3D IC devices, technologies, and manufacturing:
This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word...
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Bellingham, Washington
SPIE
2016
|
| Schriftenreihe: | SPIE Press monograph
PM265 SPIE Digital Library |
| Schlagworte: | |
| Online-Zugang: | FHD01 URL des Erstveröffentlichers |
| Zusammenfassung: | This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word-line DRAM; 3D FinFET CMOS IC devices; scaling trends of CMOS logic; devices that may be used in the "post-CMOS" era; and 3D technologies, such as the 3D-wafer process integration of silicon-on-ILD and TSV-based 3D packaging |
| Beschreibung: | 1 online resource (204 pages) |
| ISBN: | 9781510601475 |
| DOI: | 10.1117/3.2234473 |
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| doi_str_mv | 10.1117/3.2234473 |
| format | Electronic eBook |
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| id | DE-604.BV044242055 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T07:47:32Z |
| institution | BVB |
| isbn | 9781510601475 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029647382 |
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| physical | 1 online resource (204 pages) |
| psigel | ZDB-50-SPI |
| publishDate | 2016 |
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| publisher | SPIE |
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| series2 | SPIE Press monograph SPIE Digital Library |
| spelling | Xiao, Hong 1961- Verfasser aut 3D IC devices, technologies, and manufacturing Hong Xiao Bellingham, Washington SPIE 2016 1 online resource (204 pages) txt rdacontent c rdamedia cr rdacarrier SPIE Press monograph PM265 SPIE Digital Library This book discusses the advantages of 3D devices and their applications in dynamic random access memory (DRAM), 3D-NAND flash, and advanced-technology-node CMOS ICs. Topics include the development of DRAM cell transistors and storage node capacitors; the manufacturing process of advanced buried-word-line DRAM; 3D FinFET CMOS IC devices; scaling trends of CMOS logic; devices that may be used in the "post-CMOS" era; and 3D technologies, such as the 3D-wafer process integration of silicon-on-ILD and TSV-based 3D packaging Three-dimensional integrated circuits Electronic books Erscheint auch als Druck-Ausgabe 978-1-5106-0146-8 https://doi.org/10.1117/3.2234473 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Xiao, Hong 1961- 3D IC devices, technologies, and manufacturing Three-dimensional integrated circuits |
| title | 3D IC devices, technologies, and manufacturing |
| title_auth | 3D IC devices, technologies, and manufacturing |
| title_exact_search | 3D IC devices, technologies, and manufacturing |
| title_full | 3D IC devices, technologies, and manufacturing Hong Xiao |
| title_fullStr | 3D IC devices, technologies, and manufacturing Hong Xiao |
| title_full_unstemmed | 3D IC devices, technologies, and manufacturing Hong Xiao |
| title_short | 3D IC devices, technologies, and manufacturing |
| title_sort | 3d ic devices technologies and manufacturing |
| topic | Three-dimensional integrated circuits |
| topic_facet | Three-dimensional integrated circuits |
| url | https://doi.org/10.1117/3.2234473 |
| work_keys_str_mv | AT xiaohong 3dicdevicestechnologiesandmanufacturing |