Microelectronic applications of chemical mechanical planarization:
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Hoboken, N.J.
Wiley-Interscience
©2008
|
| Schlagworte: | |
| Online-Zugang: | FRO01 UBG01 Volltext Buchcover |
| Beschreibung: | Includes bibliographical references and index An authoritative, systematic, and comprehensive description of current CMP technology. Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the f |
| Beschreibung: | 1 Online-Ressource (xxv, 734 pages) 25 cm |
| ISBN: | 9780470180907 0470180900 9780470180891 0470180897 1281094161 9781281094162 0471719196 9780471719199 |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV043386774 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 160222s2008 |||| o||u| ||||||eng d | ||
| 020 | |a 9780470180907 |9 978-0-470-18090-7 | ||
| 020 | |a 0470180900 |9 0-470-18090-0 | ||
| 020 | |a 9780470180891 |9 978-0-470-18089-1 | ||
| 020 | |a 0470180897 |9 0-470-18089-7 | ||
| 020 | |a 1281094161 |9 1-281-09416-1 | ||
| 020 | |a 9781281094162 |9 978-1-281-09416-2 | ||
| 020 | |a 0471719196 |9 0-471-71919-6 | ||
| 020 | |a 9780471719199 |9 978-0-471-71919-9 | ||
| 024 | 7 | |a 10.1002/9780470180907 |2 doi | |
| 035 | |a (ZDB-35-WIC)ocn181350038 | ||
| 035 | |a (OCoLC)181350038 | ||
| 035 | |a (DE-599)BVBBV043386774 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-861 | ||
| 082 | 0 | |a 621.3815 |2 22 | |
| 245 | 1 | 0 | |a Microelectronic applications of chemical mechanical planarization |c edited by Yuzhuo Li |
| 264 | 1 | |a Hoboken, N.J. |b Wiley-Interscience |c ©2008 | |
| 300 | |a 1 Online-Ressource (xxv, 734 pages) |c 25 cm | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 500 | |a Includes bibliographical references and index | ||
| 500 | |a An authoritative, systematic, and comprehensive description of current CMP technology. Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the f | ||
| 533 | |a Online-Ausgabe |n Mode of access: World Wide Web | ||
| 650 | 7 | |a Chemical mechanical planarization |2 fast | |
| 650 | 7 | |a Integrated circuits / Design and construction |2 fast | |
| 650 | 7 | |a Microelectronics / Materials |2 fast | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Electronics / Circuits / Integrated |2 bisacsh | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Electronics / Circuits / General |2 bisacsh | |
| 650 | 4 | |a Integrated circuits | |
| 650 | 4 | |a Integrated circuits / Design and construction | |
| 650 | 4 | |a Chemical mechanical planarization | |
| 650 | 4 | |a Microelectronics / Materials | |
| 650 | 0 | 7 | |a Chemisches Verfahren |0 (DE-588)4454573-3 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Oberflächenstruktur |0 (DE-588)4130418-4 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Mikromechanik |0 (DE-588)4205811-9 |2 gnd |9 rswk-swf |
| 650 | 0 | 7 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |2 gnd |9 rswk-swf |
| 653 | |a Electronic books | ||
| 689 | 0 | 0 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |D s |
| 689 | 0 | 1 | |a Mikromechanik |0 (DE-588)4205811-9 |D s |
| 689 | 0 | 2 | |a Oberflächenstruktur |0 (DE-588)4130418-4 |D s |
| 689 | 0 | 3 | |a Chemisches Verfahren |0 (DE-588)4454573-3 |D s |
| 689 | 0 | |8 1\p |5 DE-604 | |
| 700 | 1 | |a Li, Yuzhuo |e Sonstige |4 oth | |
| 776 | 0 | 8 | |i Reproduktion von |t Microelectronic applications of chemical mechanical planarization |d ©2008 |
| 856 | 4 | 0 | |u https://onlinelibrary.wiley.com/doi/book/10.1002/9780470180907 |x Verlag |z URL des Erstveröffentlichers |3 Volltext |
| 856 | 4 | 2 | |m SWB Datenaustausch |q application/pdf |u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028805358&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |3 Buchcover |
| 912 | |a ZDB-35-WIC | ||
| 940 | 1 | |q UBG_PDA_WIC | |
| 999 | |a oai:aleph.bib-bvb.de:BVB01-028805358 | ||
| 883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
| 966 | e | |u https://onlinelibrary.wiley.com/doi/book/10.1002/9780470180907 |l FRO01 |p ZDB-35-WIC |q FRO_PDA_WIC |x Verlag |3 Volltext | |
| 966 | e | |u https://onlinelibrary.wiley.com/doi/book/10.1002/9780470180907 |l UBG01 |p ZDB-35-WIC |q UBG_PDA_WIC |x Verlag |3 Volltext | |
Datensatz im Suchindex
| _version_ | 1804175956497137664 |
|---|---|
| any_adam_object | 1 |
| building | Verbundindex |
| bvnumber | BV043386774 |
| collection | ZDB-35-WIC |
| ctrlnum | (ZDB-35-WIC)ocn181350038 (OCoLC)181350038 (DE-599)BVBBV043386774 |
| dewey-full | 621.3815 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.3815 |
| dewey-search | 621.3815 |
