Mitigating tin whisker risks: theory and practice
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Hoboken, New Jersey
John Wiley & Sons, Inc.
[2016]
|
| Schlagworte: | |
| Online-Zugang: | FRO01 UBG01 Volltext |
| Beschreibung: | 1 online resource |
| ISBN: | 1119011949 1119011965 9781119011941 9781119011965 |
Internformat
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| 100 | 1 | |a Kato, Takahiko |4 aut | |
| 245 | 1 | 0 | |a Mitigating tin whisker risks |b theory and practice |c Takahiko Kato, Carol A. Handwerker, Jasbir Bath |
| 264 | 1 | |a Hoboken, New Jersey |b John Wiley & Sons, Inc. |c [2016] | |
| 300 | |a 1 online resource | ||
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| 505 | 8 | |a Includes bibliographical references and index | |
| 505 | 8 | |a TITLE PAGE; COPYRIGHT; TABLE OF CONTENTS; LIST OF CONTRIBUTORS; INTRODUCTION; 1 A PREDICTIVE MODEL FOR WHISKER FORMATION BASED ON LOCAL MICROSTRUCTURE AND GRAIN BOUNDARY PROPERTIES; 1.1 INTRODUCTION; 1.2 CHARACTERISTICS OF WHISKER AND HILLOCK GROWTH FROM SURFACE GRAINS; 1.3 SUMMARY AND RECOMMENDATIONS; ACKNOWLEDGMENTS; REFERENCES; 2 MAJOR DRIVING FORCES AND GROWTH MECHANISMS FOR TIN WHISKERS; 2.1 INTRODUCTION; 2.2 UNDERSTANDING THE MECHANISMS BEHIND IMC-INDUCED STRESS EVOLUTION AND WHISKER GROWTH; 2.3 RELATION OF STRESS TO WHISKER GROWTH; 2.4 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES | |
| 505 | 8 | |a 3 APPROACHES OF MODELING AND SIMULATION OF STRESSES IN Sn FINISHES3.1 INTRODUCTION; 3.2 CONSTITUTIVE MODEL; 3.3 STRAIN ENERGY DENSITY; 3.4 GRAIN ORIENTATION; 3.5 FINITE ELEMENT MODELING OF TRIPLE-GRAIN JUNCTION; 3.6 FINITE ELEMENT MODELING OF S FINISH WITH MULTIPLE GRAINS; REFERENCES; 4 PROPERTIES AND WHISKER FORMATION BEHAVIOR OF TIN-BASED ALLOY FINISHES; 4.1 INTRODUCTION; 4.2 GENERAL PROPERTIES OF TIN-BASED ALLOY FINISHES (ASAO NISHIMURA); 4.3 EFFECT OF ALLOYING ELEMENTS ON WHISKER FORMATION AND MITIGATION (ASAO NISHIMURA) | |
| 505 | 8 | |a 4.4 DEPENDENCE OF WHISKER PROPENSITY OF MATTE TIN-COPPER FINISH ON COPPER LEAD-FRAME MATERIAL (TAKAHIKO KATO)4.5 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES; 5 CHARACTERIZATION TECHNIQUES FOR FILM CHARACTERISTICS; 5.1 INTRODUCTION; 5.2 TEM (TAKAHIKO KATO); 5.3 SEM (YUKIKO MIZUGUCHI); 5.4 EBSD (YUKIKO MIZUGUCHI); 5.5 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES; 6 OVERVIEW OF WHISKER-MITIGATION STRATEGIES FOR HIGH-RELIABILITY ELECTRONIC SYSTEMS; 6.1 OVERVIEW OF TIN WHISKER RISK MANAGEMENT; 6.2 DETAILS OF TIN WHISKER MITIGATION; 6.3 MANAGING TIN WHISKER RISKS AT THE SYSTEM LEVEL | |
