3D stacked chips: from emerging processes to heterogeneous systems
Gespeichert in:
Weitere Verfasser: | , |
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Format: | Buch |
Sprache: | English |
Veröffentlicht: |
[Cham]
Springer
[2016]
|
Schlagworte: | |
Online-Zugang: | Inhaltstext |
Beschreibung: | Hier auch später erschienene, unveränderte Nachdrucke |
Beschreibung: | xxiii, 339 Seiten Illustrationen, Diagramme 235 mm x 155 mm |
ISBN: | 9783319204802 9783319793054 |
Internformat
MARC
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020 | |a 9783319793054 |c Softcover reprint of the original 1st ed. 2016 |9 978-3-319-79305-4 | ||
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245 | 1 | 0 | |a 3D stacked chips |b from emerging processes to heterogeneous systems |c Ibrahim (Abe) M. Elfadel, Gerhard Fettweis editors |
264 | 1 | |a [Cham] |b Springer |c [2016] | |
264 | 4 | |c © 2016 | |
300 | |a xxiii, 339 Seiten |b Illustrationen, Diagramme |c 235 mm x 155 mm | ||
336 | |b txt |2 rdacontent | ||
337 | |b n |2 rdamedia | ||
338 | |b nc |2 rdacarrier | ||
500 | |a Hier auch später erschienene, unveränderte Nachdrucke | ||
653 | |a UYF | ||
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653 | |a Thermal Management of 3D ICs | ||
653 | |a TSV Modeling and Circuit Techniques | ||
700 | 1 | |a Elfadel, Ibrahim (Abe) M. |4 edt | |
700 | 1 | |a Fettweis, Gerhard |0 (DE-588)1037135334 |4 edt | |
710 | 2 | |a Springer International Publishing |0 (DE-588)1064344704 |4 pbl | |
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Datensatz im Suchindex
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---|---|
adam_text | |
any_adam_object | |
author2 | Elfadel, Ibrahim (Abe) M. Fettweis, Gerhard |
author2_role | edt edt |
author2_variant | i a m e iam iame g f gf |
author_GND | (DE-588)1037135334 |
author_facet | Elfadel, Ibrahim (Abe) M. Fettweis, Gerhard |
building | Verbundindex |
bvnumber | BV043340757 |
classification_rvk | ST 190 |
ctrlnum | (OCoLC)951551912 (DE-599)DNB1071248820 |
dewey-full | 621.3 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.3 |
dewey-search | 621.3 |
dewey-sort | 3621.3 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Informatik Elektrotechnik / Elektronik / Nachrichtentechnik |
format | Book |
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id | DE-604.BV043340757 |
illustrated | Illustrated |
indexdate | 2024-08-03T02:52:39Z |
institution | BVB |
institution_GND | (DE-588)1064344704 |
isbn | 9783319204802 9783319793054 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-028760659 |
oclc_num | 951551912 |
open_access_boolean | |
owner | DE-29T DE-11 |
owner_facet | DE-29T DE-11 |
physical | xxiii, 339 Seiten Illustrationen, Diagramme 235 mm x 155 mm |
publishDate | 2016 |
publishDateSearch | 2016 |
publishDateSort | 2016 |
publisher | Springer |
record_format | marc |
spelling | 3D stacked chips from emerging processes to heterogeneous systems Ibrahim (Abe) M. Elfadel, Gerhard Fettweis editors [Cham] Springer [2016] © 2016 xxiii, 339 Seiten Illustrationen, Diagramme 235 mm x 155 mm txt rdacontent n rdamedia nc rdacarrier Hier auch später erschienene, unveränderte Nachdrucke UYF Three-dimensional Integrated Circuit Design Thermal Management of 3D ICs TSV Modeling and Circuit Techniques Elfadel, Ibrahim (Abe) M. edt Fettweis, Gerhard (DE-588)1037135334 edt Springer International Publishing (DE-588)1064344704 pbl Erscheint auch als Online-Ausgabe 978-3-319-20481-9 X:MVB text/html http://deposit.dnb.de/cgi-bin/dokserv?id=5266602&prov=M&dok_var=1&dok_ext=htm Inhaltstext |
spellingShingle | 3D stacked chips from emerging processes to heterogeneous systems |
title | 3D stacked chips from emerging processes to heterogeneous systems |
title_auth | 3D stacked chips from emerging processes to heterogeneous systems |
title_exact_search | 3D stacked chips from emerging processes to heterogeneous systems |
title_full | 3D stacked chips from emerging processes to heterogeneous systems Ibrahim (Abe) M. Elfadel, Gerhard Fettweis editors |
title_fullStr | 3D stacked chips from emerging processes to heterogeneous systems Ibrahim (Abe) M. Elfadel, Gerhard Fettweis editors |
title_full_unstemmed | 3D stacked chips from emerging processes to heterogeneous systems Ibrahim (Abe) M. Elfadel, Gerhard Fettweis editors |
title_short | 3D stacked chips |
title_sort | 3d stacked chips from emerging processes to heterogeneous systems |
title_sub | from emerging processes to heterogeneous systems |
url | http://deposit.dnb.de/cgi-bin/dokserv?id=5266602&prov=M&dok_var=1&dok_ext=htm |
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