Chemical mechanical planarization of microelectronic materials:
Gespeichert in:
1. Verfasser: | |
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Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
New York
J. Wiley
©1997
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Schlagworte: | |
Online-Zugang: | FRO01 UBG01 Volltext |
Beschreibung: | Includes bibliographical references and index |
Beschreibung: | 1 Online-Ressource (xiii, 324 pages) 24 cm |
ISBN: | 9783527617746 3527617744 |
Internformat
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245 | 1 | 0 | |a Chemical mechanical planarization of microelectronic materials |c Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann |
264 | 1 | |a New York |b J. Wiley |c ©1997 | |
300 | |a 1 Online-Ressource (xiii, 324 pages) |c 24 cm | ||
336 | |b txt |2 rdacontent | ||
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500 | |a Includes bibliographical references and index | ||
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650 | 7 | |a Chemical mechanical planarization |2 fast | |
650 | 7 | |a Grinding and polishing |2 fast | |
650 | 7 | |a Microelectronics / Materials |2 fast | |
650 | 7 | |a Materiais e dispositivos semicondutores |2 larpcal | |
650 | 4 | |a Microelectronics / Materials | |
650 | 4 | |a Grinding and polishing | |
650 | 4 | |a Chemical mechanical planarization | |
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Datensatz im Suchindex
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any_adam_object | |
author | Steigerwald, Joseph M. |
author_facet | Steigerwald, Joseph M. |
author_role | aut |
author_sort | Steigerwald, Joseph M. |
author_variant | j m s jm jms |
building | Verbundindex |
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collection | ZDB-35-WIC |
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dewey-full | 621.3815/2 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.3815/2 |
dewey-search | 621.3815/2 |
dewey-sort | 3621.3815 12 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Electronic eBook |
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id | DE-604.BV043387566 |
illustrated | Not Illustrated |
indexdate | 2024-07-10T07:24:33Z |
institution | BVB |
isbn | 9783527617746 3527617744 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-028806149 |
oclc_num | 212140077 |
open_access_boolean | |
owner | DE-861 |
owner_facet | DE-861 |
physical | 1 Online-Ressource (xiii, 324 pages) 24 cm |
psigel | ZDB-35-WIC UBG_PDA_WIC ZDB-35-WIC FRO_PDA_WIC ZDB-35-WIC UBG_PDA_WIC |
publishDate | 1997 |
publishDateSearch | 1997 |
publishDateSort | 1997 |
publisher | J. Wiley |
record_format | marc |
spelling | Steigerwald, Joseph M. Verfasser aut Chemical mechanical planarization of microelectronic materials Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann New York J. Wiley ©1997 1 Online-Ressource (xiii, 324 pages) 24 cm txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index Online-Ausgabe Mode of access: World Wide Web Chemical mechanical planarization fast Grinding and polishing fast Microelectronics / Materials fast Materiais e dispositivos semicondutores larpcal Microelectronics / Materials Grinding and polishing Chemical mechanical planarization Planartechnik (DE-588)4174785-9 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 gnd rswk-swf Mikroelektronik (DE-588)4039207-7 s Planartechnik (DE-588)4174785-9 s 1\p DE-604 Murarka, S. P. Sonstige oth Gutmann, Ronald J. Sonstige oth Reproduktion von Steigerwald, Joseph M. Chemical mechanical planarization of microelectronic materials ©1997 https://onlinelibrary.wiley.com/doi/book/10.1002/9783527617746 Verlag URL des Erstveröffentlichers Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
spellingShingle | Steigerwald, Joseph M. Chemical mechanical planarization of microelectronic materials Chemical mechanical planarization fast Grinding and polishing fast Microelectronics / Materials fast Materiais e dispositivos semicondutores larpcal Microelectronics / Materials Grinding and polishing Chemical mechanical planarization Planartechnik (DE-588)4174785-9 gnd Mikroelektronik (DE-588)4039207-7 gnd |
subject_GND | (DE-588)4174785-9 (DE-588)4039207-7 |
title | Chemical mechanical planarization of microelectronic materials |
title_auth | Chemical mechanical planarization of microelectronic materials |
title_exact_search | Chemical mechanical planarization of microelectronic materials |
title_full | Chemical mechanical planarization of microelectronic materials Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann |
title_fullStr | Chemical mechanical planarization of microelectronic materials Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann |
title_full_unstemmed | Chemical mechanical planarization of microelectronic materials Joseph M. Steigerwald, Shyam P. Murarka, Ronald J. Gutmann |
title_short | Chemical mechanical planarization of microelectronic materials |
title_sort | chemical mechanical planarization of microelectronic materials |
topic | Chemical mechanical planarization fast Grinding and polishing fast Microelectronics / Materials fast Materiais e dispositivos semicondutores larpcal Microelectronics / Materials Grinding and polishing Chemical mechanical planarization Planartechnik (DE-588)4174785-9 gnd Mikroelektronik (DE-588)4039207-7 gnd |
topic_facet | Chemical mechanical planarization Grinding and polishing Microelectronics / Materials Materiais e dispositivos semicondutores Planartechnik Mikroelektronik |
url | https://onlinelibrary.wiley.com/doi/book/10.1002/9783527617746 |
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