3D Microelectronic Packaging: from Fundamentals to Applications
Saved in:
| Format: | Electronic eBook |
|---|---|
| Language: | English |
| Published: |
Cham
Springer
[2017]
|
| Series: | Springer Series in Advanced Microelectronics
57 |
| Subjects: | |
| Online Access: | BTU01 FAB01 FAW01 FHA01 FHI01 FHN01 FHR01 FKE01 FLA01 FRO01 FWS01 FWS02 TUM01 UBY01 Volltext |
| Physical Description: | 1 Online-Ressource (IX, 463 p. 331 illus., 253 illus. in color) |
| ISBN: | 9783319445861 |
| ISSN: | 1437-0387 |
| DOI: | 10.1007/978-3-319-44586-1 |
Staff View
MARC
| LEADER | 00000nmm a2200000zcb4500 | ||
|---|---|---|---|
| 001 | BV044023924 | ||
| 003 | DE-604 | ||
| 005 | 20181009 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 170201s2017 |||| o||u| ||||||eng d | ||
| 020 | |a 9783319445861 |c Online |9 978-3-319-44586-1 | ||
| 024 | 7 | |a 10.1007/978-3-319-44586-1 |2 doi | |
| 035 | |a (ZDB-2-ENG)978-3-319-44586-1 | ||
| 035 | |a (OCoLC)971244730 | ||
| 035 | |a (DE-599)BVBBV044023924 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-859 |a DE-860 |a DE-91 |a DE-1046 |a DE-1043 |a DE-Aug4 |a DE-898 |a DE-861 |a DE-573 |a DE-863 |a DE-706 |a DE-634 |a DE-862 |a DE-92 | ||
| 082 | 0 | |a 621.381 |2 23 | |
| 084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
| 084 | |a MAS 000 |2 stub | ||
| 084 | |a ELT 000 |2 stub | ||
| 245 | 1 | 0 | |a 3D Microelectronic Packaging |b from Fundamentals to Applications |c Editors Yan Li, Deepak Goyal |
| 264 | 1 | |a Cham |b Springer |c [2017] | |
| 300 | |a 1 Online-Ressource (IX, 463 p. 331 illus., 253 illus. in color) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 1 | |a Springer Series in Advanced Microelectronics |v 57 |x 1437-0387 | |
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a Biotechnology | |
| 650 | 4 | |a Electronic circuits | |
| 650 | 4 | |a Nanotechnology | |
| 650 | 4 | |a Electronics | |
| 650 | 4 | |a Microelectronics | |
| 650 | 4 | |a Optical materials | |
| 650 | 4 | |a Electronic materials | |
| 650 | 4 | |a Metals | |
| 650 | 4 | |a Electronics and Microelectronics, Instrumentation | |
| 650 | 4 | |a Optical and Electronic Materials | |
| 650 | 4 | |a Electronic Circuits and Devices | |
| 650 | 4 | |a Microengineering | |
| 650 | 4 | |a Nanotechnology and Microengineering | |
| 650 | 4 | |a Metallic Materials | |
| 650 | 4 | |a Ingenieurwissenschaften | |
| 650 | 0 | 7 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Bestücken |0 (DE-588)4223393-8 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Elektronisches Bauelement |0 (DE-588)4014360-0 |D s |
| 689 | 0 | 1 | |a Bestücken |0 (DE-588)4223393-8 |D s |
| 689 | 0 | |5 DE-604 | |
| 700 | 1 | |a Li, Yan |e Sonstige |4 oth | |
| 700 | 1 | |a Goyal, Deepak |e Sonstige |4 oth | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 978-3-319-44584-7 |
| 776 | 0 | 8 | |i Erscheint auch als |n Druckausgabe |z 978-3-319-44584-7 |
| 830 | 0 | |a Springer Series in Advanced Microelectronics |v 57 |w (DE-604)BV012563021 |9 57 | |
| 856 | 4 | 0 | |u https://doi.org/10.1007/978-3-319-44586-1 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 912 | |a ZDB-2-ENG | ||
| 940 | 1 | |q ZDB-2-ENG_2017 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-029431368 | ||
| 966 | e | |u https://doi.org/10.1007/978-3-319-44586-1 |l BTU01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-44586-1 |l FAB01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-44586-1 |l FAW01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-44586-1 |l FHA01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-44586-1 |l FHI01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-44586-1 |l FHN01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-44586-1 |l FHR01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-44586-1 |l FKE01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-44586-1 |l FLA01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-44586-1 |l FRO01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-44586-1 |l FWS01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-44586-1 |l FWS02 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-44586-1 |l TUM01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-44586-1 |l UBY01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
Record in the Search Index
| DE-BY-FWS_katkey | 637329 |
|---|---|
| _version_ | 1824554577276436480 |
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV044023924 |
| classification_rvk | ZN 4192 |
| classification_tum | MAS 000 ELT 000 |
| collection | ZDB-2-ENG |
