Holdings: Three-Dimensional Integration of Semiconductors

Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications

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Bibliographic Details
Format:	Electronic eBook
Language:	English
Published:	Cham Springer 2015
Subjects:	Chemistry Electrochemistry Semiconductors Mechanical engineering Electrical engineering Biomedical engineering Electrical Engineering Mechanical Engineering Biomedical Engineering Chemie
Online Access:	FAW01 UBT01 Volltext Inhaltsverzeichnis Abstract
Physical Description:	1 Online Ressource (XIX, 408 p. 460 illus., 269 illus. in color)
ISBN:	9783319186757
DOI:	10.1007/978-3-319-18675-7

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LEADER	00000nmm a2200000zc 4500
001	BV043309448
003	DE-604
005	20160125
007	cr\|uuu---uuuuu
008	160125s2015 \|\|\|\| o\|\|u\| \|\|\|\|\|\|eng d
020			\|a 9783319186757 \|c Online \|9 978-3-319-18675-7
024	7		\|a 10.1007/978-3-319-18675-7 \|2 doi
035			\|a (OCoLC)934178874
035			\|a (DE-599)BVBBV043309448
040			\|a DE-604 \|b ger \|e aacr
041	0		\|a eng
049			\|a DE-1046 \|a DE-703
082	0		\|a 541.37 \|2 23
084			\|a ZN 5410 \|0 (DE-625)157456: \|2 rvk
245	1	0	\|a Three-Dimensional Integration of Semiconductors \|b Processing, Materials, and Applications \|c Kazuo Kondo, Morihiro Kada, Kenji Takahashi, ed.
264		1	\|a Cham \|b Springer \|c 2015
300			\|a 1 Online Ressource (XIX, 408 p. 460 illus., 269 illus. in color)
336			\|b txt \|2 rdacontent
337			\|b c \|2 rdamedia
338			\|b cr \|2 rdacarrier
650		4	\|a Chemistry
650		4	\|a Electrochemistry
650		4	\|a Semiconductors
650		4	\|a Mechanical engineering
650		4	\|a Electrical engineering
650		4	\|a Biomedical engineering
650		4	\|a Electrical Engineering
650		4	\|a Mechanical Engineering
650		4	\|a Biomedical Engineering
650		4	\|a Chemie
700	1		\|a Kondo, Kazuo \|e Sonstige \|4 oth
700	1		\|a Kada, Morihiro \|e Sonstige \|4 oth
700	1		\|a Takahashi, Kenji \|e Sonstige \|4 oth
776	0	8	\|i Erscheint auch als \|n Druckausgabe \|z 978-3-319-18674-0
856	4	0	\|u https://doi.org/10.1007/978-3-319-18675-7 \|x Verlag \|3 Volltext
856	4	2	\|m Springer Fremddatenuebernahme \|q application/pdf \|u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA \|3 Inhaltsverzeichnis
856	4	2	\|m Springer Fremddatenuebernahme \|q application/pdf \|u http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA \|3 Abstract
912			\|a ZDB-2-CMS
940	1		\|q ZDB-2-CMS_2015
999			\|a oai:aleph.bib-bvb.de:BVB01-028730137
966	e		\|u https://doi.org/10.1007/978-3-319-18675-7 \|l FAW01 \|p ZDB-2-CMS \|x Verlag \|3 Volltext
966	e		\|u https://doi.org/10.1007/978-3-319-18675-7 \|l UBT01 \|p ZDB-2-CMS \|x Verlag \|3 Volltext

