11th international congress molded interconnect devices: scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany
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| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Pfaffikon, Switzerland
TTP
2014
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| Schriftenreihe: | Advanced materials research
v. 1038 |
| Schlagworte: | |
| Online-Zugang: | FAW01 FAW02 |
| Beschreibung: | Online resource; title from PDF title page (ebrary, viewed October 16, 2014) |
| Beschreibung: | 1 online resource (119 pages) illustrations |
| ISBN: | 9783038266365 3038266361 9783038352525 |
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| 490 | 0 | |a Advanced materials research |v v. 1038 | |
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| 505 | 8 | |a Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping,Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability. Keyword: Printing Technologies, Materiala Manufacturing, Manufatruting processes, Inspection, assemply technologies, quality testing The 16 papers collected here are from the 11th International Congress Molded Interconnect Devices (MID 2014), held in September 2014 in Nuremberg/Fuerth, Germany. Technology specialists from Europe, the US, and Taiwan address development and prototyping, printing technologies, materials and manufacturing, manufacturing processes, assembly technologies and inspection, and quality and reliability. -- Electronic components and devices-- Electronic engineering-- Materials science | |
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Datensatz im Suchindex
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| contents | Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping,Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability. Keyword: Printing Technologies, Materiala Manufacturing, Manufatruting processes, Inspection, assemply technologies, quality testing The 16 papers collected here are from the 11th International Congress Molded Interconnect Devices (MID 2014), held in September 2014 in Nuremberg/Fuerth, Germany. Technology specialists from Europe, the US, and Taiwan address development and prototyping, printing technologies, materials and manufacturing, manufacturing processes, assembly technologies and inspection, and quality and reliability. -- Electronic components and devices-- Electronic engineering-- Materials science |
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| dewey-raw | 621.367 |
| dewey-search | 621.367 |
| dewey-sort | 3621.367 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
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| spelling | International Congress Molded Interconnect Devices < 2014, Nuremberg Fuerth, Germany> Verfasser aut 11th international congress molded interconnect devices scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany edited by Jörg Franke [and three others] Pfaffikon, Switzerland TTP 2014 © 2014 1 online resource (119 pages) illustrations txt rdacontent c rdamedia cr rdacarrier Advanced materials research v. 1038 Online resource; title from PDF title page (ebrary, viewed October 16, 2014) Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping,Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability. Keyword: Printing Technologies, Materiala Manufacturing, Manufatruting processes, Inspection, assemply technologies, quality testing The 16 papers collected here are from the 11th International Congress Molded Interconnect Devices (MID 2014), held in September 2014 in Nuremberg/Fuerth, Germany. Technology specialists from Europe, the US, and Taiwan address development and prototyping, printing technologies, materials and manufacturing, manufacturing processes, assembly technologies and inspection, and quality and reliability. -- Electronic components and devices-- Electronic engineering-- Materials science TECHNOLOGY & ENGINEERING / Mechanical bisacsh Molded interconnect devices fast Three-dimensional display systems fast Molded interconnect devices Three-dimensional display systems Congresses (DE-588)1071861417 Konferenzschrift gnd-content Franke, Jörg edt Erscheint auch als Druck-Ausgabe International Congress Molded Interconnect Devices (11th : 2014 : Nuremberg / Fuerth, Germany) 11th international congress molded interconnect devices : scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany |
| spellingShingle | 11th international congress molded interconnect devices scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany Collection of selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany. The 16 papers are grouped as follows: Chapter 1: Development and Prototyping,Chapter 2: Printing Technologies, Chapter 3: Materials and Manufacturing, Chapter 4: Manufacturing Processes, Chapter 5: Assembly Technologies and Inspection, Chapter 6: Quality and Reliability. Keyword: Printing Technologies, Materiala Manufacturing, Manufatruting processes, Inspection, assemply technologies, quality testing The 16 papers collected here are from the 11th International Congress Molded Interconnect Devices (MID 2014), held in September 2014 in Nuremberg/Fuerth, Germany. Technology specialists from Europe, the US, and Taiwan address development and prototyping, printing technologies, materials and manufacturing, manufacturing processes, assembly technologies and inspection, and quality and reliability. -- Electronic components and devices-- Electronic engineering-- Materials science TECHNOLOGY & ENGINEERING / Mechanical bisacsh Molded interconnect devices fast Three-dimensional display systems fast Molded interconnect devices Three-dimensional display systems Congresses |
| subject_GND | (DE-588)1071861417 |
| title | 11th international congress molded interconnect devices scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany |
| title_auth | 11th international congress molded interconnect devices scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany |
| title_exact_search | 11th international congress molded interconnect devices scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany |
| title_full | 11th international congress molded interconnect devices scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany edited by Jörg Franke [and three others] |
| title_fullStr | 11th international congress molded interconnect devices scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany edited by Jörg Franke [and three others] |
| title_full_unstemmed | 11th international congress molded interconnect devices scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany edited by Jörg Franke [and three others] |
| title_short | 11th international congress molded interconnect devices |
| title_sort | 11th international congress molded interconnect devices scientific proceedings selected peer reviewed papers from the 11th international congress molded interconnect devices mid 2014 september 24 25 2014 nuremberg fuerth germany |
| title_sub | scientific proceedings : selected, peer reviewed papers from the 11th International Congress Molded Interconnect Devices (MID 2014), September 24-25, 2014, Nuremberg / Fuerth, Germany |
| topic | TECHNOLOGY & ENGINEERING / Mechanical bisacsh Molded interconnect devices fast Three-dimensional display systems fast Molded interconnect devices Three-dimensional display systems Congresses |
| topic_facet | TECHNOLOGY & ENGINEERING / Mechanical Molded interconnect devices Three-dimensional display systems Molded interconnect devices Three-dimensional display systems Congresses Konferenzschrift |
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