APA-Zitierstil (7. Ausg.)

Elfadel, I. M., & Fettweis, G. (2016). 3D stacked chips: From emerging processes to heterogeneous systems. Springer International Publishing. https://doi.org/10.1007/978-3-319-20481-9

Chicago-Zitierstil (17. Ausg.)

Elfadel, Ibrahim M., und Gerhard Fettweis. 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems. [Cham]: Springer International Publishing, 2016. https://doi.org/10.1007/978-3-319-20481-9.

MLA-Zitierstil (9. Ausg.)

Elfadel, Ibrahim M., und Gerhard Fettweis. 3D Stacked Chips: From Emerging Processes to Heterogeneous Systems. Springer International Publishing, 2016. https://doi.org/10.1007/978-3-319-20481-9.