Materials for high-density electronic packaging and interconnection: report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council
Gespeichert in:
| Körperschaft: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Washington, D.C.
National Academy Press
1990
|
| Schlagworte: | |
| Beschreibung: | "NMAB-449." Includes bibliographical references |
| Beschreibung: | xiv, 139 p. |
| ISBN: | 030904233X |
Internformat
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| 110 | 2 | |a National Research Council (U.S.) |b Committee on Materials for High-Density Electronic Packaging |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Materials for high-density electronic packaging and interconnection |b report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council |
| 264 | 1 | |a Washington, D.C. |b National Academy Press |c 1990 | |
| 300 | |a xiv, 139 p. | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
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| 500 | |a "NMAB-449." | ||
| 500 | |a Includes bibliographical references | ||
| 650 | 4 | |a Electronic packaging |x Materials | |
| 650 | 4 | |a Electrical engineering |x Materials | |
| 912 | |a ZDB-30-PAD | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-029514378 | ||
Datensatz im Suchindex
| _version_ | 1804177172906115073 |
|---|---|
| any_adam_object | |
| author_corporate | National Research Council (U.S.) Committee on Materials for High-Density Electronic Packaging |
| author_corporate_role | aut |
| author_facet | National Research Council (U.S.) Committee on Materials for High-Density Electronic Packaging |
| author_sort | National Research Council (U.S.) Committee on Materials for High-Density Electronic Packaging |
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| dewey-full | 621.381/046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381/046 |
| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV044107533 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T07:43:52Z |
| institution | BVB |
| isbn | 030904233X |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029514378 |
| oclc_num | 923266410 |
| open_access_boolean | |
| physical | xiv, 139 p. |
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| publishDate | 1990 |
| publishDateSearch | 1990 |
| publishDateSort | 1990 |
| publisher | National Academy Press |
| record_format | marc |
| spelling | National Research Council (U.S.) Committee on Materials for High-Density Electronic Packaging Verfasser aut Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council Washington, D.C. National Academy Press 1990 xiv, 139 p. txt rdacontent c rdamedia cr rdacarrier "NMAB-449." Includes bibliographical references Electronic packaging Materials Electrical engineering Materials |
| spellingShingle | Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council Electronic packaging Materials Electrical engineering Materials |
| title | Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council |
| title_auth | Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council |
| title_exact_search | Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council |
| title_full | Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council |
| title_fullStr | Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council |
| title_full_unstemmed | Materials for high-density electronic packaging and interconnection report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council |
| title_short | Materials for high-density electronic packaging and interconnection |
| title_sort | materials for high density electronic packaging and interconnection report of the committee on materials for high density electronic packaging national materials advisory board commission on engineering and technical systems national research council |
| title_sub | report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council |
| topic | Electronic packaging Materials Electrical engineering Materials |
| topic_facet | Electronic packaging Materials Electrical engineering Materials |
| work_keys_str_mv | AT nationalresearchcounciluscommitteeonmaterialsforhighdensityelectronicpackaging materialsforhighdensityelectronicpackagingandinterconnectionreportofthecommitteeonmaterialsforhighdensityelectronicpackagingnationalmaterialsadvisoryboardcommissiononengineeringandtechnicalsystemsnationalresearchcouncil |