| dewey-sort | 3621.3815 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03933nmm a2200733zc 4500</leader><controlfield tag="001">BV043386774</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">160222s2008 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780470180907</subfield><subfield code="9">978-0-470-18090-7</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0470180900</subfield><subfield code="9">0-470-18090-0</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780470180891</subfield><subfield code="9">978-0-470-18089-1</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0470180897</subfield><subfield code="9">0-470-18089-7</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">1281094161</subfield><subfield code="9">1-281-09416-1</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781281094162</subfield><subfield code="9">978-1-281-09416-2</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">0471719196</subfield><subfield code="9">0-471-71919-6</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9780471719199</subfield><subfield code="9">978-0-471-71919-9</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1002/9780470180907</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(ZDB-35-WIC)ocn181350038</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)181350038</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV043386774</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-861</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.3815</subfield><subfield code="2">22</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Microelectronic applications of chemical mechanical planarization</subfield><subfield code="c">edited by Yuzhuo Li</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Hoboken, N.J.</subfield><subfield code="b">Wiley-Interscience</subfield><subfield code="c">©2008</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (xxv, 734 pages)</subfield><subfield code="c">25 cm</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">An authoritative, systematic, and comprehensive description of current CMP technology. Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the f</subfield></datafield><datafield tag="533" ind1=" " ind2=" "><subfield code="a">Online-Ausgabe</subfield><subfield code="n">Mode of access: World Wide Web</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Chemical mechanical planarization</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Integrated circuits / Design and construction</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Microelectronics / Materials</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Electronics / Circuits / Integrated</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Electronics / Circuits / General</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Integrated circuits</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Integrated circuits / Design and construction</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Chemical mechanical planarization</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microelectronics / Materials</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Chemisches Verfahren</subfield><subfield code="0">(DE-588)4454573-3</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Oberflächenstruktur</subfield><subfield code="0">(DE-588)4130418-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Mikromechanik</subfield><subfield code="0">(DE-588)4205811-9</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="653" ind1=" " ind2=" "><subfield code="a">Electronic books</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Mikromechanik</subfield><subfield code="0">(DE-588)4205811-9</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="2"><subfield code="a">Oberflächenstruktur</subfield><subfield code="0">(DE-588)4130418-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="3"><subfield code="a">Chemisches Verfahren</subfield><subfield code="0">(DE-588)4454573-3</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Li, Yuzhuo</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Reproduktion von</subfield><subfield code="t">Microelectronic applications of chemical mechanical planarization</subfield><subfield code="d">©2008</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://onlinelibrary.wiley.com/doi/book/10.1002/9780470180907</subfield><subfield code="x">Verlag</subfield><subfield code="z">URL des Erstveröffentlichers</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">SWB Datenaustausch</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028805358&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Buchcover</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-35-WIC</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">UBG_PDA_WIC</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-028805358</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://onlinelibrary.wiley.com/doi/book/10.1002/9780470180907</subfield><subfield code="l">FRO01</subfield><subfield code="p">ZDB-35-WIC</subfield><subfield code="q">FRO_PDA_WIC</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://onlinelibrary.wiley.com/doi/book/10.1002/9780470180907</subfield><subfield code="l">UBG01</subfield><subfield code="p">ZDB-35-WIC</subfield><subfield code="q">UBG_PDA_WIC</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV043386774 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T07:24:31Z |
