11th international congress molded interconnect devices: scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany
Saved in:
| Corporate Author: | |
|---|---|
| Other Authors: | |
| Format: | Electronic eBook |
| Language: | English |
| Published: |
Pfaffikon, Switzerland
TTP
2014
|
| Series: | Advanced materials research
v. 1038 |
| Subjects: | |
| Online Access: | FAW01 FAW02 |
| Item Description: | Online resource; title from PDF title page (ebrary, viewed October 16, 2014) |
| Physical Description: | 1 online resource (119 pages) illustrations |
| ISBN: | 9783038266365 3038266361 9783038352525 |
Staff View
MARC
| LEADER | 00000nmm a2200000zcb4500 | ||
|---|---|---|---|
| 001 | BV043783207 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 160920s2014 |||| o||u| ||||||eng d | ||
| 020 | |a 9783038266365 |9 978-3-03826-636-5 | ||
| 020 | |a 3038266361 |9 3-03826-636-1 | ||
| 020 | |a 9783038352525 |9 978-3-03835-252-5 | ||
| 035 | |a (ZDB-4-EBA)ocn893677821 | ||
| 035 | |a (OCoLC)893677821 | ||
| 035 | |a (DE-599)BVBBV043783207 | ||
| 040 | |a DE-604 |b ger |e rda | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-1046 |a DE-1047 | ||
| 082 | 0 | |a 621.367 |2 23 | |
| 110 | 2 | |a International Congress Molded Interconnect Devices < 2014, Nuremberg |b Fuerth, Germany> |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a 11th international congress molded interconnect devices |b scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany |c edited by Jörg Franke [and three others] |
| 264 | 1 | |a Pfaffikon, Switzerland |b TTP |c 2014 | |
| 264 | 4 | |c © 2014 | |
| 300 | |a 1 online resource (119 pages) |b illustrations | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a Advanced materials research |v v. 1038 | |
| 500 | |a Online resource; title from PDF title page (ebrary, viewed October 16, 2014) | ||
| 505 | 8 | |a Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping,Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability. Keyword: Printing Technologies, Materiala Manufacturing, Manufatruting processes, Inspection, assemply technologies, quality testing The 16 papers collected here are from the 11th International Congress Molded Interconnect Devices (MID 2014), held in September 2014 in Nuremberg/Fuerth, Germany. Technology specialists from Europe, the US, and Taiwan address development and prototyping, printing technologies, materials and manufacturing, manufacturing processes, assembly technologies and inspection, and quality and reliability. -- Electronic components and devices-- Electronic engineering-- Materials science | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Mechanical |2 bisacsh | |
| 650 | 7 | |a Molded interconnect devices |2 fast | |
| 650 | 7 | |a Three-dimensional display systems |2 fast | |
| 650 | 4 | |a Molded interconnect devices |a Three-dimensional display systems |v Congresses | |
| 655 | 7 | |0 (DE-588)1071861417 |a Konferenzschrift |2 gnd-content | |
| 700 | 1 | |a Franke, Jörg |4 edt | |
| 776 | 0 | 8 | |i Erscheint auch als |n Druck-Ausgabe |a International Congress Molded Interconnect Devices (11th : 2014 : Nuremberg / Fuerth, Germany) |t 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany |
| 912 | |a ZDB-4-EBA | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-029194267 | ||
| 966 | e | |u http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=862190 |l FAW01 |p ZDB-4-EBA |q FAW_PDA_EBA |x Aggregator |3 Volltext | |
| 966 | e | |u http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=862190 |l FAW02 |p ZDB-4-EBA |q FAW_PDA_EBA |x Aggregator |3 Volltext | |
Record in the Search Index
| _version_ | 1804176615018594304 |
|---|---|
| any_adam_object | |
| author2 | Franke, Jörg |
| author2_role | edt |
| author2_variant | j f jf |
| author_corporate | International Congress Molded Interconnect Devices < 2014, Nuremberg Fuerth, Germany> |
| author_corporate_role | aut |
| author_facet | Franke, Jörg International Congress Molded Interconnect Devices < 2014, Nuremberg Fuerth, Germany> |
| author_sort | International Congress Molded Interconnect Devices < 2014, Nuremberg Fuerth, Germany> |
| building | Verbundindex |
| bvnumber | BV043783207 |
| collection | ZDB-4-EBA |
| contents | Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping,Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability. Keyword: Printing Technologies, Materiala Manufacturing, Manufatruting processes, Inspection, assemply technologies, quality testing The 16 papers collected here are from the 11th International Congress Molded Interconnect Devices (MID 2014), held in September 2014 in Nuremberg/Fuerth, Germany. Technology specialists from Europe, the US, and Taiwan address development and prototyping, printing technologies, materials and manufacturing, manufacturing processes, assembly technologies and inspection, and quality and reliability. -- Electronic components and devices-- Electronic engineering-- Materials science |
| ctrlnum | (ZDB-4-EBA)ocn893677821 (OCoLC)893677821 (DE-599)BVBBV043783207 |
