Advanced processes for 193-nm immersion lithography:
This book is a comprehensive guide to advanced processes and materials used in 193-nm immersion lithography (193i). It is an important text for those new to the field as well as for current practitioners who want to broaden their understanding of this latest technology. The book can be used as cours...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Bellingham, Wash.
SPIE
[2009]
|
| Schriftenreihe: | SPIE Press monograph
PM189 |
| Schlagworte: | |
| Online-Zugang: | FHD01 Volltext |
| Zusammenfassung: | This book is a comprehensive guide to advanced processes and materials used in 193-nm immersion lithography (193i). It is an important text for those new to the field as well as for current practitioners who want to broaden their understanding of this latest technology. The book can be used as course material for graduate students of electrical engineering, material sciences, physics, chemistry, and microelectronics engineering and can also be used to train engineers involved in the manufacture of integrated circuits. It provides techniques for selecting critical materials (topcoats, photoresists, and antireflective coatings) and optimizing immersion processes to ensure higher performance and lower defectivity at lower cost. This book also includes sections on shrinking, trimming, and smoothing of the resist pattern to reduce feature sizes and line-edge roughness. Finally, it describes the recent development of 193i in combination with double exposure and double patterning |
| Beschreibung: | 1 online resource (xix, 315 pages) illustrations |
| ISBN: | 9780819478436 |
| DOI: | 10.1117/3.820233 |
Internformat
MARC
| LEADER | 00000nmm a2200000zcb4500 | ||
|---|---|---|---|
| 001 | BV044221893 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 170313s2009 |||| o||u| ||||||eng d | ||
| 020 | |a 9780819478436 |9 978-0-8194-7843-6 | ||
| 024 | 7 | |a 10.1117/3.820233 |2 doi | |
| 035 | |a (ZDB-50-SPI)9780819478436 | ||
| 035 | |a (OCoLC)812328394 | ||
| 035 | |a (DE-599)BVBBV044221893 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-1050 | ||
| 082 | 0 | |a 621.3815/31 | |
| 100 | 1 | |a Wei, Yayi |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Advanced processes for 193-nm immersion lithography |c Yayi Wei, Robert L. Brainard |
| 264 | 1 | |a Bellingham, Wash. |b SPIE |c [2009] | |
| 300 | |a 1 online resource (xix, 315 pages) |b illustrations | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a SPIE Press monograph |v PM189 | |
| 520 | |a This book is a comprehensive guide to advanced processes and materials used in 193-nm immersion lithography (193i). It is an important text for those new to the field as well as for current practitioners who want to broaden their understanding of this latest technology. The book can be used as course material for graduate students of electrical engineering, material sciences, physics, chemistry, and microelectronics engineering and can also be used to train engineers involved in the manufacture of integrated circuits. It provides techniques for selecting critical materials (topcoats, photoresists, and antireflective coatings) and optimizing immersion processes to ensure higher performance and lower defectivity at lower cost. This book also includes sections on shrinking, trimming, and smoothing of the resist pattern to reduce feature sizes and line-edge roughness. Finally, it describes the recent development of 193i in combination with double exposure and double patterning | ||
| 650 | 4 | |a Immersion lithography | |
| 650 | 4 | |a Semiconductors / Etching | |
| 650 | 4 | |a Integrated circuits / Design and construction | |
| 700 | 1 | |a Brainard, Robert L. |e Verfasser |4 aut | |
| 710 | 2 | |a Society of Photo-optical Instrumentation Engineers |e Sonstige |4 oth | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 978-0-8194-7557-2 |
| 856 | 4 | 0 | |u https://doi.org/10.1117/3.820233 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 912 | |a ZDB-50-SPI | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-029627825 | ||
| 966 | e | |u https://doi.org/10.1117/3.820233 |l FHD01 |p ZDB-50-SPI |x Verlag |3 Volltext | |
Datensatz im Suchindex
| _version_ | 1804177370248118272 |
|---|---|
| any_adam_object | |
| author | Wei, Yayi Brainard, Robert L. |
| author_facet | Wei, Yayi Brainard, Robert L. |
| author_role | aut aut |
| author_sort | Wei, Yayi |
| author_variant | y w yw r l b rl rlb |
| building | Verbundindex |
| bvnumber | BV044221893 |
| collection | ZDB-50-SPI |
| ctrlnum | (ZDB-50-SPI)9780819478436 (OCoLC)812328394 (DE-599)BVBBV044221893 |
| dewey-full | 621.3815/31 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815/31 |
| dewey-search | 621.3815/31 |
| dewey-sort | 3621.3815 231 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| doi_str_mv | 10.1117/3.820233 |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02485nmm a2200421zcb4500</leader><controlfield tag="001">BV044221893</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">170313s2009 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780819478436</subfield><subfield code="9">978-0-8194-7843-6</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1117/3.820233</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-50-SPI)9780819478436</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)812328394</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV044221893</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-1050</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.3815/31</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Wei, Yayi</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Advanced processes for 193-nm immersion lithography</subfield><subfield code="c">Yayi Wei, Robert L. Brainard</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Bellingham, Wash.