Record in the Search Index

_version_	1804175846285508608
adam_text	THREE-DIMENSIONAL INTEGRATION OF SEMICONDUCTORS / : 2015 TABLE OF CONTENTS / INHALTSVERZEICHNIS RESEARCH AND DEVELOPMENT HISTORY OF THREE DIMENSIONAL (3D) INTEGRATION TECHNOLOGY RECENT RESEARCH AND DEVELOPMENT ACTIVITIES OF THREE DIMENSIONAL (3D) INTEGRATION TECHNOLOGY TSV PROCESSES WAFER AND DIE BONDING PROCESSES METROLOGY AND INSPECTION TSV CHARACTERISTICS AND RELIABILITY: IMPACT OF 3D INTEGRATION PROCESSES ON DEVICE RELIABILITY TRENDS IN 3D INTEGRATED CIRCUIT (3D-IC) TESTING TECHNOLOGY DREAM CHIP PROJECT AT ASET. DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT. THREE-DIMENSIONAL INTEGRATION OF SEMICONDUCTORS / : 2015 ABSTRACT / INHALTSTEXT THIS BOOK STARTS WITH BACKGROUNDCONCERNING THREE-DIMENSIONAL INTEGRATION - INCLUDING THEIRLOW ENERGY CONSUMPTION AND HIGH SPEED IMAGE PROCESSING - AND THEN PROCEEDS TO HOW TO CONSTRUCT THEM AND WHICH MATERIALS TO USE IN PARTICULAR SITUATIONS.THE BOOK COVERS NUMEROUS APPLICATIONS, INCLUDINGNEXT GENERATION SMART PHONES, DRIVING ASSISTANCE SYSTEMS, CAPSULE ENDOSCOPES, HOMING MISSILES, AND MANY OTHERS. THE BOOK CONCLUDES WITH RECENT PROGRESS AND DEVELOPMENTS IN THREE DIMENSIONAL PACKAGING, AS WELL AS FUTURE PROSPECTS DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
any_adam_object	1
building	Verbundindex
bvnumber	BV043309448
classification_rvk	ZN 5410
collection	ZDB-2-CMS
ctrlnum	(OCoLC)934178874 (DE-599)BVBBV043309448
dewey-full	541.37
dewey-hundreds	500 - Natural sciences and mathematics
dewey-ones	541 - Physical chemistry
dewey-raw	541.37
dewey-search	541.37
dewey-sort	3541.37
dewey-tens	540 - Chemistry and allied sciences
discipline	Chemie / Pharmazie Elektrotechnik / Elektronik / Nachrichtentechnik
doi_str_mv	10.1007/978-3-319-18675-7
format	Electronic eBook
fullrecord	<?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>02306nmm a2200529zc 4500</leader><controlfield tag="001">BV043309448</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">20160125 </controlfield><controlfield tag="007">cr\|uuu---uuuuu</controlfield><controlfield tag="008">160125s2015 \|\|\|\| o\|\|u\| \|\|\|\|\|\|eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9783319186757</subfield><subfield code="c">Online</subfield><subfield code="9">978-3-319-18675-7</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-3-319-18675-7</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)934178874</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV043309448</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-1046</subfield><subfield code="a">DE-703</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">541.37</subfield><subfield code="2">23</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">ZN 5410</subfield><subfield code="0">(DE-625)157456:</subfield><subfield code="2">rvk</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Three-Dimensional Integration of Semiconductors</subfield><subfield code="b">Processing, Materials, and Applications</subfield><subfield code="c">Kazuo Kondo, Morihiro Kada, Kenji Takahashi, ed.</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Cham</subfield><subfield code="b">Springer</subfield><subfield code="c">2015</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online Ressource (XIX, 408 p. 460 illus., 269 illus. in color)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Chemistry</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electrochemistry</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Semiconductors</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Mechanical engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electrical engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Biomedical engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electrical Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Mechanical Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Biomedical Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Chemie</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kondo, Kazuo</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Kada, Morihiro</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Takahashi, Kenji</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="776" ind1="0" ind2="8"><subfield code="i">Erscheint auch als</subfield><subfield code="n">Druckausgabe</subfield><subfield code="z">978-3-319-18674-0</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-3-319-18675-7</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">Springer Fremddatenuebernahme</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Inhaltsverzeichnis</subfield></datafield><datafield tag="856" ind1="4" ind2="2"><subfield code="m">Springer Fremddatenuebernahme</subfield><subfield code="q">application/pdf</subfield><subfield code="u">http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA</subfield><subfield code="3">Abstract</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-CMS</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-CMS_2015</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-028730137</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-18675-7</subfield><subfield code="l">FAW01</subfield><subfield code="p">ZDB-2-CMS</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">https://doi.org/10.1007/978-3-319-18675-7</subfield><subfield code="l">UBT01</subfield><subfield code="p">ZDB-2-CMS</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield></record></collection>
id	DE-604.BV043309448
illustrated	Not Illustrated
indexdate	2024-07-10T07:22:46Z
institution	BVB
isbn	9783319186757
language	English
oai_aleph_id	oai:aleph.bib-bvb.de:BVB01-028730137
oclc_num	934178874
open_access_boolean
owner	DE-1046 DE-703
owner_facet	DE-1046 DE-703
physical	1 Online Ressource (XIX, 408 p. 460 illus., 269 illus. in color)
psigel	ZDB-2-CMS ZDB-2-CMS_2015
publishDate	2015
publishDateSearch	2015
publishDateSort	2015
publisher	Springer
record_format	marc
spelling	Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications Kazuo Kondo, Morihiro Kada, Kenji Takahashi, ed. Cham Springer 2015 1 Online Ressource (XIX, 408 p. 460 illus., 269 illus. in color) txt rdacontent c rdamedia cr rdacarrier Chemistry Electrochemistry Semiconductors Mechanical engineering Electrical engineering Biomedical engineering Electrical Engineering Mechanical Engineering Biomedical Engineering Chemie Kondo, Kazuo Sonstige oth Kada, Morihiro Sonstige oth Takahashi, Kenji Sonstige oth Erscheint auch als Druckausgabe 978-3-319-18674-0 https://doi.org/10.1007/978-3-319-18675-7 Verlag Volltext Springer Fremddatenuebernahme application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis Springer Fremddatenuebernahme application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA Abstract
spellingShingle	Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications Chemistry Electrochemistry Semiconductors Mechanical engineering Electrical engineering Biomedical engineering Electrical Engineering Mechanical Engineering Biomedical Engineering Chemie
title	Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications
title_auth	Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications
title_exact_search	Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications
title_full	Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications Kazuo Kondo, Morihiro Kada, Kenji Takahashi, ed.
title_fullStr	Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications Kazuo Kondo, Morihiro Kada, Kenji Takahashi, ed.
title_full_unstemmed	Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications Kazuo Kondo, Morihiro Kada, Kenji Takahashi, ed.
title_short	Three-Dimensional Integration of Semiconductors
title_sort	three dimensional integration of semiconductors processing materials and applications
title_sub	Processing, Materials, and Applications
topic	Chemistry Electrochemistry Semiconductors Mechanical engineering Electrical engineering Biomedical engineering Electrical Engineering Mechanical Engineering Biomedical Engineering Chemie
topic_facet	Chemistry Electrochemistry Semiconductors Mechanical engineering Electrical engineering Biomedical engineering Electrical Engineering Mechanical Engineering Biomedical Engineering Chemie
url	https://doi.org/10.1007/978-3-319-18675-7 http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA
work_keys_str_mv	AT kondokazuo threedimensionalintegrationofsemiconductorsprocessingmaterialsandapplications AT kadamorihiro threedimensionalintegrationofsemiconductorsprocessingmaterialsandapplications AT takahashikenji threedimensionalintegrationofsemiconductorsprocessingmaterialsandapplications

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