| institution | BVB |
| isbn | 9780470180907 0470180900 9780470180891 0470180897 1281094161 9781281094162 0471719196 9780471719199 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-028805358 |
| oclc_num | 181350038 |
| open_access_boolean | |
| owner | DE-861 |
| owner_facet | DE-861 |
| physical | 1 Online-Ressource (xxv, 734 pages) 25 cm |
| psigel | ZDB-35-WIC UBG_PDA_WIC ZDB-35-WIC FRO_PDA_WIC ZDB-35-WIC UBG_PDA_WIC |
| publishDate | 2008 |
| publishDateSearch | 2008 |
| publishDateSort | 2008 |
| publisher | Wiley-Interscience |
| record_format | marc |
| spelling | Microelectronic applications of chemical mechanical planarization edited by Yuzhuo Li Hoboken, N.J. Wiley-Interscience ©2008 1 Online-Ressource (xxv, 734 pages) 25 cm txt rdacontent c rdamedia cr rdacarrier Includes bibliographical references and index An authoritative, systematic, and comprehensive description of current CMP technology. Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the f Online-Ausgabe Mode of access: World Wide Web Chemical mechanical planarization fast Integrated circuits / Design and construction fast Microelectronics / Materials fast TECHNOLOGY & ENGINEERING / Electronics / Circuits / Integrated bisacsh TECHNOLOGY & ENGINEERING / Electronics / Circuits / General bisacsh Integrated circuits Integrated circuits / Design and construction Chemical mechanical planarization Microelectronics / Materials Chemisches Verfahren (DE-588)4454573-3 gnd rswk-swf Oberflächenstruktur (DE-588)4130418-4 gnd rswk-swf Mikromechanik (DE-588)4205811-9 gnd rswk-swf Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf Electronic books Integrierte Schaltung (DE-588)4027242-4 s Mikromechanik (DE-588)4205811-9 s Oberflächenstruktur (DE-588)4130418-4 s Chemisches Verfahren (DE-588)4454573-3 s 1\p DE-604 Li, Yuzhuo Sonstige oth Reproduktion von Microelectronic applications of chemical mechanical planarization ©2008 https://onlinelibrary.wiley.com/doi/book/10.1002/9780470180907 Verlag URL des Erstveröffentlichers Volltext SWB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028805358&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Buchcover 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
| spellingShingle | Microelectronic applications of chemical mechanical planarization Chemical mechanical planarization fast Integrated circuits / Design and construction fast Microelectronics / Materials fast TECHNOLOGY & ENGINEERING / Electronics / Circuits / Integrated bisacsh TECHNOLOGY & ENGINEERING / Electronics / Circuits / General bisacsh Integrated circuits Integrated circuits / Design and construction Chemical mechanical planarization Microelectronics / Materials Chemisches Verfahren (DE-588)4454573-3 gnd Oberflächenstruktur (DE-588)4130418-4 gnd Mikromechanik (DE-588)4205811-9 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
| subject_GND | (DE-588)4454573-3 (DE-588)4130418-4 (DE-588)4205811-9 (DE-588)4027242-4 |
| title | Microelectronic applications of chemical mechanical planarization |
| title_auth | Microelectronic applications of chemical mechanical planarization |
| title_exact_search | Microelectronic applications of chemical mechanical planarization |
| title_full | Microelectronic applications of chemical mechanical planarization edited by Yuzhuo Li |
| title_fullStr | Microelectronic applications of chemical mechanical planarization edited by Yuzhuo Li |
| title_full_unstemmed | Microelectronic applications of chemical mechanical planarization edited by Yuzhuo Li |
| title_short | Microelectronic applications of chemical mechanical planarization |
| title_sort | microelectronic applications of chemical mechanical planarization |
| topic | Chemical mechanical planarization fast Integrated circuits / Design and construction fast Microelectronics / Materials fast TECHNOLOGY & ENGINEERING / Electronics / Circuits / Integrated bisacsh TECHNOLOGY & ENGINEERING / Electronics / Circuits / General bisacsh Integrated circuits Integrated circuits / Design and construction Chemical mechanical planarization Microelectronics / Materials Chemisches Verfahren (DE-588)4454573-3 gnd Oberflächenstruktur (DE-588)4130418-4 gnd Mikromechanik (DE-588)4205811-9 gnd Integrierte Schaltung (DE-588)4027242-4 gnd |
| topic_facet | Chemical mechanical planarization Integrated circuits / Design and construction Microelectronics / Materials TECHNOLOGY & ENGINEERING / Electronics / Circuits / Integrated TECHNOLOGY & ENGINEERING / Electronics / Circuits / General Integrated circuits Chemisches Verfahren Oberflächenstruktur Mikromechanik Integrierte Schaltung |
| url | https://onlinelibrary.wiley.com/doi/book/10.1002/9780470180907 http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028805358&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
| work_keys_str_mv | AT liyuzhuo microelectronicapplicationsofchemicalmechanicalplanarization |