body model -- Machine model -- Charged device model -- Transmission line pulse (TLP) -- Very fast transmission line pulse (VF-TLP) -- IEC 61000-4-2 -- Human metal model (HMM) -- IEC 61000-4-5 -- Cable discharge event (CDE) -- Latchup -- Electrical overstress (EOS) -- Electromagnetic compatibility (EMC) testing |
ctrlnum | (OCoLC)992552039 (DE-599)BVBBV044289106 |
format | Electronic eBook |
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id | DE-604.BV044289106 |
illustrated | Not Illustrated |
indexdate | 2024-07-10T07:48:49Z |
institution | BVB |
isbn | 9781118707128 1118707125 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029693247 |
oclc_num | 992552039 |
open_access_boolean | |
owner | DE-861 DE-83 DE-898 DE-BY-UBR |
owner_facet | DE-861 DE-83 DE-898 DE-BY-UBR |
physical | 1 Online-Ressource (xxiv, 297 Seiten) |
psigel | ZDB-35-WIC UBG_PDA_WIC ZDB-35-WIC FHR_ZDB-35-WIC_Kauf ZDB-35-WIC FRO_PDA_WIC ZDB-35-WIC UBG_PDA_WIC ZDB-35-WIC FHR_PDA_WIC |
publishDate | 2017 |
publishDateSearch | 2017 |
publishDateSort | 2017 |
publisher | Wiley |
record_format | marc |
series2 | ESD series |
spelling | Voldman, Steven H. Verfasser (DE-588)1046025996 aut ESD testing from components to systems Steven H. Voldman, IEEE Fellow, New York, USA Electrostatic discharge testing Chichester, West Sussex Wiley [2017] 1 Online-Ressource (xxiv, 297 Seiten) txt rdacontent c rdamedia cr rdacarrier Online-Ressource ESD series Includes bibliographical references and index Human body model -- Machine model -- Charged device model -- Transmission line pulse (TLP) -- Very fast transmission line pulse (VF-TLP) -- IEC 61000-4-2 -- Human metal model (HMM) -- IEC 61000-4-5 -- Cable discharge event (CDE) -- Latchup -- Electrical overstress (EOS) -- Electromagnetic compatibility (EMC) testing With the evolution of semiconductor technology and global diversification of the semiconductor business, testing of semiconductor devices to systems for electrostatic discharge (ESD) and electrical overstress (EOS) has increased in importance. ESD Testing: From Components to Systems updates the reader in the new tests, test models, and techniques in the characterization of semiconductor components for ESD, EOS, and latchup. Key features: -Provides understanding and knowledge of ESD models and specifications including human body model (HBM), machine model (MM), charged device model (CDM), charged board model (CBM), cable discharge events (CDE), human metal model (HMM), IEC 61000-4-2 and IEC 61000-4-5. -Discusses new testing methodologies such as transmission line pulse (TLP), to very fast transmission line pulse (VF-TLP), and future methods of long pulse TLP, to ultra-fast TLP (UF-TLP). -Describes both conventional testing and new testing techniques for both chip and system level evaluation. -Addresses EOS testing, electromagnetic compatibility (EMC) scanning, to current reconstruction methods. -Discusses latchup characterization and testing methodologies for evaluation of semiconductor technology to product testing. ESD Testing: From Components to Systems is part of the authors' series of books on electrostatic discharge (ESD) protection; this book will be an invaluable reference for the professional semiconductor chip and system-level ESD and EOS test engineer. Semiconductor device and process development, circuit designers, quality, reliability and failure analysis engineers will also find it an essential reference. In addition, its academic treatment will appeal to both senior and graduate students with interests in semiconductor process, device physics, semiconductor testing and experimental work TECHNOLOGY & ENGINEERING / Mechanical bisacsh Electronic circuits / Effect of radiation on Electronic apparatus and appliances / Testing Electric discharges / Detection Electric discharges / Measurement Electrostatics Elektrostatische Entladung (DE-588)4401020-5 gnd rswk-swf Elektrostatische Entladung (DE-588)4401020-5 s DE-604 Erscheint auch als Druck-Ausgabe 9780470511916 Erscheint auch als Online-Ausgebe, PDF 978-1-118-70714-2 Erscheint auch als Online-Ausgebe, EPub 978-1-118-70715-9 https://onlinelibrary.wiley.com/doi/book/10.1002/9781118707128 Verlag URL des Erstveröffentlichers Volltext |
spellingShingle | Voldman, Steven H. ESD testing from components to systems Includes bibliographical references and index Human body model -- Machine model -- Charged device model -- Transmission line pulse (TLP) -- Very fast transmission line pulse (VF-TLP) -- IEC 61000-4-2 -- Human metal model (HMM) -- IEC 61000-4-5 -- Cable discharge event (CDE) -- Latchup -- Electrical overstress (EOS) -- Electromagnetic compatibility (EMC) testing TECHNOLOGY & ENGINEERING / Mechanical bisacsh Electronic circuits / Effect of radiation on Electronic apparatus and appliances / Testing Electric discharges / Detection Electric discharges / Measurement Electrostatics Elektrostatische Entladung (DE-588)4401020-5 gnd |
subject_GND | (DE-588)4401020-5 |
title | ESD testing from components to systems |
title_alt | Electrostatic discharge testing |
title_auth | ESD testing from components to systems |
title_exact_search | ESD testing from components to systems |
title_full | ESD testing from components to systems Steven H. Voldman, IEEE Fellow, New York, USA |
title_fullStr | ESD testing from components to systems Steven H. Voldman, IEEE Fellow, New York, USA |
title_full_unstemmed | ESD testing from components to systems Steven H. Voldman, IEEE Fellow, New York, USA |
title_short | ESD testing |
title_sort | esd testing from components to systems |
title_sub | from components to systems |
topic | TECHNOLOGY & ENGINEERING / Mechanical bisacsh Electronic circuits / Effect of radiation on Electronic apparatus and appliances / Testing Electric discharges / Detection Electric discharges / Measurement Electrostatics Elektrostatische Entladung (DE-588)4401020-5 gnd |
topic_facet | TECHNOLOGY & ENGINEERING / Mechanical Electronic circuits / Effect of radiation on Electronic apparatus and appliances / Testing Electric discharges / Detection Electric discharges / Measurement Electrostatics Elektrostatische Entladung |
url | https://onlinelibrary.wiley.com/doi/book/10.1002/9781118707128 |
work_keys_str_mv | AT voldmanstevenh esdtestingfromcomponentstosystems AT voldmanstevenh electrostaticdischargetesting |