Simulation based analysis of LED package reliability regarding encapsulant related failures:
Gespeichert in:
1. Verfasser: | |
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Format: | Abschlussarbeit Buch |
Sprache: | English |
Veröffentlicht: |
Stuttgart
Fraunhofer Verlag
[2016]
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Schlagworte: | |
Online-Zugang: | Inhaltstext Inhaltsverzeichnis Abstract Abstract Inhaltsverzeichnis |
Beschreibung: | XXV, 138 Seiten Illustrationen, Diagramme 21 cm |
ISBN: | 9783839609569 3839609569 |
Internformat
MARC
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Datensatz im Suchindex
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adam_text | |
any_adam_object | |
author | Watzke, Stefan |
author_GND | (DE-588)1090916957 |
author_facet | Watzke, Stefan |
author_role | aut |
author_sort | Watzke, Stefan |
author_variant | s w sw |
building | Verbundindex |
bvnumber | BV044047396 |
classification_rvk | ZN 5040 |
ctrlnum | (OCoLC)939674228 (DE-599)DNB1082379255 |
dewey-full | 621.3815220284 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.3815220284 |
dewey-search | 621.3815220284 |
dewey-sort | 3621.3815220284 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Maschinenbau / Maschinenwesen Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Thesis Book |
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institution | BVB |
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language | English |
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physical | XXV, 138 Seiten Illustrationen, Diagramme 21 cm |
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spelling | Watzke, Stefan Verfasser (DE-588)1090916957 aut Simulation based analysis of LED package reliability regarding encapsulant related failures von Stefan Watzke Stuttgart Fraunhofer Verlag [2016] © 2016 XXV, 138 Seiten Illustrationen, Diagramme 21 cm txt rdacontent n rdamedia nc rdacarrier Dissertation Technische Universität Berlin 2015 Lumineszenzdiode (DE-588)4125154-4 gnd rswk-swf Stoffeigenschaft (DE-588)4192147-1 gnd rswk-swf Werkstoffprüfung (DE-588)4037934-6 gnd rswk-swf Ausfall Technik (DE-588)4510528-5 gnd rswk-swf Silicone (DE-588)4127342-4 gnd rswk-swf Verbindungstechnik (DE-588)4129183-9 gnd rswk-swf Degradation Technik (DE-588)4206992-0 gnd rswk-swf Finite-Elemente-Methode (DE-588)4017233-8 gnd rswk-swf Epoxide (DE-588)4152561-9 gnd rswk-swf Vergussmasse (DE-588)4128787-3 gnd rswk-swf Dynamik und Statik Fraunhofer IZM Materialcharakterisierung Materialwissenschaftler Mechanik von Festkörpern Modellierung und Simulation (DE-588)4113937-9 Hochschulschrift gnd-content Lumineszenzdiode (DE-588)4125154-4 s Ausfall Technik (DE-588)4510528-5 s Verbindungstechnik (DE-588)4129183-9 s Silicone (DE-588)4127342-4 s Epoxide (DE-588)4152561-9 s Vergussmasse (DE-588)4128787-3 s Stoffeigenschaft (DE-588)4192147-1 s Werkstoffprüfung (DE-588)4037934-6 s Degradation Technik (DE-588)4206992-0 s Finite-Elemente-Methode (DE-588)4017233-8 s DE-604 Fraunhofer IRB-Verlag (DE-588)4786605-6 pbl X:MVB text/html http://deposit.dnb.de/cgi-bin/dokserv?id=118bae83b9844b12a977a92e4cc52d1d&prov=M&dok_var=1&dok_ext=htm Inhaltstext B:DE-101 application/pdf http://d-nb.info/1082379255/04 Inhaltsverzeichnis http://www.verlag.tu-berlin.de/abstracts/diss/watzke_stefan_dt.pdf Abstract http://www.verlag.tu-berlin.de/abstracts/diss/watzke_stefan_engl.pdf Abstract http://www.verlag.tu-berlin.de/abstracts/diss/watzke_stefan_inhalt.pdf Inhaltsverzeichnis |
spellingShingle | Watzke, Stefan Simulation based analysis of LED package reliability regarding encapsulant related failures Lumineszenzdiode (DE-588)4125154-4 gnd Stoffeigenschaft (DE-588)4192147-1 gnd Werkstoffprüfung (DE-588)4037934-6 gnd Ausfall Technik (DE-588)4510528-5 gnd Silicone (DE-588)4127342-4 gnd Verbindungstechnik (DE-588)4129183-9 gnd Degradation Technik (DE-588)4206992-0 gnd Finite-Elemente-Methode (DE-588)4017233-8 gnd Epoxide (DE-588)4152561-9 gnd Vergussmasse (DE-588)4128787-3 gnd |
subject_GND | (DE-588)4125154-4 (DE-588)4192147-1 (DE-588)4037934-6 (DE-588)4510528-5 (DE-588)4127342-4 (DE-588)4129183-9 (DE-588)4206992-0 (DE-588)4017233-8 (DE-588)4152561-9 (DE-588)4128787-3 (DE-588)4113937-9 |
title | Simulation based analysis of LED package reliability regarding encapsulant related failures |
title_auth | Simulation based analysis of LED package reliability regarding encapsulant related failures |
title_exact_search | Simulation based analysis of LED package reliability regarding encapsulant related failures |
title_full | Simulation based analysis of LED package reliability regarding encapsulant related failures von Stefan Watzke |
title_fullStr | Simulation based analysis of LED package reliability regarding encapsulant related failures von Stefan Watzke |
title_full_unstemmed | Simulation based analysis of LED package reliability regarding encapsulant related failures von Stefan Watzke |
title_short | Simulation based analysis of LED package reliability regarding encapsulant related failures |
title_sort | simulation based analysis of led package reliability regarding encapsulant related failures |
topic | Lumineszenzdiode (DE-588)4125154-4 gnd Stoffeigenschaft (DE-588)4192147-1 gnd Werkstoffprüfung (DE-588)4037934-6 gnd Ausfall Technik (DE-588)4510528-5 gnd Silicone (DE-588)4127342-4 gnd Verbindungstechnik (DE-588)4129183-9 gnd Degradation Technik (DE-588)4206992-0 gnd Finite-Elemente-Methode (DE-588)4017233-8 gnd Epoxide (DE-588)4152561-9 gnd Vergussmasse (DE-588)4128787-3 gnd |
topic_facet | Lumineszenzdiode Stoffeigenschaft Werkstoffprüfung Ausfall Technik Silicone Verbindungstechnik Degradation Technik Finite-Elemente-Methode Epoxide Vergussmasse Hochschulschrift |
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