Lead-free electronics:
Gespeichert in:
Bibliographische Detailangaben
Format: Elektronisch E-Book
Sprache:English
Veröffentlicht: Hoboken, N.J. Wiley-Interscience ©2006
Schlagworte:
Online-Zugang:FHI01
FRO01
UBG01
URL des Erstveröffentlichers
Beschreibung:Includes bibliographical references and index
Various social and environmental reasons drive the push to lead-free technologies. Proposed and enacted legislation in the form of international and national laws and standards and local initiatives seem to control the use of lead in electronics manufacture and waste minimization. This book examines all issues, technical, social, historical as well as legislative, related to the current situation and future plans for lead-free electronics. 160; It was originally published by the160;authors for internal purposes but160;has since been updated and taken off the market. 160; These updates include the latest data on cyclic thermo-mechanical deformation properties of lead-free SnAgCu alloys and the comparison of the properties between the standard Sn-Pb and lead-free alloys using the energy partitioning approach. 160; Tin whiskering, solder joint reliability, and lead-free implementation are also covered
Beschreibung:1 Online-Ressource (xxv, 766 pages)
ISBN:0470007796
9780470007792
047000780X
9780470007808
0471786179
9780471786177

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