| ctrlnum | (ZDB-2-ENG)978-3-319-44586-1 (OCoLC)971244730 (DE-599)BVBBV044023924 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau |
| doi_str_mv | 10.1007/978-3-319-44586-1 |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03830nmm a2200841zcb4500</leader><controlfield tag="001">BV044023924</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20181009 </controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">170201s2017 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783319445861</subfield><subfield code="c">Online</subfield><subfield code="9">978-3-319-44586-1</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-3-319-44586-1</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-2-ENG)978-3-319-44586-1</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)971244730</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV044023924</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-859</subfield><subfield code="a">DE-860</subfield><subfield code="a">DE-91</subfield><subfield code="a">DE-1046</subfield><subfield code="a">DE-1043</subfield><subfield code="a">DE-Aug4</subfield><subfield code="a">DE-898</subfield><subfield code="a">DE-861</subfield><subfield code="a">DE-573</subfield><subfield code="a">DE-863</subfield><subfield code="a">DE-706</subfield><subfield code="a">DE-634</subfield><subfield code="a">DE-862</subfield><subfield code="a">DE-92</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">23</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4192</subfield><subfield code="0">(DE-625)157372:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">MAS 000</subfield><subfield code="2">stub</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ELT 000</subfield><subfield code="2">stub</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">3D Microelectronic Packaging</subfield><subfield code="b">from Fundamentals to Applications</subfield><subfield code="c">Editors Yan Li, Deepak Goyal</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Cham</subfield><subfield code="b">Springer</subfield><subfield code="c">[2017]</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (IX, 463 p. 331 illus., 253 illus. in color)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="1" ind2=" "><subfield code="a">Springer Series in Advanced Microelectronics</subfield><subfield code="v">57</subfield><subfield code="x">1437-0387</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Biotechnology</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic circuits</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nanotechnology</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Metals</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics and Microelectronics, Instrumentation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical and Electronic Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic Circuits and Devices</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microengineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nanotechnology and Microengineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Metallic Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Ingenieurwissenschaften</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Elektronisches Bauelement</subfield><subfield code="0">(DE-588)4014360-0</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Bestücken</subfield><subfield code="0">(DE-588)4223393-8</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Elektronisches Bauelement</subfield><subfield code="0">(DE-588)4014360-0</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Bestücken</subfield><subfield code="0">(DE-588)4223393-8</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Li, Yan</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Goyal, Deepak</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-3-319-44584-7</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druckausgabe</subfield><subfield code="z">978-3-319-44584-7</subfield></datafield><datafield tag="830" ind1=" " ind2="0"><subfield code="a">Springer Series in Advanced Microelectronics</subfield><subfield code="v">57</subfield><subfield code="w">(DE-604)BV012563021</subfield><subfield code="9">57</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-3-319-44586-1</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-ENG</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-ENG_2017</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-029431368</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-44586-1</subfield><subfield