| dewey-full | 621.367 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.367 |
| dewey-search | 621.367 |
| dewey-sort | 3621.367 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03540nmm a2200469zcb4500</leader><controlfield tag="001">BV043783207</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">160920s2014 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783038266365</subfield><subfield code="9">978-3-03826-636-5</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">3038266361</subfield><subfield code="9">3-03826-636-1</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783038352525</subfield><subfield code="9">978-3-03835-252-5</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-4-EBA)ocn893677821</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)893677821</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV043783207</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-1046</subfield><subfield code="a">DE-1047</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.367</subfield><subfield code="2">23</subfield></datafield><datafield tag="110" ind1="2" ind2=" "><subfield code="a">International Congress Molded Interconnect Devices < 2014, Nuremberg</subfield><subfield code="b">Fuerth, Germany></subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">11th international congress molded interconnect devices</subfield><subfield code="b">scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany</subfield><subfield code="c">edited by Jörg Franke [and three others]</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Pfaffikon, Switzerland</subfield><subfield code="b">TTP</subfield><subfield code="c">2014</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">© 2014</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 online resource (119 pages)</subfield><subfield code="b">illustrations</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Advanced materials research</subfield><subfield code="v">v. 1038</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Online resource; title from PDF title page (ebrary, viewed October 16, 2014)</subfield></datafield><datafield tag="505" ind1="8" ind2=" "><subfield code="a">Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping,Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability. Keyword: Printing Technologies, Materiala Manufacturing, Manufatruting processes, Inspection, assemply technologies, quality testing The 16 papers collected here are from the 11th International Congress Molded Interconnect Devices (MID 2014), held in September 2014 in Nuremberg/Fuerth, Germany. Technology specialists from Europe, the US, and Taiwan address development and prototyping, printing technologies, materials and manufacturing, manufacturing processes, assembly technologies and inspection, and quality and reliability. -- Electronic components and devices-- Electronic engineering-- Materials science</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Mechanical</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Molded interconnect devices</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Three-dimensional display systems</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Molded interconnect devices</subfield><subfield code="a">Three-dimensional display systems</subfield><subfield code="v">Congresses</subfield></datafield><datafield tag="655" ind1=" " ind2="7"><subfield code="0">(DE-588)1071861417</subfield><subfield code="a">Konferenzschrift</subfield><subfield code="2">gnd-content</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Franke, Jörg</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druck-Ausgabe</subfield><subfield code="a">International Congress Molded Interconnect Devices (11th : 2014 : Nuremberg / Fuerth, Germany)</subfield><subfield code="t">11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-4-EBA</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-029194267</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=862190</subfield><subfield code="l">FAW01</subfield><subfield code="p">ZDB-4-EBA</subfield><subfield code="q">FAW_PDA_EBA</subfield><subfield code="x">Aggregator</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&AN=862190</subfield><subfield code="l">FAW02</subfield><subfield code="p">ZDB-4-EBA</subfield><subfield code="q">FAW_PDA_EBA</subfield><subfield code="x">Aggregator</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| genre | (DE-588)1071861417 Konferenzschrift gnd-content |
| genre_facet | Konferenzschrift |
| id | DE-604.BV043783207 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T07:34:59Z |
| institution | BVB |
| isbn | 9783038266365 3038266361 9783038352525 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-029194267 |
| oclc_num | 893677821 |
| open_access_boolean | |
| owner | DE-1046 DE-1047 |
| owner_facet | DE-1046 DE-1047 |
| physical | 1 online resource (119 pages) illustrations |
| psigel | ZDB-4-EBA ZDB-4-EBA FAW_PDA_EBA |
| publishDate | 2014 |
| publishDateSearch | 2014 |
| publishDateSort | 2014 |
