Holdings: Materials for advanced packaging

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Bibliographic Details
Other Authors:	Lu, Daniel (Editor), Wong, C.P (Editor)
Format:	Electronic eBook
Language:	English
Published:	Cham Springer 2017
Edition:	Second edition
Subjects:	Engineering Nanotechnology Electronics Microelectronics Electronic circuits Optical materials Electronic materials Metals Electronics and Microelectronics, Instrumentation Nanotechnology and Microengineering Metallic Materials Optical and Electronic Materials Circuits and Systems Ingenieurwissenschaften Verbindungstechnik Integrierte Schaltung Mikroelektronik Gehäuse Werkstoff
Online Access:	BTU01 FAB01 FAW01 FHA01 FHI01 FHN01 FHR01 FKE01 FLA01 FRO01 FWS01 FWS02 TUM01 UBY01 Volltext
Physical Description:	1 Online Ressource (xvi, 969 Seiten) Illustrationen, Diagramme
ISBN:	9783319450988
DOI:	10.1007/978-3-319-45098-8

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MARC


LEADER	00000nmm a2200000zc 4500
001	BV043934321
003	DE-604
005	20190110
007	cr\|uuu---uuuuu
008	161205s2017 \|\|\|\| o\|\|u\| \|\|\|\|\|\|eng d
020			\|a 9783319450988 \|c Online \|9 978-3-319-45098-8
024	7		\|a 10.1007/978-3-319-45098-8 \|2 doi
035			\|a (ZDB-2-ENG)978-3-319-45098-8
035			\|a (OCoLC)965689867
035			\|a (DE-599)BVBBV043934321
040			\|a DE-604 \|b ger \|e rda
041	0		\|a eng
049			\|a DE-859 \|a DE-1046 \|a DE-860 \|a DE-898 \|a DE-706 \|a DE-92 \|a DE-1043 \|a DE-91 \|a DE-Aug4 \|a DE-861 \|a DE-573 \|a DE-863 \|a DE-634 \|a DE-862
082	0		\|a 621.381 \|2 23
084			\|a ZN 4192 \|0 (DE-625)157372: \|2 rvk
084			\|a MAS 000 \|2 stub
084			\|a ELT 000 \|2 stub
245	1	0	\|a Materials for advanced packaging \|c Daniel Lu, C.P. Wong
250			\|a Second edition
264		1	\|a Cham \|b Springer \|c 2017
300			\|a 1 Online Ressource (xvi, 969 Seiten) \|b Illustrationen, Diagramme
336			\|b txt \|2 rdacontent
337			\|b c \|2 rdamedia
338			\|b cr \|2 rdacarrier
650		4	\|a Engineering
650		4	\|a Nanotechnology
650		4	\|a Electronics
650		4	\|a Microelectronics
650		4	\|a Electronic circuits
650		4	\|a Optical materials
650		4	\|a Electronic materials
650		4	\|a Metals
650		4	\|a Electronics and Microelectronics, Instrumentation
650		4	\|a Nanotechnology and Microengineering
650		4	\|a Metallic Materials
650		4	\|a Optical and Electronic Materials
650		4	\|a Circuits and Systems
650		4	\|a Ingenieurwissenschaften
650	0	7	\|a Verbindungstechnik \|0 (DE-588)4129183-9 \|2 gnd \|9 rswk-swf
650	0	7	\|a Integrierte Schaltung \|0 (DE-588)4027242-4 \|2 gnd \|9 rswk-swf
650	0	7	\|a Mikroelektronik \|0 (DE-588)4039207-7 \|2 gnd \|9 rswk-swf
650	0	7	\|a Gehäuse \|0 (DE-588)4156307-4 \|2 gnd \|9 rswk-swf
650	0	7	\|a Werkstoff \|0 (DE-588)4065579-9 \|2 gnd \|9 rswk-swf
689	0	0	\|a Mikroelektronik \|0 (DE-588)4039207-7 \|D s
689	0	1	\|a Werkstoff \|0 (DE-588)4065579-9 \|D s
689	0	2	\|a Integrierte Schaltung \|0 (DE-588)4027242-4 \|D s
689	0	3	\|a Verbindungstechnik \|0 (DE-588)4129183-9 \|D s
689	0	4	\|a Gehäuse \|0 (DE-588)4156307-4 \|D s
689	0		\|8 1\p \|5 DE-604
700	1		\|a Lu, Daniel \|4 edt
700	1		\|a Wong, C.P. \|4 edt
776	0	8	\|i Erscheint auch als \|n Druck-Ausgabe \|z 978-3-319-45097-1
856	4	0	\|u https://doi.org/10.1007/978-3-319-45098-8 \|x Verlag \|z URL des Erstveröffentlichers \|3 Volltext
912			\|a ZDB-2-ENG
940	1		\|q ZDB-2-ENG_2017
999			\|a oai:aleph.bib-bvb.de:BVB01-029343336
883	1		\|8 1\p \|a cgwrk \|d 20201028 \|q DE-101 \|u https://d-nb.info/provenance/plan#cgwrk
966	e		\|u https://doi.org/10.1007/978-3-319-45098-8 \|l BTU01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-45098-8 \|l FAB01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-45098-8 \|l FAW01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-45098-8 \|l FHA01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-45098-8 \|l FHI01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-45098-8 \|l FHN01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-45098-8 \|l FHR01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-45098-8 \|l FKE01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-45098-8 \|l FLA01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-45098-8 \|l FRO01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-45098-8 \|l FWS01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-45098-8 \|l FWS02 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-45098-8 \|l TUM01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-45098-8 \|l UBY01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext

Record in the Search Index

DE-BY-FWS_katkey	633223
_version_	1824554559354175488
any_adam_object
author2	Lu, Daniel Wong, C.P
author2_role	edt edt
author2_variant	d l dl c w cw
author_facet	Lu, Daniel Wong, C.P
building	Verbundindex
bvnumber	BV043934321
classification_rvk	ZN 4192
classification_tum	MAS 000 ELT 000
collection	ZDB-2-ENG
ctrlnum	(ZDB-2-ENG)978-3-319-45098-8 (OCoLC)965689867 (DE-599)BVBBV043934321
dewey-full	621.381
dewey-hundreds	600 - Technology (Applied sciences)
dewey-ones	621 - Applied physics
dewey-raw	621.381
dewey-search	621.381
dewey-sort	3621.381
dewey-tens	620 - Engineering and allied operations
discipline	Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau
doi_str_mv	10.1007/978-3-319-45098-8
edition	Second edition
format	Electronic eBook
fullrecord	<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03925nmm a2200877zc 4500</leader><controlfield tag="001">BV043934321</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20190110 </controlfield><controlfield tag="007">cr\|uuu---uuuuu</controlfield><controlfield tag="008">161205s2017 \|\|\|\| o\|\|u\| \|\|\|\|\|\|eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783319450988</subfield><subfield code="c">Online</subfield><subfield code="9">978-3-319-45098-8</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-3-319-45098-8</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-2-ENG)978-3-319-45098-8</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)965689867</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV043934321</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-859</subfield><subfield code="a">DE-1046</subfield><subfield code="a">DE-860</subfield><subfield code="a">DE-898</subfield><subfield code="a">DE-706</subfield><subfield code="a">DE-92</subfield><subfield code="a">DE-1043</subfield><subfield code="a">DE-91</subfield><subfield code="a">DE-Aug4</subfield><subfield code="a">DE-861</subfield><subfield code="a">DE-573</subfield><subfield code="a">DE-863</subfield><subfield code="a">DE-634</subfield><subfield code="a">DE-862</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">23</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4192</subfield><subfield code="0">(DE-625)157372:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">MAS 000</subfield><subfield code="2">stub</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ELT 000</subfield><subfield code="2">stub</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Materials for advanced packaging</subfield><subfield code="c">Daniel Lu, C.P. Wong</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">Second edition</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Cham</subfield><subfield code="b">Springer</subfield><subfield code="c">2017</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online Ressource (xvi, 969 Seiten)</subfield><subfield code="b">Illustrationen, Diagramme</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nanotechnology</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic circuits</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Metals</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics and Microelectronics, Instrumentation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nanotechnology and Microengineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Metallic Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical and Electronic Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Circuits and Systems</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Ingenieurwissenschaften</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Verbindungstechnik</subfield><subfield code="0">(DE-588)4129183-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Werkstoff</subfield><subfield code="0">(DE-588)4065579-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Werkstoff</subfield><subfield code="0">(DE-588)4065579-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="3"><subfield code="a">Verbindungstechnik</subfield><subfield code="0">(DE-588)4129183-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="4"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Lu, Daniel</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Wong, C.P.