code="l">BTU01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-44586-1</subfield><subfield code="l">FAB01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-44586-1</subfield><subfield code="l">FAW01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-44586-1</subfield><subfield code="l">FHA01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-44586-1</subfield><subfield code="l">FHI01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-44586-1</subfield><subfield code="l">FHN01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-44586-1</subfield><subfield code="l">FHR01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-44586-1</subfield><subfield code="l">FKE01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-44586-1</subfield><subfield code="l">FLA01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-44586-1</subfield><subfield code="l">FRO01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-44586-1</subfield><subfield code="l">FWS01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-44586-1</subfield><subfield code="l">FWS02</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-44586-1</subfield><subfield code="l">TUM01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-44586-1</subfield><subfield code="l">UBY01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV044023924 |
| illustrated | Not Illustrated |
| indexdate | 2025-02-20T06:53:59Z |
| institution | BVB |
| isbn | 9783319445861 |
| issn | 1437-0387 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029431368 |
| oclc_num | 971244730 |
| open_access_boolean | |
| owner | DE-859 DE-860 DE-91 DE-BY-TUM DE-1046 DE-1043 DE-Aug4 DE-898 DE-BY-UBR DE-861 DE-573 DE-863 DE-BY-FWS DE-706 DE-634 DE-862 DE-BY-FWS DE-92 |
| owner_facet | DE-859 DE-860 DE-91 DE-BY-TUM DE-1046 DE-1043 DE-Aug4 DE-898 DE-BY-UBR DE-861 DE-573 DE-863 DE-BY-FWS DE-706 DE-634 DE-862 DE-BY-FWS DE-92 |
| physical | 1 Online-Ressource (IX, 463 p. 331 illus., 253 illus. in color) |
| psigel | ZDB-2-ENG ZDB-2-ENG_2017 |
| publishDate | 2017 |
| publishDateSearch | 2017 |
| publishDateSort | 2017 |
| publisher | Springer |
| record_format | marc |
| series | Springer Series in Advanced Microelectronics |
| series2 | Springer Series in Advanced Microelectronics |
| spellingShingle | 3D Microelectronic Packaging from Fundamentals to Applications Springer Series in Advanced Microelectronics Engineering Biotechnology Electronic circuits Nanotechnology Electronics Microelectronics Optical materials Electronic materials Metals Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Electronic Circuits and Devices Microengineering Nanotechnology and Microengineering Metallic Materials Ingenieurwissenschaften Elektronisches Bauelement (DE-588)4014360-0 gnd Bestücken (DE-588)4223393-8 gnd |
| subject_GND | (DE-588)4014360-0 (DE-588)4223393-8 |
| title | 3D Microelectronic Packaging from Fundamentals to Applications |
| title_auth | 3D Microelectronic Packaging from Fundamentals to Applications |
| title_exact_search | 3D Microelectronic Packaging from Fundamentals to Applications |
| title_full | 3D Microelectronic Packaging from Fundamentals to Applications Editors Yan Li, Deepak Goyal |
| title_fullStr | 3D Microelectronic Packaging from Fundamentals to Applications Editors Yan Li, Deepak Goyal |
| title_full_unstemmed | 3D Microelectronic Packaging from Fundamentals to Applications Editors Yan Li, Deepak Goyal |
| title_short | 3D Microelectronic Packaging |
| title_sort | 3d microelectronic packaging from fundamentals to applications |
| title_sub | from Fundamentals to Applications |
| topic | Engineering Biotechnology Electronic circuits Nanotechnology Electronics Microelectronics Optical materials Electronic materials Metals Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Electronic Circuits and Devices Microengineering Nanotechnology and Microengineering Metallic Materials Ingenieurwissenschaften Elektronisches Bauelement (DE-588)4014360-0 gnd Bestücken (DE-588)4223393-8 gnd |
| topic_facet | Engineering Biotechnology Electronic circuits Nanotechnology Electronics Microelectronics Optical materials Electronic materials Metals Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Electronic Circuits and Devices Microengineering Nanotechnology and Microengineering Metallic Materials Ingenieurwissenschaften Elektronisches Bauelement Bestücken |
| url | https://doi.org/10.1007/978-3-319-44586-1 |
| volume_link | (DE-604)BV012563021 |
| work_keys_str_mv | AT liyan 3dmicroelectronicpackagingfromfundamentalstoapplications AT goyaldeepak 3dmicroelectronicpackagingfromfundamentalstoapplications |