| 505 | 8 | |a 6.4 CONTROL OF SUBCONTRACTORS AND SUPPLIERS6.5 CONCLUSIONS; REFERENCES; 7 QUANTITATIVE ASSESSMENT OF STRESS RELAXATION IN TIN FILMS BY THE FORMATION OF WHISKERS, HILLOCKS, AND OTHER SURFACE DEFECTS; 7.1 INTRODUCTION; 7.2 SURFACE-DEFECT CLASSIFICATION AND MEASUREMENT METHOD; 7.3 PREPARATION AND STORAGE CONDITIONS OF ELECTROPLATED FILMS ON SUBSTRATES; 7.4 SURFACE DEFECT FORMATION AS A FUNCTION OF TIN FILM TYPE, SUBSTRATE, AND STORAGE CONDITION; 7.5 CONCLUSIONS; APPENDIX; ACKNOWLEDGMENTS; REFERENCES; 8 BOARD REFLOW PROCESSES AND THEIR EFFECT ON TIN WHISKER GROWTH; 8.1 INTRODUCTION | |
| 505 | 8 | |a 8.2 THE EFFECT OF REFLOWED COMPONENTS ON TIN WHISKER GROWTH IN TERMS OF GRAIN SIZE AND GRAIN ORIENTATION DISTRIBUTION8.3 REFLOW PROFILES AND THE EFFECT ON TIN WHISKER GROWTH; 8.4 INFLUENCE OF REFLOW ATMOSPHERE AND FLUX ON TIN WHISKER GROWTH; 8.5 EFFECT OF SOLDER PASTE VOLUME ON COMPONENT TIN WHISKER GROWTH DURING ELECTRONICS ASSEMBLY; 8.6 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES; 9 MECHANICALLY INDUCED TIN WHISKERS; 9.1 INTRODUCTION; 9.2 OVERVIEW OF MECHANICALLY INDUCED TIN WHISKER FORMATION; 9.3 THEORY; 9.4 CASE STUDIES; 9.5 CONCLUSIONS; REFERENCES; INDEX; END USER LICENSE AGREEMENT | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Technical & Manufacturing Industries & Trades |2 bisacsh | |
| 650 | 7 | |a Failure analysis (Engineering) |2 fast | |
| 650 | 7 | |a Solder and soldering |2 fast | |
| 650 | 4 | |a Solder and soldering | |
| 650 | 4 | |a Failure analysis (Engineering) | |
| 700 | 1 | |a Handwerker, Carol A. |4 aut | |
| 700 | 1 | |a Bath, Jasbir |4 aut | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druckausgabe |z 978-0-470-90723-8 |
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Datensatz im Suchindex
| _version_ | 1804176747855347712 |
|---|---|
| any_adam_object | |
| author | Kato, Takahiko Handwerker, Carol A. Bath, Jasbir |
| author_facet | Kato, Takahiko Handwerker, Carol A. Bath, Jasbir |
| author_role | aut aut aut |
| author_sort | Kato, Takahiko |
| author_variant | t k tk c a h ca cah j b jb |
| building | Verbundindex |
| bvnumber | BV043864491 |
| collection | ZDB-35-WIC |
| contents | Includes bibliographical references and index TITLE PAGE; COPYRIGHT; TABLE OF CONTENTS; LIST OF CONTRIBUTORS; INTRODUCTION; 1 A PREDICTIVE MODEL FOR WHISKER FORMATION BASED ON LOCAL MICROSTRUCTURE AND GRAIN BOUNDARY PROPERTIES; 1.1 INTRODUCTION; 1.2 CHARACTERISTICS OF WHISKER AND HILLOCK GROWTH FROM SURFACE GRAINS; 1.3 SUMMARY AND RECOMMENDATIONS; ACKNOWLEDGMENTS; REFERENCES; 2 MAJOR DRIVING FORCES AND GROWTH MECHANISMS FOR TIN WHISKERS; 2.1 INTRODUCTION; 2.2 UNDERSTANDING THE MECHANISMS BEHIND IMC-INDUCED STRESS EVOLUTION AND WHISKER GROWTH; 2.3 RELATION OF STRESS TO WHISKER GROWTH; 2.4 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES 3 APPROACHES OF MODELING AND SIMULATION OF STRESSES IN Sn FINISHES3.1 INTRODUCTION; 3.2 CONSTITUTIVE MODEL; 3.3 STRAIN ENERGY DENSITY; 3.4 GRAIN ORIENTATION; 3.5 FINITE ELEMENT MODELING OF TRIPLE-GRAIN JUNCTION; 3.6 FINITE ELEMENT MODELING OF S FINISH