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3D stacked chips: from emerging processes to heterogeneous systems

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Bibliographic Details
Other Authors:	Elfadel, Ibrahim (Abe) M. (Editor), Fettweis, Gerhard (Editor)
Format:	Electronic eBook
Language:	English
Published:	[Cham] Springer International Publishing [2016]
Subjects:	Engineering Microprocessors Electronic circuits Circuits and Systems Electronic Circuits and Devices Processor Architectures Ingenieurwissenschaften
Online Access:	BTU01 FAB01 FAW01 FHA01 FHI01 FHN01 FHR01 FKE01 FRO01 FWS01 FWS02 UBY01 Volltext Inhaltsverzeichnis Abstract
Physical Description:	1 Online-Ressource (xxiii, 339 p. 238 illus., 157 illus. in color)
ISBN:	9783319204819
DOI:	10.1007/978-3-319-20481-9

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adam_text	3D STACKED CHIPS / : 2016 TABLE OF CONTENTS / INHALTSVERZEICHNIS INTRODUCTION TO ELECTRICAL 3D INTEGRATION COPPER-BASED TSV – INTERPOSER MULTI-TSV CROSSTALK CHANNEL EQUALIZATION WITH NON-UNIFORM QUANTIZATION ENERGY EFFICIENT ELECTRICAL INTRA-CHIP STACK COMMUNICATION CLOCK GENERATORS FOR HETEROGENEOUS MPSOCS WITHIN 3D CHIP STACKS ENERGY EFFICIENT COMMUNICATIONS EMPLOYING 1-BIT QUANTIZATION AT THE RECEIVER 2-NM LASER SYNTHESIZED SI-NANOPARTICLES FOR LOW POWER MEMORY APPLICATIONS ACCURATE TEMPERATURE MEASUREMENT FOR 3D THERMAL MANAGEMENT EDA ENVIRONMENTS FOR 3D CHIP STACKS INTEGRATING 3D FLOORPLANNING AND OPTIMIZATION OF THERMAL THROUGH-SILICON VIAS INTRODUCTION TO OPTICAL INTER- AND INTRACONNECTS OPTICAL THROUGH-SILICON VIAS INTEGRATED OPTICAL DEVICES FOR 3D PHOTONIC TRANSCEIVERS CANTILEVER DESIGN FOR TUNABLE WDM FILTERS BASED ON SILICON MICRORING RESONATORS ATHERMAL PHOTONIC CIRCUITS FOR OPTICAL ON-CHIP INTERCONNECTS INTEGRATED CIRCUITS FOR 3D PHOTONIC TRANSCEIVERS REVIEW OF INTERDIGITATED BACK CONTACTED FULL HETEROJUNCTION SOLAR CELL (IBC-SHJ): A SIMULATION APPROACH.- DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT. 3D STACKED CHIPS / : 2016 ABSTRACT / INHALTSTEXT THIS BOOK EXPLAINS FOR READERS HOW 3D CHIP STACKS PROMISE TO INCREASE THE LEVEL OF ON-CHIP INTEGRATION, AND TO DESIGN NEW HETEROGENEOUS SEMICONDUCTOR DEVICES THAT COMBINE CHIPS OF DIFFERENT INTEGRATION TECHNOLOGIES (INCL. SENSORS) IN A SINGLE PACKAGE OF THE SMALLEST POSSIBLE SIZE. THE AUTHORS FOCUS ON HETEROGENEOUS 3D INTEGRATION, ADDRESSING SOME OF THE MOST IMPORTANT CHALLENGES IN THIS EMERGING TECHNOLOGY, INCLUDING CONTACTLESS, OPTICS-BASED, AND CARBON-NANOTUBE-BASED 3D INTEGRATION, AS WELL AS SIGNAL-INTEGRITY AND THERMAL MANAGEMENT ISSUES IN COPPER-BASED 3D INTEGRATION. COVERAGE ALSO INCLUDES THE 3D HETEROGENEOUS INTEGRATION OF POWER SOURCES, PHOTONIC DEVICES, AND NON-VOLATILE MEMORIES BASED ON NEW MATERIALS SYSTEMS. •PROVIDES SINGLE-SOURCE REFERENCE TO THE LATEST RESEARCH IN 3D OPTOELECTRONIC INTEGRATION: PROCESS, DEVICES, AND SYSTEMS; •EXPLAINS THE USE OF WIRELESS 3D INTEGRATION TO IMPROVE 3D IC RELIABILITY AND YIELD; •DESCRIBES TECHNIQUES FOR MONITORING AND MITIGATING THERMAL BEHAVIOR IN 3D ICS; •INCLUDES DISCUSSION OF 3D INTEGRATION OF HIGH-DENSITY POWER SOURCES AND NOVEL NVM. DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
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spellingShingle	3D stacked chips from emerging processes to heterogeneous systems Engineering Microprocessors Electronic circuits Circuits and Systems Electronic Circuits and Devices Processor Architectures Ingenieurwissenschaften
title	3D stacked chips from emerging processes to heterogeneous systems
title_auth	3D stacked chips from emerging processes to heterogeneous systems
title_exact_search	3D stacked chips from emerging processes to heterogeneous systems
title_full	3D stacked chips from emerging processes to heterogeneous systems Ibrahim (Abe) M. Elfadel, Gerhard Fettweis editors
title_fullStr	3D stacked chips from emerging processes to heterogeneous systems Ibrahim (Abe) M. Elfadel, Gerhard Fettweis editors
title_full_unstemmed	3D stacked chips from emerging processes to heterogeneous systems Ibrahim (Abe) M. Elfadel, Gerhard Fettweis editors
title_short	3D stacked chips
title_sort	3d stacked chips from emerging processes to heterogeneous systems
title_sub	from emerging processes to heterogeneous systems
topic	Engineering Microprocessors Electronic circuits Circuits and Systems Electronic Circuits and Devices Processor Architectures Ingenieurwissenschaften
topic_facet	Engineering Microprocessors Electronic circuits Circuits and Systems Electronic Circuits and Devices Processor Architectures Ingenieurwissenschaften
url	https://doi.org/10.1007/978-3-319-20481-9 http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028994322&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028994322&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA
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