Crosstalk in modern on-chip interconnects: a FDTD approach
Gespeichert in:
1. Verfasser: | |
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Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
Singapore
Springer
2016
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Schriftenreihe: | SpringerBriefs in applied sciences and technology
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Schlagworte: | |
Online-Zugang: | BTU01 FAB01 FAW01 FHA01 FHI01 FHN01 FHR01 FKE01 FRO01 FWS01 FWS02 UBY01 Volltext Inhaltsverzeichnis Abstract |
Beschreibung: | 1 Online-Ressource (xv, 116 Seiten) |
ISBN: | 9789811008009 |
DOI: | 10.1007/978-981-10-0800-9 |
Internformat
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Datensatz im Suchindex
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adam_text | CROSSTALK IN MODERN ON-CHIP INTERCONNECTS
/ KAUSHIK, B.K.
: 2016
TABLE OF CONTENTS / INHALTSVERZEICHNIS
INTRODUCTION TO ON-CHIP INTERCONNECTS AND MODELING
INTERCONNECT MODELING, CNT AND GNR STRUCTURE, PROPERTIES AND
CHARACTERISTICS
FDTD MODEL FOR CROSSTALK ANALYSIS OF CMOS GATE-DRIVEN COUPLED COPPER
INTERCONNECTS
FDTD MODEL FOR CROSSTALK ANALYSIS OF MULTIWALL CARBON NANOTUBE (MWCNT)
INTERCONNECTS
CROSSTALK MODELING WITH WIDTH DEPENDENT MFP IN MLGNR INTERCONNECTS USING
FDTD TECHNIQUE
AN EFFICIENT US-FDTD MODEL FOR CROSSTALK ANALYSIS OF ON-CHIP
INTERCONNECTS
DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
CROSSTALK IN MODERN ON-CHIP INTERCONNECTS
/ KAUSHIK, B.K.
: 2016
ABSTRACT / INHALTSTEXT
THE BOOK PROVIDES ACCURATE FDTD MODELS FOR ON-CHIP INTERCONNECTS,
COVERING MOST RECENT ADVANCEMENTS IN MATERIALS AND DESIGN. FURTHERMORE,
DEPENDING ON THE GEOMETRY AND PHYSICAL CONFIGURATIONS, DIFFERENT
ELECTRICAL EQUIVALENT MODELS FOR CNT AND GNR BASED INTERCONNECTS ARE
PRESENTED. BASED ON THE ELECTRICAL EQUIVALENT MODELS THE PERFORMANCE
COMPARISON AMONG THE CU, CNT AND GNR-BASED INTERCONNECTS ARE ALSO
DISCUSSED IN THE BOOK. THE PROPOSED MODELS ARE VALIDATED WITH THE HSPICE
SIMULATIONS. THE BOOK INTRODUCES THE CURRENT RESEARCH SCENARIO IN THE
MODELING OF ON-CHIP INTERCONNECTS. IT PRESENTS THE STRUCTURE,
PROPERTIES, AND CHARACTERISTICS OF GRAPHENE BASED ON-CHIP INTERCONNECTS
AND THE FDTD MODELING OF CU BASED ON-CHIP INTERCONNECTS. THE MODEL
CONSIDERS THE NON-LINEAR EFFECTS OF CMOS DRIVER AS WELL AS THE
TRANSMISSION LINE EFFECTS OF INTERCONNECT LINE THAT INCLUDES COUPLING
CAPACITANCE AND MUTUAL INDUCTANCE EFFECTS. IN A MORE REALISTIC MANNER,
THE PROPOSED MODEL INCLUDES THE EFFECT OF WIDTH-DEPENDENT MFP OF THE
MLGNR WHILE TAKING INTO ACCOUNT THE EDGE ROUGHNESS
DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
|
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spellingShingle | Kaushik, B.K Crosstalk in modern on-chip interconnects a FDTD approach Engineering Nanotechnology Electronics Microelectronics Electronic circuits Nanotechnology and Microengineering Electronics and Microelectronics, Instrumentation Circuits and Systems Ingenieurwissenschaften |
title | Crosstalk in modern on-chip interconnects a FDTD approach |
title_auth | Crosstalk in modern on-chip interconnects a FDTD approach |
title_exact_search | Crosstalk in modern on-chip interconnects a FDTD approach |
title_full | Crosstalk in modern on-chip interconnects a FDTD approach B.K. Kaushik, V. Ramesh Kumar, Amalendu Patnaik |
title_fullStr | Crosstalk in modern on-chip interconnects a FDTD approach B.K. Kaushik, V. Ramesh Kumar, Amalendu Patnaik |
title_full_unstemmed | Crosstalk in modern on-chip interconnects a FDTD approach B.K. Kaushik, V. Ramesh Kumar, Amalendu Patnaik |
title_short | Crosstalk in modern on-chip interconnects |
title_sort | crosstalk in modern on chip interconnects a fdtd approach |
title_sub | a FDTD approach |
topic | Engineering Nanotechnology Electronics Microelectronics Electronic circuits Nanotechnology and Microengineering Electronics and Microelectronics, Instrumentation Circuits and Systems Ingenieurwissenschaften |
topic_facet | Engineering Nanotechnology Electronics Microelectronics Electronic circuits Nanotechnology and Microengineering Electronics and Microelectronics, Instrumentation Circuits and Systems Ingenieurwissenschaften |
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