Verfügbarkeit: Three-Dimensional Integration of Semiconductors

Three-Dimensional Integration of Semiconductors: Processing, Materials, and Applications

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Bibliographische Detailangaben
Format:	Elektronisch E-Book
Sprache:	English
Veröffentlicht:	Cham Springer 2015
Schlagworte:	Chemistry Electrochemistry Semiconductors Mechanical engineering Electrical engineering Biomedical engineering Electrical Engineering Mechanical Engineering Biomedical Engineering Chemie
Online-Zugang:	FAW01 UBT01 Volltext Inhaltsverzeichnis Abstract
Beschreibung:	1 Online Ressource (XIX, 408 p. 460 illus., 269 illus. in color)
ISBN:	9783319186757
DOI:	10.1007/978-3-319-18675-7

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Datensatz im Suchindex

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adam_text	THREE-DIMENSIONAL INTEGRATION OF SEMICONDUCTORS / : 2015 TABLE OF CONTENTS / INHALTSVERZEICHNIS RESEARCH AND DEVELOPMENT HISTORY OF THREE DIMENSIONAL (3D) INTEGRATION TECHNOLOGY RECENT RESEARCH AND DEVELOPMENT ACTIVITIES OF THREE DIMENSIONAL (3D) INTEGRATION TECHNOLOGY TSV PROCESSES WAFER AND DIE BONDING PROCESSES METROLOGY AND INSPECTION TSV CHARACTERISTICS AND RELIABILITY: IMPACT OF 3D INTEGRATION PROCESSES ON DEVICE RELIABILITY TRENDS IN 3D INTEGRATED CIRCUIT (3D-IC) TESTING TECHNOLOGY DREAM CHIP PROJECT AT ASET. DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT. THREE-DIMENSIONAL INTEGRATION OF SEMICONDUCTORS / : 2015 ABSTRACT / INHALTSTEXT THIS BOOK STARTS WITH BACKGROUNDCONCERNING THREE-DIMENSIONAL INTEGRATION - INCLUDING THEIRLOW ENERGY CONSUMPTION AND HIGH SPEED IMAGE PROCESSING - AND THEN PROCEEDS TO HOW TO CONSTRUCT THEM AND WHICH MATERIALS TO USE IN PARTICULAR SITUATIONS.THE BOOK COVERS NUMEROUS APPLICATIONS, INCLUDINGNEXT GENERATION SMART PHONES, DRIVING ASSISTANCE SYSTEMS, CAPSULE ENDOSCOPES, HOMING MISSILES, AND MANY OTHERS. THE BOOK CONCLUDES WITH RECENT PROGRESS AND DEVELOPMENTS IN THREE DIMENSIONAL PACKAGING, AS WELL AS FUTURE PROSPECTS DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
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discipline	Chemie / Pharmazie Elektrotechnik / Elektronik / Nachrichtentechnik
doi_str_mv	10.1007/978-3-319-18675-7
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isbn	9783319186757
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spelling	Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications Kazuo Kondo, Morihiro Kada, Kenji Takahashi, ed. Cham Springer 2015 1 Online Ressource (XIX, 408 p. 460 illus., 269 illus. in color) txt rdacontent c rdamedia cr rdacarrier Chemistry Electrochemistry Semiconductors Mechanical engineering Electrical engineering Biomedical engineering Electrical Engineering Mechanical Engineering Biomedical Engineering Chemie Kondo, Kazuo Sonstige oth Kada, Morihiro Sonstige oth Takahashi, Kenji Sonstige oth Erscheint auch als Druckausgabe 978-3-319-18674-0 https://doi.org/10.1007/978-3-319-18675-7 Verlag Volltext Springer Fremddatenuebernahme application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis Springer Fremddatenuebernahme application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA Abstract
spellingShingle	Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications Chemistry Electrochemistry Semiconductors Mechanical engineering Electrical engineering Biomedical engineering Electrical Engineering Mechanical Engineering Biomedical Engineering Chemie
title	Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications
title_auth	Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications
title_exact_search	Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications
title_full	Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications Kazuo Kondo, Morihiro Kada, Kenji Takahashi, ed.
title_fullStr	Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications Kazuo Kondo, Morihiro Kada, Kenji Takahashi, ed.
title_full_unstemmed	Three-Dimensional Integration of Semiconductors Processing, Materials, and Applications Kazuo Kondo, Morihiro Kada, Kenji Takahashi, ed.
title_short	Three-Dimensional Integration of Semiconductors
title_sort	three dimensional integration of semiconductors processing materials and applications
title_sub	Processing, Materials, and Applications
topic	Chemistry Electrochemistry Semiconductors Mechanical engineering Electrical engineering Biomedical engineering Electrical Engineering Mechanical Engineering Biomedical Engineering Chemie
topic_facet	Chemistry Electrochemistry Semiconductors Mechanical engineering Electrical engineering Biomedical engineering Electrical Engineering Mechanical Engineering Biomedical Engineering Chemie
url	https://doi.org/10.1007/978-3-319-18675-7 http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028730137&sequence=000003&line_number=0002&func_code=DB_RECORDS&service_type=MEDIA
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