Materials for advanced packaging:
Gespeichert in:
| Weitere Verfasser: | , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Cham
Springer
2017
|
| Ausgabe: | Second edition |
| Schlagworte: | |
| Online-Zugang: | BTU01 FAB01 FAW01 FHA01 FHI01 FHN01 FHR01 FKE01 FLA01 FRO01 FWS01 FWS02 TUM01 UBY01 URL des Erstveröffentlichers |
| Beschreibung: | 1 Online Ressource (xvi, 969 Seiten) Illustrationen, Diagramme |
| ISBN: | 9783319450988 |
| DOI: | 10.1007/978-3-319-45098-8 |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV043934321 | ||
| 003 | DE-604 | ||
| 005 | 20190110 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 161205s2017 |||| o||u| ||||||eng d | ||
| 020 | |a 9783319450988 |c Online |9 978-3-319-45098-8 | ||
| 024 | 7 | |a 10.1007/978-3-319-45098-8 |2 doi | |
| 035 | |a (ZDB-2-ENG)978-3-319-45098-8 | ||
| 035 | |a (OCoLC)965689867 | ||
| 035 | |a (DE-599)BVBBV043934321 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-859 |a DE-1046 |a DE-860 |a DE-898 |a DE-706 |a DE-92 |a DE-1043 |a DE-91 |a DE-Aug4 |a DE-861 |a DE-573 |a DE-863 |a DE-634 |a DE-862 | ||
| 082 | 0 | |a 621.381 |2 23 | |
| 084 | |a ZN 4192 |0 (DE-625)157372: |2 rvk | ||
| 084 | |a MAS 000 |2 stub | ||
| 084 | |a ELT 000 |2 stub | ||
| 245 | 1 | 0 | |a Materials for advanced packaging |c Daniel Lu, C.P. Wong |
| 250 | |a Second edition | ||
| 264 | 1 | |a Cham |b Springer |c 2017 | |
| 300 | |a 1 Online Ressource (xvi, 969 Seiten) |b Illustrationen, Diagramme | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 650 | 4 | |a Engineering | |
| 650 | 4 | |a Nanotechnology | |
| 650 | 4 | |a Electronics | |
| 650 | 4 | |a Microelectronics | |
| 650 | 4 | |a Electronic circuits | |
| 650 | 4 | |a Optical materials | |
| 650 | 4 | |a Electronic materials | |
| 650 | 4 | |a Metals | |
| 650 | 4 | |a Electronics and Microelectronics, Instrumentation | |
| 650 | 4 | |a Nanotechnology and Microengineering | |
| 650 | 4 | |a Metallic Materials | |
| 650 | 4 | |a Optical and Electronic Materials | |
| 650 | 4 | |a Circuits and Systems | |
| 650 | 4 | |a Ingenieurwissenschaften | |
| 650 | 0 | 7 | |a Verbindungstechnik |0 (DE-588)4129183-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Mikroelektronik |0 (DE-588)4039207-7 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Gehäuse |0 (DE-588)4156307-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Werkstoff |0 (DE-588)4065579-9 |2 gnd |9 rswk-swf |
| 689 | 0 | 0 | |a Mikroelektronik |0 (DE-588)4039207-7 |D s |
| 689 | 0 | 1 | |a Werkstoff |0 (DE-588)4065579-9 |D s |
| 689 | 0 | 2 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |D s |
| 689 | 0 | 3 | |a Verbindungstechnik |0 (DE-588)4129183-9 |D s |
| 689 | 0 | 4 | |a Gehäuse |0 (DE-588)4156307-4 |D s |
| 689 | 0 | |8 1\p |5 DE-604 | |
| 700 | 1 | |a Lu, Daniel |4 edt | |
| 700 | 1 | |a Wong, C.P. |4 edt | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |z 978-3-319-45097-1 |
| 856 | 4 | 0 | |u https://doi.org/10.1007/978-3-319-45098-8 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 912 | |a ZDB-2-ENG | ||
| 940 | 1 | |q ZDB-2-ENG_2017 | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-029343336 | ||
| 883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-45098-8 |l BTU01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-45098-8 |l FAB01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-45098-8 |l FAW01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-45098-8 |l FHA01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-45098-8 |l FHI01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-45098-8 |l FHN01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-45098-8 |l FHR01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-45098-8 |l FKE01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-45098-8 |l FLA01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-45098-8 |l FRO01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-45098-8 |l FWS01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-45098-8 |l FWS02 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-45098-8 |l TUM01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
| 966 | e | |u https://doi.org/10.1007/978-3-319-45098-8 |l UBY01 |p ZDB-2-ENG |x Verlag |3 Volltext | |
Datensatz im Suchindex
| DE-BY-FWS_katkey | 633223 |
