Handbook of 3D integration, Volume 3, 3D process technology:
Gespeichert in:
| Weitere Verfasser: | , , , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Weinheim, Germany
Wiley-VCH
2014
|
| Schlagworte: | |
| Beschreibung: | Description based on online resource; title from PDF title page (ebrary, viewed May 5, 2014) |
| Beschreibung: | 1 online resource (475 pages) illustrations (some color) |
| ISBN: | 9783527334667 9783527670130 9783527670123 9783527670116 9783527670109 |
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| 245 | 1 | 0 | |a Handbook of 3D integration, Volume 3, 3D process technology |c edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm ; Richard A. Allen [and sixty others], contributors |
| 264 | 1 | |a Weinheim, Germany |b Wiley-VCH |c 2014 | |
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| 650 | 4 | |a Three-dimensional imaging | |
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| 700 | 1 | |a Koyanagi, Mitsumasa |4 edt | |
| 700 | 1 | |a Ramm, Peter |4 edt | |
| 700 | 1 | |a Allen, Ricky |4 ctb | |
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| dewey-tens | 620 - Engineering and allied operations |
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| id | DE-604.BV044068074 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T07:42:41Z |
| institution | BVB |
| isbn | 9783527334667 9783527670130 9783527670123 9783527670116 9783527670109 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029474919 |
| oclc_num | 878919955 |
| open_access_boolean | |
| physical | 1 online resource (475 pages) illustrations (some color) |
| psigel | ZDB-30-PAD |
| publishDate | 2014 |
| publishDateSearch | 2014 |
| publishDateSort | 2014 |
| publisher | Wiley-VCH |
| record_format | marc |
| spelling | Handbook of 3D integration, Volume 3, 3D process technology edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm ; Richard A. Allen [and sixty others], contributors Weinheim, Germany Wiley-VCH 2014 © 2014 1 online resource (475 pages) illustrations (some color) txt rdacontent c rdamedia cr rdacarrier Description based on online resource; title from PDF title page (ebrary, viewed May 5, 2014) Integrated circuits Integrated circuits Design and construction Silicon Three-dimensional imaging Garrou, Philip edt Koyanagi, Mitsumasa edt Ramm, Peter edt Allen, Ricky ctb Erscheint auch als Druck-Ausgabe Handbook of 3D integration. Volume 3, 3D process technology |
| spellingShingle | Handbook of 3D integration, Volume 3, 3D process technology Integrated circuits Integrated circuits Design and construction Silicon Three-dimensional imaging |
| title | Handbook of 3D integration, Volume 3, 3D process technology |
| title_auth | Handbook of 3D integration, Volume 3, 3D process technology |
| title_exact_search | Handbook of 3D integration, Volume 3, 3D process technology |
| title_full | Handbook of 3D integration, Volume 3, 3D process technology edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm ; Richard A. Allen [and sixty others], contributors |
| title_fullStr | Handbook of 3D integration, Volume 3, 3D process technology edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm ; Richard A. Allen [and sixty others], contributors |
| title_full_unstemmed | Handbook of 3D integration, Volume 3, 3D process technology edited by Philip Garrou, Mitsumasa Koyanagi, and Peter Ramm ; Richard A. Allen [and sixty others], contributors |
| title_short | Handbook of 3D integration, Volume 3, 3D process technology |
| title_sort | handbook of 3d integration volume 3 3d process technology |
| topic | Integrated circuits Integrated circuits Design and construction Silicon Three-dimensional imaging |
| topic_facet | Integrated circuits Integrated circuits Design and construction Silicon Three-dimensional imaging |
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