Liu, S. (2011). Modeling and simulation for microelectronic packaging assembly: Manufacturing, reliability and testing. Wiley.
Chicago-Zitierstil (17. Ausg.)Liu, S. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing. Hoboken, N.J: Wiley, 2011.
MLA-Zitierstil (9. Ausg.)Liu, S. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing. Wiley, 2011.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.