|---|---|
| _version_ | 1824554559354175488 |
| any_adam_object | |
| author2 | Lu, Daniel Wong, C.P |
| author2_role | edt edt |
| author2_variant | d l dl c w cw |
| author_facet | Lu, Daniel Wong, C.P |
| building | Verbundindex |
| bvnumber | BV043934321 |
| classification_rvk | ZN 4192 |
| classification_tum | MAS 000 ELT 000 |
| collection | ZDB-2-ENG |
| ctrlnum | (ZDB-2-ENG)978-3-319-45098-8 (OCoLC)965689867 (DE-599)BVBBV043934321 |
| dewey-full | 621.381 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381 |
| dewey-search | 621.381 |
| dewey-sort | 3621.381 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik Elektrotechnik / Elektronik / Nachrichtentechnik Maschinenbau |
| doi_str_mv | 10.1007/978-3-319-45098-8 |
| edition | Second edition |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03925nmm a2200877zc 4500</leader><controlfield tag="001">BV043934321</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20190110 </controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">161205s2017 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783319450988</subfield><subfield code="c">Online</subfield><subfield code="9">978-3-319-45098-8</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-3-319-45098-8</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-2-ENG)978-3-319-45098-8</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)965689867</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV043934321</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-859</subfield><subfield code="a">DE-1046</subfield><subfield code="a">DE-860</subfield><subfield code="a">DE-898</subfield><subfield code="a">DE-706</subfield><subfield code="a">DE-92</subfield><subfield code="a">DE-1043</subfield><subfield code="a">DE-91</subfield><subfield code="a">DE-Aug4</subfield><subfield code="a">DE-861</subfield><subfield code="a">DE-573</subfield><subfield code="a">DE-863</subfield><subfield code="a">DE-634</subfield><subfield code="a">DE-862</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.381</subfield><subfield code="2">23</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 4192</subfield><subfield code="0">(DE-625)157372:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">MAS 000</subfield><subfield code="2">stub</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ELT 000</subfield><subfield code="2">stub</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Materials for advanced packaging</subfield><subfield code="c">Daniel Lu, C.P. Wong</subfield></datafield><datafield tag="250" ind1=" " ind2=" "><subfield code="a">Second edition</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Cham</subfield><subfield code="b">Springer</subfield><subfield code="c">2017</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online Ressource (xvi, 969 Seiten)</subfield><subfield code="b">Illustrationen, Diagramme</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nanotechnology</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic circuits</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Metals</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronics and Microelectronics, Instrumentation</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Nanotechnology and Microengineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Metallic Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical and Electronic Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Circuits and Systems</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Ingenieurwissenschaften</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Verbindungstechnik</subfield><subfield code="0">(DE-588)4129183-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Werkstoff</subfield><subfield code="0">(DE-588)4065579-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Mikroelektronik</subfield><subfield code="0">(DE-588)4039207-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Werkstoff</subfield><subfield code="0">(DE-588)4065579-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="3"><subfield code="a">Verbindungstechnik</subfield><subfield code="0">(DE-588)4129183-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="4"><subfield code="a">Gehäuse</subfield><subfield code="0">(DE-588)4156307-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Lu, Daniel</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Wong, C.P.