WITH MULTIPLE GRAINS; REFERENCES; 4 PROPERTIES AND WHISKER FORMATION BEHAVIOR OF TIN-BASED ALLOY FINISHES; 4.1 INTRODUCTION; 4.2 GENERAL PROPERTIES OF TIN-BASED ALLOY FINISHES (ASAO NISHIMURA); 4.3 EFFECT OF ALLOYING ELEMENTS ON WHISKER FORMATION AND MITIGATION (ASAO NISHIMURA) 4.4 DEPENDENCE OF WHISKER PROPENSITY OF MATTE TIN-COPPER FINISH ON COPPER LEAD-FRAME MATERIAL (TAKAHIKO KATO)4.5 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES; 5 CHARACTERIZATION TECHNIQUES FOR FILM CHARACTERISTICS; 5.1 INTRODUCTION; 5.2 TEM (TAKAHIKO KATO); 5.3 SEM (YUKIKO MIZUGUCHI); 5.4 EBSD (YUKIKO MIZUGUCHI); 5.5 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES; 6 OVERVIEW OF WHISKER-MITIGATION STRATEGIES FOR HIGH-RELIABILITY ELECTRONIC SYSTEMS; 6.1 OVERVIEW OF TIN WHISKER RISK MANAGEMENT; 6.2 DETAILS OF TIN WHISKER MITIGATION; 6.3 MANAGING TIN WHISKER RISKS AT THE SYSTEM LEVEL 6.4 CONTROL OF SUBCONTRACTORS AND SUPPLIERS6.5 CONCLUSIONS; REFERENCES; 7 QUANTITATIVE ASSESSMENT OF STRESS RELAXATION IN TIN FILMS BY THE FORMATION OF WHISKERS, HILLOCKS, AND OTHER SURFACE DEFECTS; 7.1 INTRODUCTION; 7.2 SURFACE-DEFECT CLASSIFICATION AND MEASUREMENT METHOD; 7.3 PREPARATION AND STORAGE CONDITIONS OF ELECTROPLATED FILMS ON SUBSTRATES; 7.4 SURFACE DEFECT FORMATION AS A FUNCTION OF TIN FILM TYPE, SUBSTRATE, AND STORAGE CONDITION; 7.5 CONCLUSIONS; APPENDIX; ACKNOWLEDGMENTS; REFERENCES; 8 BOARD REFLOW PROCESSES AND THEIR EFFECT ON TIN WHISKER GROWTH; 8.1 INTRODUCTION 8.2 THE EFFECT OF REFLOWED COMPONENTS ON TIN WHISKER GROWTH IN TERMS OF GRAIN SIZE AND GRAIN ORIENTATION DISTRIBUTION8.3 REFLOW PROFILES AND THE EFFECT ON TIN WHISKER GROWTH; 8.4 INFLUENCE OF REFLOW ATMOSPHERE AND FLUX ON TIN WHISKER GROWTH; 8.5 EFFECT OF SOLDER PASTE VOLUME ON COMPONENT TIN WHISKER GROWTH DURING ELECTRONICS ASSEMBLY; 8.6 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES; 9 MECHANICALLY INDUCED TIN WHISKERS; 9.1 INTRODUCTION; 9.2 OVERVIEW OF MECHANICALLY INDUCED TIN WHISKER FORMATION; 9.3 THEORY; 9.4 CASE STUDIES; 9.5 CONCLUSIONS; REFERENCES; INDEX; END USER LICENSE AGREEMENT |
| ctrlnum | (ZDB-35-WIC)ocn948690683 (OCoLC)951133843 (DE-599)BVBBV043864491 |
| dewey-full | 671.5/6 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 671 - Metalworking & primary metal products |
| dewey-raw | 671.5/6 |
| dewey-search | 671.5/6 |
| dewey-sort | 3671.5 16 |
| dewey-tens | 670 - Manufacturing |
| discipline | Werkstoffwissenschaften / Fertigungstechnik |
| format | Electronic eBook |
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| id | DE-604.BV043864491 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T07:37:06Z |
| institution | BVB |
| isbn | 1119011949 1119011965 9781119011941 9781119011965 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029274519 |
| oclc_num | 948690683 951133843 |
| open_access_boolean | |
