Liu, S. (2011). Modeling and simulation for microelectronic packaging assembly: Manufacture, reliability, and testing. Wiley.
Chicago-Zitierstil (17. Ausg.)Liu, S. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacture, Reliability, and Testing. Hoboken, N.J: Wiley, 2011.
MLA-Zitierstil (9. Ausg.)Liu, S. Modeling and Simulation for Microelectronic Packaging Assembly: Manufacture, Reliability, and Testing. Wiley, 2011.
Achtung: Diese Zitate sind unter Umständen nicht zu 100% korrekt.