3D Microelectronic Packaging: from Fundamentals to Applications
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Cham
Springer
[2017]
|
| Schriftenreihe: | Springer Series in Advanced Microelectronics
57 |
| Schlagworte: | |
| Online-Zugang: | BTU01 FAB01 FAW01 FHA01 FHI01 FHN01 FHR01 FKE01 FLA01 FRO01 FWS01 FWS02 TUM01 UBY01 Volltext |
| Beschreibung: | 1 Online-Ressource (IX, 463 p. 331 illus., 253 illus. in color) |
| ISBN: | 9783319445861 |
| ISSN: | 1437-0387 |
| DOI: | 10.1007/978-3-319-44586-1 |
Internformat
MARC
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Datensatz im Suchindex
| DE-BY-FWS_katkey | 637329 |
|---|---|
| _version_ | 1806180758045327360 |
| any_adam_object | |
| building | Verbundindex |
| bvnumber | BV044023924 |
| classification_rvk | ZN 4192 |
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| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau |
| doi_str_mv | 10.1007/978-3-319-44586-1 |
| format | Electronic eBook |
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| id | DE-604.BV044023924 |
| illustrated | Not Illustrated |
| indexdate | 2024-08-01T12:29:59Z |
| institution | BVB |
| isbn | 9783319445861 |
| issn | 1437-0387 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029431368 |
| oclc_num | 971244730 |
| open_access_boolean | |
| owner | DE-859 DE-860 DE-91 DE-BY-TUM DE-1046 DE-1043 DE-Aug4 DE-898 DE-BY-UBR DE-861 DE-573 DE-863 DE-BY-FWS DE-706 DE-634 DE-862 DE-BY-FWS DE-92 |
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| physical | 1 Online-Ressource (IX, 463 p. 331 illus., 253 illus. in color) |
| psigel | ZDB-2-ENG ZDB-2-ENG_2017 |
| publishDate | 2017 |
| publishDateSearch | 2017 |
| publishDateSort | 2017 |
| publisher | Springer |
| record_format | marc |
| series | Springer Series in Advanced Microelectronics |
| series2 | Springer Series in Advanced Microelectronics |
| spellingShingle | 3D Microelectronic Packaging from Fundamentals to Applications Springer Series in Advanced Microelectronics Engineering Biotechnology Electronic circuits Nanotechnology Electronics Microelectronics Optical materials Electronic materials Metals Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Electronic Circuits and Devices Microengineering Nanotechnology and Microengineering Metallic Materials Ingenieurwissenschaften Elektronisches Bauelement (DE-588)4014360-0 gnd Bestücken (DE-588)4223393-8 gnd |
| subject_GND | (DE-588)4014360-0 (DE-588)4223393-8 |
| title | 3D Microelectronic Packaging from Fundamentals to Applications |
| title_auth | 3D Microelectronic Packaging from Fundamentals to Applications |
| title_exact_search | 3D Microelectronic Packaging from Fundamentals to Applications |
| title_full | 3D Microelectronic Packaging from Fundamentals to Applications Editors Yan Li, Deepak Goyal |
| title_fullStr | 3D Microelectronic Packaging from Fundamentals to Applications Editors Yan Li, Deepak Goyal |
| title_full_unstemmed | 3D Microelectronic Packaging from Fundamentals to Applications Editors Yan Li, Deepak Goyal |
| title_short | 3D Microelectronic Packaging |
| title_sort | 3d microelectronic packaging from fundamentals to applications |
| title_sub | from Fundamentals to Applications |
| topic | Engineering Biotechnology Electronic circuits Nanotechnology Electronics Microelectronics Optical materials Electronic materials Metals Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Electronic Circuits and Devices Microengineering Nanotechnology and Microengineering Metallic Materials Ingenieurwissenschaften Elektronisches Bauelement (DE-588)4014360-0 gnd Bestücken (DE-588)4223393-8 gnd |
| topic_facet | Engineering Biotechnology Electronic circuits Nanotechnology Electronics Microelectronics Optical materials Electronic materials Metals Electronics and Microelectronics, Instrumentation Optical and Electronic Materials Electronic Circuits and Devices Microengineering Nanotechnology and Microengineering Metallic Materials Ingenieurwissenschaften Elektronisches Bauelement Bestücken |
| url | https://doi.org/10.1007/978-3-319-44586-1 |
| volume_link | (DE-604)BV012563021 |
| work_keys_str_mv | AT liyan 3dmicroelectronicpackagingfromfundamentalstoapplications AT goyaldeepak 3dmicroelectronicpackagingfromfundamentalstoapplications |