| owner | DE-861 |
| owner_facet | DE-861 |
| physical | 1 online resource |
| psigel | ZDB-35-WIC UBG_PDA_WIC ZDB-35-WIC FRO_PDA_WIC ZDB-35-WIC UBG_PDA_WIC |
| publishDate | 2016 |
| publishDateSearch | 2016 |
| publishDateSort | 2016 |
| publisher | John Wiley & Sons, Inc. |
| record_format | marc |
| spelling | Kato, Takahiko aut Mitigating tin whisker risks theory and practice Takahiko Kato, Carol A. Handwerker, Jasbir Bath Hoboken, New Jersey John Wiley & Sons, Inc. [2016] 1 online resource txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index TITLE PAGE; COPYRIGHT; TABLE OF CONTENTS; LIST OF CONTRIBUTORS; INTRODUCTION; 1 A PREDICTIVE MODEL FOR WHISKER FORMATION BASED ON LOCAL MICROSTRUCTURE AND GRAIN BOUNDARY PROPERTIES; 1.1 INTRODUCTION; 1.2 CHARACTERISTICS OF WHISKER AND HILLOCK GROWTH FROM SURFACE GRAINS; 1.3 SUMMARY AND RECOMMENDATIONS; ACKNOWLEDGMENTS; REFERENCES; 2 MAJOR DRIVING FORCES AND GROWTH MECHANISMS FOR TIN WHISKERS; 2.1 INTRODUCTION; 2.2 UNDERSTANDING THE MECHANISMS BEHIND IMC-INDUCED STRESS EVOLUTION AND WHISKER GROWTH; 2.3 RELATION OF STRESS TO WHISKER GROWTH; 2.4 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES 3 APPROACHES OF MODELING AND SIMULATION OF STRESSES IN Sn FINISHES3.1 INTRODUCTION; 3.2 CONSTITUTIVE MODEL; 3.3 STRAIN ENERGY DENSITY; 3.4 GRAIN ORIENTATION; 3.5 FINITE ELEMENT MODELING OF TRIPLE-GRAIN JUNCTION; 3.6 FINITE ELEMENT MODELING OF S FINISH WITH MULTIPLE GRAINS; REFERENCES; 4 PROPERTIES AND WHISKER FORMATION BEHAVIOR OF TIN-BASED ALLOY FINISHES; 4.1 INTRODUCTION; 4.2 GENERAL PROPERTIES OF TIN-BASED ALLOY FINISHES (ASAO NISHIMURA); 4.3 EFFECT OF ALLOYING ELEMENTS ON WHISKER FORMATION AND MITIGATION (ASAO NISHIMURA) 4.4 DEPENDENCE OF WHISKER PROPENSITY OF MATTE TIN-COPPER FINISH ON COPPER LEAD-FRAME MATERIAL (TAKAHIKO KATO)4.5 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES; 5 CHARACTERIZATION TECHNIQUES FOR FILM CHARACTERISTICS; 5.1 INTRODUCTION; 5.2 TEM (TAKAHIKO KATO); 5.3 SEM (YUKIKO MIZUGUCHI); 5.4 EBSD (YUKIKO MIZUGUCHI); 5.5 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES; 6 OVERVIEW OF WHISKER-MITIGATION STRATEGIES FOR HIGH-RELIABILITY ELECTRONIC SYSTEMS; 6.1 OVERVIEW OF TIN WHISKER RISK MANAGEMENT; 6.2 DETAILS OF TIN WHISKER MITIGATION; 6.3 MANAGING TIN WHISKER RISKS AT THE SYSTEM LEVEL 6.4 CONTROL OF SUBCONTRACTORS AND SUPPLIERS6.5 CONCLUSIONS; REFERENCES; 7 QUANTITATIVE ASSESSMENT OF STRESS RELAXATION IN TIN FILMS BY THE FORMATION OF WHISKERS, HILLOCKS, AND OTHER SURFACE DEFECTS; 7.1 INTRODUCTION; 7.2 SURFACE-DEFECT CLASSIFICATION AND MEASUREMENT METHOD; 7.3 PREPARATION AND STORAGE CONDITIONS OF ELECTROPLATED FILMS ON SUBSTRATES; 7.4 SURFACE DEFECT FORMATION AS A FUNCTION OF TIN FILM TYPE, SUBSTRATE, AND STORAGE CONDITION; 7.5 CONCLUSIONS; APPENDIX; ACKNOWLEDGMENTS; REFERENCES; 8 BOARD REFLOW PROCESSES