Verfügbarkeit: 3D stacked chips

3D stacked chips: from emerging processes to heterogeneous systems

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Bibliographische Detailangaben
Weitere Verfasser:	Elfadel, Ibrahim (Abe) M. (HerausgeberIn), Fettweis, Gerhard (HerausgeberIn)
Format:	Elektronisch E-Book
Sprache:	English
Veröffentlicht:	[Cham] Springer International Publishing [2016]
Schlagworte:	Engineering Microprocessors Electronic circuits Circuits and Systems Electronic Circuits and Devices Processor Architectures Ingenieurwissenschaften
Online-Zugang:	BTU01 FAB01 FAW01 FHA01 FHI01 FHN01 FHR01 FKE01 FRO01 FWS01 FWS02 UBY01 Volltext Inhaltsverzeichnis Abstract
Beschreibung:	1 Online-Ressource (xxiii, 339 p. 238 illus., 157 illus. in color)
ISBN:	9783319204819
DOI:	10.1007/978-3-319-20481-9

Internformat

MARC


LEADER	00000nmm a2200000zc 4500
001	BV043579649
003	DE-604
005	20160607
007	cr\|uuu---uuuuu
008	160601s2016 \|\|\|\| o\|\|u\| \|\|\|\|\|\|eng d
020			\|a 9783319204819 \|c Online \|9 978-3-319-20481-9
024	7		\|a 10.1007/978-3-319-20481-9 \|2 doi
035			\|a (ZDB-2-ENG)978-3-319-20481-9
035			\|a (OCoLC)951032573
035			\|a (DE-599)BVBBV043579649
040			\|a DE-604 \|b ger \|e rda
041	0		\|a eng
049			\|a DE-706 \|a DE-1046 \|a DE-1043 \|a DE-Aug4 \|a DE-898 \|a DE-861 \|a DE-573 \|a DE-859 \|a DE-863 \|a DE-634 \|a DE-862 \|a DE-92
082	0		\|a 621.3815 \|2 23
084			\|a ST 190 \|0 (DE-625)143607: \|2 rvk
245	1	0	\|a 3D stacked chips \|b from emerging processes to heterogeneous systems \|c Ibrahim (Abe) M. Elfadel, Gerhard Fettweis editors
264		1	\|a [Cham] \|b Springer International Publishing \|c [2016]
264		4	\|c © 2016
300			\|a 1 Online-Ressource (xxiii, 339 p. 238 illus., 157 illus. in color)
336			\|b txt \|2 rdacontent
337			\|b c \|2 rdamedia
338			\|b cr \|2 rdacarrier
650		4	\|a Engineering
650		4	\|a Microprocessors
650		4	\|a Electronic circuits
650		4	\|a Circuits and Systems
650		4	\|a Electronic Circuits and Devices
650		4	\|a Processor Architectures
650		4	\|a Ingenieurwissenschaften
700	1		\|a Elfadel, Ibrahim (Abe) M. \|4 edt
700	1		\|a Fettweis, Gerhard \|0 (DE-588)1037135334 \|4 edt
776	0	8	\|i Erscheint auch als \|n Druckausgabe \|z 978-3-319-20480-2
856	4	0	\|u https://doi.org/10.1007/978-3-319-20481-9 \|x Verlag \|z URL des Erstveröffentlichers \|3 Volltext
856	4	2	\|m Springer Fremddatenuebernahme \|q application/pdf \|u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028994322&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA \|3 Inhaltsverzeichnis
856	4	2	\|m Springer Fremddatenuebernahme \|q application/pdf \|u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028994322&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA \|3 Abstract
912			\|a ZDB-2-ENG
940	1		\|q ZDB-2-ENG_2016
999			\|a oai:aleph.bib-bvb.de:BVB01-028994322
966	e		\|u https://doi.org/10.1007/978-3-319-20481-9 \|l BTU01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-20481-9 \|l FAB01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-20481-9 \|l FAW01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-20481-9 \|l FHA01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-20481-9 \|l FHI01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-20481-9 \|l FHN01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-20481-9 \|l FHR01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-20481-9 \|l FKE01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-20481-9 \|l FRO01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-20481-9 \|l FWS01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-20481-9 \|l FWS02 \|p ZDB-2-ENG \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-20481-9 \|l UBY01 \|p ZDB-2-ENG \|x Verlag \|3 Volltext