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-3-319-45097-1</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-ENG</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-ENG_2017</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-029343336</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">BTU01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FAB01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FAW01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FHA01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FHI01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FHN01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FHR01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FKE01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FLA01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FRO01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FWS01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FWS02</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">TUM01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">UBY01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection>
id	DE-604.BV043934321
illustrated	Not Illustrated
indexdate	2025-02-20T06:53:42Z
institution	BVB
isbn	9783319450988
language	English
oai_aleph_id	oai:aleph.bib-bvb.de:BVB01-029343336
oclc_num	965689867
open_access_boolean
owner	DE-859 DE-1046 DE-860 DE-898 DE-BY-UBR DE-706 DE-92 DE-1043 DE-91 DE-BY-TUM DE-Aug4 DE-861 DE-573 DE-863 DE-BY-FWS DE-634 DE-862 DE-BY-FWS
owner_facet	DE-859 DE-1046 DE-860 DE-898 DE-BY-UBR DE-706 DE-92 DE-1043 DE-91 DE-BY-TUM DE-Aug4 DE-861 DE-573 DE-863 DE-BY-FWS DE-634 DE-862 DE-BY-FWS
physical	1 Online Ressource (xvi, 969 Seiten) Illustrationen, Diagramme
psigel	ZDB-2-ENG ZDB-2-ENG_2017
publishDate	2017
publishDateSearch	2017
publishDateSort	2017
publisher	Springer
record_format	marc
spellingShingle	Materials for advanced packaging Engineering Nanotechnology Electronics Microelectronics Electronic circuits Optical materials Electronic materials Metals Electronics and Microelectronics, Instrumentation Nanotechnology and Microengineering Metallic Materials Optical and Electronic Materials Circuits and Systems Ingenieurwissenschaften Verbindungstechnik (DE-588)4129183-9 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Mikroelektronik (DE-588)4039207-7 gnd Gehäuse (DE-588)4156307-4 gnd Werkstoff (DE-588)4065579-9 gnd
subject_GND	(DE-588)4129183-9 (DE-588)4027242-4 (DE-588)4039207-7 (DE-588)4156307-4 (DE-588)4065579-9
title	Materials for advanced packaging
title_auth	Materials for advanced packaging
title_exact_search	Materials for advanced packaging
title_full	Materials for advanced packaging Daniel Lu, C.P. Wong
title_fullStr	Materials for advanced packaging Daniel Lu, C.P. Wong
title_full_unstemmed	Materials for advanced packaging Daniel Lu, C.P. Wong
title_short	Materials for advanced packaging
title_sort	materials for advanced packaging
topic	Engineering Nanotechnology Electronics Microelectronics Electronic circuits Optical materials Electronic materials Metals Electronics and Microelectronics, Instrumentation Nanotechnology and Microengineering Metallic Materials Optical and Electronic Materials Circuits and Systems Ingenieurwissenschaften Verbindungstechnik (DE-588)4129183-9 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Mikroelektronik (DE-588)4039207-7 gnd Gehäuse (DE-588)4156307-4 gnd Werkstoff (DE-588)4065579-9 gnd
topic_facet	Engineering Nanotechnology Electronics Microelectronics Electronic circuits Optical materials Electronic materials Metals Electronics and Microelectronics, Instrumentation Nanotechnology and Microengineering Metallic Materials Optical and Electronic Materials Circuits and Systems Ingenieurwissenschaften Verbindungstechnik Integrierte Schaltung Mikroelektronik Gehäuse Werkstoff
url	https://doi.org/10.1007/978-3-319-45098-8
work_keys_str_mv	AT ludaniel materialsforadvancedpackaging AT wongcp materialsforadvancedpackaging

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