</subfield><subfield code="b">SPIE</subfield><subfield code="c">[2009]</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (xix, 315 pages)</subfield><subfield code="b">illustrations</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">SPIE Press monograph</subfield><subfield code="v">PM189</subfield></datafield><datafield tag="520" ind1=" " ind2=" "><subfield code="a">This book is a comprehensive guide to advanced processes and materials used in 193-nm immersion lithography (193i). It is an important text for those new to the field as well as for current practitioners who want to broaden their understanding of this latest technology. The book can be used as course material for graduate students of electrical engineering, material sciences, physics, chemistry, and microelectronics engineering and can also be used to train engineers involved in the manufacture of integrated circuits. It provides techniques for selecting critical materials (topcoats, photoresists, and antireflective coatings) and optimizing immersion processes to ensure higher performance and lower defectivity at lower cost. This book also includes sections on shrinking, trimming, and smoothing of the resist pattern to reduce feature sizes and line-edge roughness. Finally, it describes the recent development of 193i in combination with double exposure and double patterning</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Immersion lithography</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Semiconductors / Etching</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Integrated circuits / Design and construction</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Brainard, Robert L.</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="710" ind1="2" ind2=" "><subfield code="a">Society of Photo-optical Instrumentation Engineers</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-0-8194-7557-2</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1117/3.820233</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-50-SPI</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-029627825</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1117/3.820233</subfield><subfield code="l">FHD01</subfield><subfield code="p">ZDB-50-SPI</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV044221893 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T07:47:00Z |
| institution | BVB |
| isbn | 9780819478436 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029627825 |
| oclc_num | 812328394 |
| open_access_boolean | |
| owner | DE-1050 |
| owner_facet | DE-1050 |
| physical | 1 online resource (xix, 315 pages) illustrations |
| psigel | ZDB-50-SPI |
| publishDate | 2009 |
| publishDateSearch | 2009 |
| publishDateSort | 2009 |
| publisher | SPIE |
| record_format | marc |
| series2 | SPIE Press monograph |
| spelling | Wei, Yayi Verfasser aut Advanced processes for 193-nm immersion lithography Yayi Wei, Robert L. Brainard Bellingham, Wash. SPIE [2009] 1 online resource (xix, 315 pages) illustrations txt rdacontent c rdamedia cr rdacarrier SPIE Press monograph PM189 This book is a comprehensive guide to advanced processes and materials used in 193-nm immersion lithography (193i). It is an important text for those new to the field as well as for current practitioners who want to broaden their understanding of this latest technology. The book can be used as course material for graduate students of electrical engineering, material sciences, physics, chemistry, and microelectronics engineering and can also be used to train engineers involved in the manufacture of integrated circuits. It provides techniques for selecting critical materials (topcoats, photoresists, and antireflective coatings) and optimizing immersion processes to ensure higher performance and lower defectivity at lower cost. This book also includes sections on shrinking, trimming, and smoothing of the resist pattern to reduce feature sizes and line-edge roughness. Finally, it describes the recent development of 193i in combination with double exposure and double patterning Immersion lithography Semiconductors / Etching Integrated circuits / Design and construction Brainard, Robert L. Verfasser aut Society of Photo-optical Instrumentation Engineers Sonstige oth Erscheint auch als Druck-Ausgabe 978-0-8194-7557-2 https://doi.org/10.1117/3.820233 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Wei, Yayi Brainard, Robert L. Advanced processes for 193-nm immersion lithography Immersion lithography Semiconductors / Etching Integrated circuits / Design and construction |
| title | Advanced processes for 193-nm immersion lithography |
| title_auth | Advanced processes for 193-nm immersion lithography |
| title_exact_search | Advanced processes for 193-nm immersion lithography |
| title_full | Advanced processes for 193-nm immersion lithography Yayi Wei, Robert L. Brainard |
| title_fullStr | Advanced processes for 193-nm immersion lithography Yayi Wei, Robert L. Brainard |
| title_full_unstemmed | Advanced processes for 193-nm immersion lithography Yayi Wei, Robert L. Brainard |
| title_short | Advanced processes for 193-nm immersion lithography |
| title_sort | advanced processes for 193 nm immersion lithography |
| topic | Immersion lithography Semiconductors / Etching Integrated circuits / Design and construction |
| topic_facet | Immersion lithography Semiconductors / Etching Integrated circuits / Design and construction |
| url | https://doi.org/10.1117/3.820233 |
| work_keys_str_mv | AT weiyayi advancedprocessesfor193nmimmersionlithography AT brainardrobertl advancedprocessesfor193nmimmersionlithography AT societyofphotoopticalinstrumentationengineers advancedprocessesfor193nmimmersionlithography |