| publisher | TTP |
| record_format | marc |
| series2 | Advanced materials research |
| spelling | International Congress Molded Interconnect Devices < 2014, Nuremberg Fuerth, Germany> Verfasser aut 11th international congress molded interconnect devices scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany edited by Jörg Franke [and three others] Pfaffikon, Switzerland TTP 2014 © 2014 1 online resource (119 pages) illustrations txt rdacontent c rdamedia cr rdacarrier Advanced materials research v. 1038 Online resource; title from PDF title page (ebrary, viewed October 16, 2014) Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping,Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability. Keyword: Printing Technologies, Materiala Manufacturing, Manufatruting processes, Inspection, assemply technologies, quality testing The 16 papers collected here are from the 11th International Congress Molded Interconnect Devices (MID 2014), held in September 2014 in Nuremberg/Fuerth, Germany. Technology specialists from Europe, the US, and Taiwan address development and prototyping, printing technologies, materials and manufacturing, manufacturing processes, assembly technologies and inspection, and quality and reliability. -- Electronic components and devices-- Electronic engineering-- Materials science TECHNOLOGY & ENGINEERING / Mechanical bisacsh Molded interconnect devices fast Three-dimensional display systems fast Molded interconnect devices Three-dimensional display systems Congresses (DE-588)1071861417 Konferenzschrift gnd-content Franke, Jörg edt Erscheint auch als Druck-Ausgabe International Congress Molded Interconnect Devices (11th : 2014 : Nuremberg / Fuerth, Germany) 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany |
| spellingShingle | 11th international congress molded interconnect devices scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping,Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability. Keyword: Printing Technologies, Materiala Manufacturing, Manufatruting processes, Inspection, assemply technologies, quality testing The 16 papers collected here are from the 11th International Congress Molded Interconnect Devices (MID 2014), held in September 2014 in Nuremberg/Fuerth, Germany. Technology specialists from Europe, the US, and Taiwan address development and prototyping, printing technologies, materials and manufacturing, manufacturing processes, assembly technologies and inspection, and quality and reliability. -- Electronic components and devices-- Electronic engineering-- Materials science TECHNOLOGY & ENGINEERING / Mechanical bisacsh Molded interconnect devices fast Three-dimensional display systems fast Molded interconnect devices Three-dimensional display systems Congresses |
| subject_GND | (DE-588)1071861417 |
| title | 11th international congress molded interconnect devices scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany |
| title_auth | 11th international congress molded interconnect devices scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany |
| title_exact_search | 11th international congress molded interconnect devices scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany |
| title_full | 11th international congress molded interconnect devices scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany edited by Jörg Franke [and three others] |
| title_fullStr | 11th international congress molded interconnect devices scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany edited by Jörg Franke [and three others] |
| title_full_unstemmed | 11th international congress molded interconnect devices scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany edited by Jörg Franke [and three others] |
| title_short | 11th international congress molded interconnect devices |
| title_sort | 11th international congress molded interconnect devices scientific proceedings selected peer reviewed papers from the 11th international congress molded interconnect devices mid 2014 september 24 25 2014 nuremberg fuerth germany |
| title_sub | scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany |
| topic | TECHNOLOGY & ENGINEERING / Mechanical bisacsh Molded interconnect devices fast Three-dimensional display systems fast Molded interconnect devices Three-dimensional display systems Congresses |
| topic_facet | TECHNOLOGY & ENGINEERING / Mechanical Molded interconnect devices Three-dimensional display systems Molded interconnect devices Three-dimensional display systems Congresses Konferenzschrift |
| work_keys_str_mv | AT internationalcongressmoldedinterconnectdevices2014nurembergfuerthgermany 11thinternationalcongressmoldedinterconnectdevicesscientificproceedingsselectedpeerreviewedpapersfromthe11thinternationalcongressmoldedinterconnectdevicesmid2014september24252014nurembergfuerthgermany AT frankejorg 11thinternationalcongressmoldedinterconnectdevicesscientificproceedingsselectedpeerreviewedpapersfromthe11thinternationalcongressmoldedinterconnectdevicesmid2014september24252014nurembergfuerthgermany |