AND THEIR EFFECT ON TIN WHISKER GROWTH; 8.1 INTRODUCTION 8.2 THE EFFECT OF REFLOWED COMPONENTS ON TIN WHISKER GROWTH IN TERMS OF GRAIN SIZE AND GRAIN ORIENTATION DISTRIBUTION8.3 REFLOW PROFILES AND THE EFFECT ON TIN WHISKER GROWTH; 8.4 INFLUENCE OF REFLOW ATMOSPHERE AND FLUX ON TIN WHISKER GROWTH; 8.5 EFFECT OF SOLDER PASTE VOLUME ON COMPONENT TIN WHISKER GROWTH DURING ELECTRONICS ASSEMBLY; 8.6 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES; 9 MECHANICALLY INDUCED TIN WHISKERS; 9.1 INTRODUCTION; 9.2 OVERVIEW OF MECHANICALLY INDUCED TIN WHISKER FORMATION; 9.3 THEORY; 9.4 CASE STUDIES; 9.5 CONCLUSIONS; REFERENCES; INDEX; END USER LICENSE AGREEMENT TECHNOLOGY & ENGINEERING / Technical & Manufacturing Industries & Trades bisacsh Failure analysis (Engineering) fast Solder and soldering fast Solder and soldering Failure analysis (Engineering) Handwerker, Carol A. aut Bath, Jasbir aut Erscheint auch als Druckausgabe 978-0-470-90723-8 https://onlinelibrary.wiley.com/doi/book/10.1002/9781119011965 Verlag URL des Erstveröffentlichers Volltext |
| spellingShingle | Kato, Takahiko Handwerker, Carol A. Bath, Jasbir Mitigating tin whisker risks theory and practice Includes bibliographical references and index TITLE PAGE; COPYRIGHT; TABLE OF CONTENTS; LIST OF CONTRIBUTORS; INTRODUCTION; 1 A PREDICTIVE MODEL FOR WHISKER FORMATION BASED ON LOCAL MICROSTRUCTURE AND GRAIN BOUNDARY PROPERTIES; 1.1 INTRODUCTION; 1.2 CHARACTERISTICS OF WHISKER AND HILLOCK GROWTH FROM SURFACE GRAINS; 1.3 SUMMARY AND RECOMMENDATIONS; ACKNOWLEDGMENTS; REFERENCES; 2 MAJOR DRIVING FORCES AND GROWTH MECHANISMS FOR TIN WHISKERS; 2.1 INTRODUCTION; 2.2 UNDERSTANDING THE MECHANISMS BEHIND IMC-INDUCED STRESS EVOLUTION AND WHISKER GROWTH; 2.3 RELATION OF STRESS TO WHISKER GROWTH; 2.4 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES 3 APPROACHES OF MODELING AND SIMULATION OF STRESSES IN Sn FINISHES3.1 INTRODUCTION; 3.2 CONSTITUTIVE MODEL; 3.3 STRAIN ENERGY DENSITY; 3.4 GRAIN ORIENTATION; 3.5 FINITE ELEMENT MODELING OF TRIPLE-GRAIN JUNCTION; 3.6 FINITE ELEMENT MODELING OF S FINISH WITH MULTIPLE GRAINS; REFERENCES; 4 PROPERTIES AND WHISKER FORMATION BEHAVIOR OF TIN-BASED ALLOY FINISHES; 4.1 INTRODUCTION; 4.2 GENERAL PROPERTIES OF TIN-BASED ALLOY FINISHES (ASAO NISHIMURA); 4.3 EFFECT OF ALLOYING ELEMENTS ON WHISKER FORMATION AND MITIGATION (ASAO NISHIMURA) 4.4 DEPENDENCE OF WHISKER PROPENSITY OF MATTE TIN-COPPER FINISH ON COPPER LEAD-FRAME MATERIAL (TAKAHIKO KATO)4.5 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES; 5 CHARACTERIZATION TECHNIQUES FOR FILM CHARACTERISTICS; 5.1 INTRODUCTION; 5.2 TEM (TAKAHIKO KATO); 5.3 SEM (YUKIKO MIZUGUCHI); 5.4 EBSD (YUKIKO MIZUGUCHI); 5.5 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES; 6 OVERVIEW OF WHISKER-MITIGATION STRATEGIES FOR HIGH-RELIABILITY ELECTRONIC SYSTEMS; 6.1 