Datensatz im Suchindex

DE-BY-FWS_katkey	618873
_version_	1824554524973465600
adam_text	3D STACKED CHIPS / : 2016 TABLE OF CONTENTS / INHALTSVERZEICHNIS INTRODUCTION TO ELECTRICAL 3D INTEGRATION COPPER-BASED TSV – INTERPOSER MULTI-TSV CROSSTALK CHANNEL EQUALIZATION WITH NON-UNIFORM QUANTIZATION ENERGY EFFICIENT ELECTRICAL INTRA-CHIP STACK COMMUNICATION CLOCK GENERATORS FOR HETEROGENEOUS MPSOCS WITHIN 3D CHIP STACKS ENERGY EFFICIENT COMMUNICATIONS EMPLOYING 1-BIT QUANTIZATION AT THE RECEIVER 2-NM LASER SYNTHESIZED SI-NANOPARTICLES FOR LOW POWER MEMORY APPLICATIONS ACCURATE TEMPERATURE MEASUREMENT FOR 3D THERMAL MANAGEMENT EDA ENVIRONMENTS FOR 3D CHIP STACKS INTEGRATING 3D FLOORPLANNING AND OPTIMIZATION OF THERMAL THROUGH-SILICON VIAS INTRODUCTION TO OPTICAL INTER- AND INTRACONNECTS OPTICAL THROUGH-SILICON VIAS INTEGRATED OPTICAL DEVICES FOR 3D PHOTONIC TRANSCEIVERS CANTILEVER DESIGN FOR TUNABLE WDM FILTERS BASED ON SILICON MICRORING RESONATORS ATHERMAL PHOTONIC CIRCUITS FOR OPTICAL ON-CHIP INTERCONNECTS INTEGRATED CIRCUITS FOR 3D PHOTONIC TRANSCEIVERS REVIEW OF INTERDIGITATED BACK CONTACTED FULL HETEROJUNCTION SOLAR CELL (IBC-SHJ): A SIMULATION APPROACH.- DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT. 3D STACKED CHIPS / : 2016 ABSTRACT / INHALTSTEXT THIS BOOK EXPLAINS FOR READERS HOW 3D CHIP STACKS PROMISE TO INCREASE THE LEVEL OF ON-CHIP INTEGRATION, AND TO DESIGN NEW HETEROGENEOUS SEMICONDUCTOR DEVICES THAT COMBINE CHIPS OF DIFFERENT INTEGRATION TECHNOLOGIES (INCL. SENSORS) IN A SINGLE PACKAGE OF THE SMALLEST POSSIBLE SIZE. THE AUTHORS FOCUS ON HETEROGENEOUS 3D INTEGRATION, ADDRESSING SOME OF THE MOST IMPORTANT CHALLENGES IN THIS EMERGING TECHNOLOGY, INCLUDING CONTACTLESS, OPTICS-BASED, AND CARBON-NANOTUBE-BASED 3D INTEGRATION, AS WELL AS SIGNAL-INTEGRITY AND THERMAL MANAGEMENT ISSUES IN COPPER-BASED 3D INTEGRATION. COVERAGE ALSO INCLUDES THE 3D HETEROGENEOUS INTEGRATION OF POWER SOURCES, PHOTONIC DEVICES, AND NON-VOLATILE MEMORIES BASED ON NEW MATERIALS SYSTEMS. •PROVIDES SINGLE-SOURCE REFERENCE TO THE LATEST RESEARCH IN 3D OPTOELECTRONIC INTEGRATION: PROCESS, DEVICES, AND SYSTEMS; •EXPLAINS THE USE OF WIRELESS 3D INTEGRATION TO IMPROVE 3D IC RELIABILITY AND YIELD; •DESCRIBES TECHNIQUES FOR MONITORING AND MITIGATING THERMAL BEHAVIOR IN 3D ICS; •INCLUDES DISCUSSION OF 3D INTEGRATION OF HIGH-DENSITY POWER SOURCES AND NOVEL NVM. DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
any_adam_object	1
author2	Elfadel, Ibrahim (Abe) M. Fettweis, Gerhard
author2_role	edt edt
author2_variant	i a m e iam iame g f gf
author_GND	(DE-588)1037135334
author_facet	Elfadel, Ibrahim (Abe) M. Fettweis, Gerhard
building	Verbundindex
bvnumber	BV043579649
classification_rvk	ST 190
collection	ZDB-2-ENG
ctrlnum	(ZDB-2-ENG)978-3-319-20481-9 (OCoLC)951032573 (DE-599)BVBBV043579649
dewey-full	621.3815
dewey-hundreds	600 - Technology (Applied sciences)
dewey-ones	621 - Applied physics
dewey-raw	621.3815
dewey-search	621.3815
dewey-sort	3621.3815
dewey-tens	620 - Engineering and allied operations
discipline	Informatik Elektrotechnik / Elektronik / Nachrichtentechnik
doi_str_mv	10.1007/978-3-319-20481-9
format	Electronic eBook
fullrecord	<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03321nmm a2200625zc 4500</leader><controlfield tag="001">BV043579649</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20160607 </controlfield><controlfield tag="007">cr\|uuu---uuuuu</controlfield><controlfield tag="008">160601s2016 \|\|\|\| o\|\|u\| \|\|\|\|\|\|eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783319204819</subfield><subfield code="c">Online</subfield><subfield code="9">978-3-319-20481-9</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-3-319-20481-9</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-2-ENG)978-3-319-20481-9</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)951032573</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV043579649</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">rda</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-706</subfield><subfield code="a">DE-1046</subfield><subfield code="a">DE-1043</subfield><subfield code="a">DE-Aug4</subfield><subfield code="a">DE-898</subfield><subfield code="a">DE-861</subfield><subfield code="a">DE-573</subfield><subfield code="a">DE-859</subfield><subfield code="a">DE-863</subfield><subfield code="a">DE-634</subfield><subfield code="a">DE-862</subfield><subfield code="a">DE-92</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.3815</subfield><subfield code="2">23</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ST 190</subfield><subfield code="0">(DE-625)143607:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">3D stacked chips</subfield><subfield code="b">from emerging processes to heterogeneous systems</subfield><subfield code="c">Ibrahim (Abe) M. Elfadel, Gerhard Fettweis editors</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">[Cham]</subfield><subfield code="b">Springer International Publishing</subfield><subfield code="c">[2016]</subfield></datafield><datafield tag="264" ind1=" " ind2="4"><subfield code="c">© 2016</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (xxiii, 339 p. 238 illus., 157 illus. in color)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microprocessors</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic circuits</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Circuits and Systems</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electronic Circuits and Devices</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Processor Architectures</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Ingenieurwissenschaften</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Elfadel, Ibrahim (Abe) M.