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="z">978-3-319-45097-1</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-ENG</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-ENG_2017</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-029343336</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">BTU01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FAB01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FAW01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FHA01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FHI01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FHN01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FHR01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FKE01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FLA01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FRO01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FWS01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">FWS02</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">TUM01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-45098-8</subfield><subfield code="l">UBY01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV043934321 |
| illustrated | Not Illustrated |
| indexdate | 2025-02-20T06:53:42Z |
| institution | BVB |
| isbn | 9783319450988 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029343336 |
| oclc_num | 965689867 |
| open_access_boolean | |
| owner | DE-859 DE-1046 DE-860 DE-898 DE-BY-UBR DE-706 DE-92 DE-1043 DE-91 DE-BY-TUM DE-Aug4 DE-861 DE-573 DE-863 DE-BY-FWS DE-634 DE-862 DE-BY-FWS |
| owner_facet | DE-859 DE-1046 DE-860 DE-898 DE-BY-UBR DE-706 DE-92 DE-1043 DE-91 DE-BY-TUM DE-Aug4 DE-861 DE-573 DE-863 DE-BY-FWS DE-634 DE-862 DE-BY-FWS |
| physical | 1 Online Ressource (xvi, 969 Seiten) Illustrationen, Diagramme |
| psigel | ZDB-2-ENG ZDB-2-ENG_2017 |
| publishDate | 2017 |
| publishDateSearch | 2017 |
| publishDateSort | 2017 |
| publisher | Springer |
| record_format | marc |
| spellingShingle | Materials for advanced packaging Engineering Nanotechnology Electronics Microelectronics Electronic circuits Optical materials Electronic materials Metals Electronics and Microelectronics, Instrumentation Nanotechnology and Microengineering Metallic Materials Optical and Electronic Materials Circuits and Systems Ingenieurwissenschaften Verbindungstechnik (DE-588)4129183-9 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Mikroelektronik (DE-588)4039207-7 gnd Gehäuse (DE-588)4156307-4 gnd Werkstoff (DE-588)4065579-9 gnd |
| subject_GND | (DE-588)4129183-9 (DE-588)4027242-4 (DE-588)4039207-7 (DE-588)4156307-4 (DE-588)4065579-9 |
| title | Materials for advanced packaging |
| title_auth | Materials for advanced packaging |
| title_exact_search | Materials for advanced packaging |
| title_full | Materials for advanced packaging Daniel Lu, C.P. Wong |
| title_fullStr | Materials for advanced packaging Daniel Lu, C.P. Wong |
| title_full_unstemmed | Materials for advanced packaging Daniel Lu, C.P. Wong |
| title_short | Materials for advanced packaging |
| title_sort | materials for advanced packaging |
| topic | Engineering Nanotechnology Electronics Microelectronics Electronic circuits Optical materials Electronic materials Metals Electronics and Microelectronics, Instrumentation Nanotechnology and Microengineering Metallic Materials Optical and Electronic Materials Circuits and Systems Ingenieurwissenschaften Verbindungstechnik (DE-588)4129183-9 gnd Integrierte Schaltung (DE-588)4027242-4 gnd Mikroelektronik (DE-588)4039207-7 gnd Gehäuse (DE-588)4156307-4 gnd Werkstoff (DE-588)4065579-9 gnd |
| topic_facet | Engineering Nanotechnology Electronics Microelectronics Electronic circuits Optical materials Electronic materials Metals Electronics and Microelectronics, Instrumentation Nanotechnology and Microengineering Metallic Materials Optical and Electronic Materials Circuits and Systems Ingenieurwissenschaften Verbindungstechnik Integrierte Schaltung Mikroelektronik Gehäuse Werkstoff |
| url | https://doi.org/10.1007/978-3-319-45098-8 |
| work_keys_str_mv | AT ludaniel materialsforadvancedpackaging AT wongcp materialsforadvancedpackaging |