Modeling and simulation for microelectronic packaging assembly: manufacturing, reliability and testing
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Hoboken, N.J.
Wiley
2011
|
| Schlagworte: | |
| Online-Zugang: | Buchcover |
| Beschreibung: | Includes bibliographical references and index "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- |
| Beschreibung: | xxii, 564 p. |
| ISBN: | 9780470827826 9780470828410 9781118082829 9780470827819 |
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| 245 | 1 | 0 | |a Modeling and simulation for microelectronic packaging assembly |b manufacturing, reliability and testing |c Sheng Liu, Yong Liu |
| 264 | 1 | |a Hoboken, N.J. |b Wiley |c 2011 | |
| 300 | |a xxii, 564 p. | ||
| 336 | |b txt |2 rdacontent | ||
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| 338 | |b cr |2 rdacarrier | ||
| 500 | |a Includes bibliographical references and index | ||
| 500 | |a "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- | ||
| 505 | 0 | |a pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging | |
| 650 | 4 | |a Microelectronic packaging |x Simulation methods | |
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| author | Liu, S. 1963- |
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| contents | pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging |
| ctrlnum | (ZDB-30-PAD)EBC818629 (ZDB-89-EBL)EBL818629 (OCoLC)756280855 (DE-599)BVBBV044159853 |
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| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| illustrated | Not Illustrated |
| indexdate | 2024-07-10T07:45:24Z |
| institution | BVB |
| isbn | 9780470827826 9780470828410 9781118082829 9780470827819 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029566698 |
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| physical | xxii, 564 p. |
| psigel | ZDB-30-PAD |
| publishDate | 2011 |
| publishDateSearch | 2011 |
| publishDateSort | 2011 |
| publisher | Wiley |
| record_format | marc |
| spelling | Liu, S. 1963- Verfasser aut Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing Sheng Liu, Yong Liu Hoboken, N.J. Wiley 2011 xxii, 564 p. txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index "This book is primarily concerned with studies of electronic packaging in assembly manufacture processes and failure mechanisms in assembly manufacture processes and tests through modeling and simulation"-- pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging Microelectronic packaging Simulation methods Liu, Yong 1962- Sonstige oth Erscheint auch als Druck-Ausgabe, Hardcover 978-0-470-82780-2 SWB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=029566698&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Buchcover |
| spellingShingle | Liu, S. 1963- Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing pt. 1. Mechanics and modeling -- pt. 2. Modeling in microelectronic packaging and assembly -- pt. 3. Modeling in microelectronic package reliability and test -- pt. 4. Modern modeling and simulation methodologies : application to nano packaging Microelectronic packaging Simulation methods |
| title | Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing |
| title_auth | Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing |
| title_exact_search | Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing |
| title_full | Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing Sheng Liu, Yong Liu |
| title_fullStr | Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing Sheng Liu, Yong Liu |
| title_full_unstemmed | Modeling and simulation for microelectronic packaging assembly manufacturing, reliability and testing Sheng Liu, Yong Liu |
| title_short | Modeling and simulation for microelectronic packaging assembly |
| title_sort | modeling and simulation for microelectronic packaging assembly manufacturing reliability and testing |
| title_sub | manufacturing, reliability and testing |
| topic | Microelectronic packaging Simulation methods |
| topic_facet | Microelectronic packaging Simulation methods |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=029566698&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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