</subfield><subfield code="4">edt</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Fettweis, Gerhard</subfield><subfield code="0">(DE-588)1037135334</subfield><subfield code="4">edt</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druckausgabe</subfield><subfield code="z">978-3-319-20480-2</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-3-319-20481-9</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">Springer Fremddatenuebernahme</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028994322&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Inhaltsverzeichnis</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">Springer Fremddatenuebernahme</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028994322&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Abstract</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-ENG</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-ENG_2016</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-028994322</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-20481-9</subfield><subfield code="l">BTU01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-20481-9</subfield><subfield code="l">FAB01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-20481-9</subfield><subfield code="l">FAW01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-20481-9</subfield><subfield code="l">FHA01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-20481-9</subfield><subfield code="l">FHI01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-20481-9</subfield><subfield code="l">FHN01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-20481-9</subfield><subfield code="l">FHR01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-20481-9</subfield><subfield code="l">FKE01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-20481-9</subfield><subfield code="l">FRO01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-20481-9</subfield><subfield code="l">FWS01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-20481-9</subfield><subfield code="l">FWS02</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-20481-9</subfield><subfield code="l">UBY01</subfield><subfield code="p">ZDB-2-ENG</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection>
id	DE-604.BV043579649
illustrated	Not Illustrated
indexdate	2025-02-20T06:53:09Z
institution	BVB
isbn	9783319204819
language	English
oai_aleph_id	oai:aleph.bib-bvb.de:BVB01-028994322
oclc_num	951032573
open_access_boolean
owner	DE-706 DE-1046 DE-1043 DE-Aug4 DE-898 DE-BY-UBR DE-861 DE-573 DE-859 DE-863 DE-BY-FWS DE-634 DE-862 DE-BY-FWS DE-92
owner_facet	DE-706 DE-1046 DE-1043 DE-Aug4 DE-898 DE-BY-UBR DE-861 DE-573 DE-859 DE-863 DE-BY-FWS DE-634 DE-862 DE-BY-FWS DE-92
physical	1 Online-Ressource (xxiii, 339 p. 238 illus., 157 illus. in color)
psigel	ZDB-2-ENG ZDB-2-ENG_2016
publishDate	2016
publishDateSearch	2016
publishDateSort	2016
publisher	Springer International Publishing
record_format	marc
spellingShingle	3D stacked chips from emerging processes to heterogeneous systems Engineering Microprocessors Electronic circuits Circuits and Systems Electronic Circuits and Devices Processor Architectures Ingenieurwissenschaften
title	3D stacked chips from emerging processes to heterogeneous systems
title_auth	3D stacked chips from emerging processes to heterogeneous systems
title_exact_search	3D stacked chips from emerging processes to heterogeneous systems
title_full	3D stacked chips from emerging processes to heterogeneous systems Ibrahim (Abe) M. Elfadel, Gerhard Fettweis editors
title_fullStr	3D stacked chips from emerging processes to heterogeneous systems Ibrahim (Abe) M. Elfadel, Gerhard Fettweis editors
title_full_unstemmed	3D stacked chips from emerging processes to heterogeneous systems Ibrahim (Abe) M. Elfadel, Gerhard Fettweis editors
title_short	3D stacked chips
title_sort	3d stacked chips from emerging processes to heterogeneous systems
title_sub	from emerging processes to heterogeneous systems
topic	Engineering Microprocessors Electronic circuits Circuits and Systems Electronic Circuits and Devices Processor Architectures Ingenieurwissenschaften
topic_facet	Engineering Microprocessors Electronic circuits Circuits and Systems Electronic Circuits and Devices Processor Architectures Ingenieurwissenschaften
url	https://doi.org/10.1007/978-3-319-20481-9 http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028994322&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028994322&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA
work_keys_str_mv	AT elfadelibrahimabem 3dstackedchipsfromemergingprocessestoheterogeneoussystems AT fettweisgerhard 3dstackedchipsfromemergingprocessestoheterogeneoussystems

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