OVERVIEW OF TIN WHISKER RISK MANAGEMENT; 6.2 DETAILS OF TIN WHISKER MITIGATION; 6.3 MANAGING TIN WHISKER RISKS AT THE SYSTEM LEVEL 6.4 CONTROL OF SUBCONTRACTORS AND SUPPLIERS6.5 CONCLUSIONS; REFERENCES; 7 QUANTITATIVE ASSESSMENT OF STRESS RELAXATION IN TIN FILMS BY THE FORMATION OF WHISKERS, HILLOCKS, AND OTHER SURFACE DEFECTS; 7.1 INTRODUCTION; 7.2 SURFACE-DEFECT CLASSIFICATION AND MEASUREMENT METHOD; 7.3 PREPARATION AND STORAGE CONDITIONS OF ELECTROPLATED FILMS ON SUBSTRATES; 7.4 SURFACE DEFECT FORMATION AS A FUNCTION OF TIN FILM TYPE, SUBSTRATE, AND STORAGE CONDITION; 7.5 CONCLUSIONS; APPENDIX; ACKNOWLEDGMENTS; REFERENCES; 8 BOARD REFLOW PROCESSES AND THEIR EFFECT ON TIN WHISKER GROWTH; 8.1 INTRODUCTION 8.2 THE EFFECT OF REFLOWED COMPONENTS ON TIN WHISKER GROWTH IN TERMS OF GRAIN SIZE AND GRAIN ORIENTATION DISTRIBUTION8.3 REFLOW PROFILES AND THE EFFECT ON TIN WHISKER GROWTH; 8.4 INFLUENCE OF REFLOW ATMOSPHERE AND FLUX ON TIN WHISKER GROWTH; 8.5 EFFECT OF SOLDER PASTE VOLUME ON COMPONENT TIN WHISKER GROWTH DURING ELECTRONICS ASSEMBLY; 8.6 CONCLUSIONS; ACKNOWLEDGMENTS; REFERENCES; 9 MECHANICALLY INDUCED TIN WHISKERS; 9.1 INTRODUCTION; 9.2 OVERVIEW OF MECHANICALLY INDUCED TIN WHISKER FORMATION; 9.3 THEORY; 9.4 CASE STUDIES; 9.5 CONCLUSIONS; REFERENCES; INDEX; END USER LICENSE AGREEMENT TECHNOLOGY & ENGINEERING / Technical & Manufacturing Industries & Trades bisacsh Failure analysis (Engineering) fast Solder and soldering fast Solder and soldering Failure analysis (Engineering) |
| title | Mitigating tin whisker risks theory and practice |
| title_auth | Mitigating tin whisker risks theory and practice |
| title_exact_search | Mitigating tin whisker risks theory and practice |
| title_full | Mitigating tin whisker risks theory and practice Takahiko Kato, Carol A. Handwerker, Jasbir Bath |
| title_fullStr | Mitigating tin whisker risks theory and practice Takahiko Kato, Carol A. Handwerker, Jasbir Bath |
| title_full_unstemmed | Mitigating tin whisker risks theory and practice Takahiko Kato, Carol A. Handwerker, Jasbir Bath |
| title_short | Mitigating tin whisker risks |
| title_sort | mitigating tin whisker risks theory and practice |
| title_sub | theory and practice |
| topic | TECHNOLOGY & ENGINEERING / Technical & Manufacturing Industries & Trades bisacsh Failure analysis (Engineering) fast Solder and soldering fast Solder and soldering Failure analysis (Engineering) |
| topic_facet | TECHNOLOGY & ENGINEERING / Technical & Manufacturing Industries & Trades Failure analysis (Engineering) Solder and soldering |
| url | https://onlinelibrary.wiley.com/doi/book/10.1002/9781119011965 |
| work_keys_str_mv | AT katotakahiko mitigatingtinwhiskerriskstheoryandpractice AT handwerkercarola mitigatingtinwhiskerriskstheoryandpractice AT bathjasbir mitigatingtinwhiskerriskstheoryandpractice |