APA (7th ed.) Citation

(2017). 3D Microelectronic Packaging: From Fundamentals to Applications. Springer. https://doi.org/10.1007/978-3-319-44586-1

Chicago Style (17th ed.) Citation

3D Microelectronic Packaging: From Fundamentals to Applications. Cham: Springer, 2017. https://doi.org/10.1007/978-3-319-44586-1.

MLA (9th ed.) Citation

3D Microelectronic Packaging: From Fundamentals to Applications. Springer, 2017. https://doi.org/10.1007/978-3-319-44586-1.