Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Abschlussarbeit Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Berlin
Springer
[2016]
|
| Schriftenreihe: | Springer theses. Recognizing outstanding Ph.D. research
|
| Schlagworte: | |
| Online-Zugang: | BTU01 FAB01 FAW01 FHA01 FHI01 FHN01 FHR01 FKE01 FRO01 FWS01 FWS02 UBY01 Volltext Inhaltsverzeichnis Abstract |
| Beschreibung: | 1 Online Ressource (xv, 143 Seiten) |
| ISBN: | 9783662488232 |
| DOI: | 10.1007/978-3-662-48823-2 |
Internformat
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Datensatz im Suchindex
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| adam_text | INVESTIGATIONS ON MICROSTRUCTURE AND MECHANICAL PROPERTIES OF THE
CU/PB-FREE SOLDER JOINT INTERFACES
/ ZHANG, QINGKE
: 2016
TABLE OF CONTENTS / INHALTSVERZEICHNIS
RESEARCH PROGRESS IN PB-FREE SOLDERING
FRACTURE BEHAVIOR OF IMCS AT CU/PB-FREE SOLDER INTERFACE
TENSILE-COMPRESS FATIGUE BEHAVIOR OF SOLDER JOINTS
SHEAR CREEP-FATIGUE BEHAVIOR OF CU/PB-FREE SOLDER JOINTS
THERMAL FATIGUE BEHAVIOR OF SN-AG/CU SOLDER JOINTS
CONCLUSIONS
DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
INVESTIGATIONS ON MICROSTRUCTURE AND MECHANICAL PROPERTIES OF THE
CU/PB-FREE SOLDER JOINT INTERFACES
/ ZHANG, QINGKE
: 2016
ABSTRACT / INHALTSTEXT
THIS THESIS PRESENTS A SERIES OF MECHANICAL TEST METHODS AND
COMPREHENSIVELY INVESTIGATES THE DEFORMATION AND DAMAGE BEHAVIOR OF
CU/PB-FREE SOLDER JOINTS UNDER DIFFERENT LOADING CONDITIONS. THE
FRACTURE BEHAVIOR OF PB-FREE JOINT INTERFACES INDUCED BY STRESS,
DEFORMATION OF SOLDER AND SUBSTRATE ARE SHOWN, THE SHEAR FRACTURE
STRENGTH OF THE CU6SN5 IMC IS MEASURED EXPERIMENTALLY FOR THE FIRST
TIME, AND THE DYNAMIC DAMAGE PROCESS AND MICROSTRUCTURE EVOLUTION
BEHAVIOR OF PB-FREE SOLDER JOINTS ARE REVEALED INTUITIVELY. THE THESIS
PUTS FORWARD THE ARGUMENT THAT THE LOCAL CUMULATIVE DAMAGE IS THE MAJOR
CAUSE OF FAILURE IN SOLDER JOINTS. THE RESEARCH RESULTS PROVIDE THE
EXPERIMENTAL AND THEORETICAL BASIS FOR IMPROVING THE RELIABILITY OF
SOLDER JOINTS
DIESES SCHRIFTSTUECK WURDE MASCHINELL ERZEUGT.
|
| any_adam_object | 1 |
| author | Zhang, Qingke |
| author_facet | Zhang, Qingke |
| author_role | aut |
| author_sort | Zhang, Qingke |
| author_variant | q z qz |
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| doi_str_mv | 10.1007/978-3-662-48823-2 |
| format | Thesis Electronic eBook |
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| institution | BVB |
| isbn | 9783662488232 |
| language | English |
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| publisher | Springer |
| record_format | marc |
| series2 | Springer theses. Recognizing outstanding Ph.D. research |
| spellingShingle | Zhang, Qingke Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces Engineering Mechanics Structural mechanics Materials science Materials / Surfaces Thin films Structural Mechanics Surfaces and Interfaces, Thin Films Characterization and Evaluation of Materials Ingenieurwissenschaften |
| subject_GND | (DE-588)4113937-9 |
| title | Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces |
| title_auth | Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces |
| title_exact_search | Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces |
| title_full | Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces Qingke Zhang |
| title_fullStr | Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces Qingke Zhang |
| title_full_unstemmed | Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces Qingke Zhang |
| title_short | Investigations on microstructure and mechanical properties of the Cu/Pb-free solder joint interfaces |
| title_sort | investigations on microstructure and mechanical properties of the cu pb free solder joint interfaces |
| topic | Engineering Mechanics Structural mechanics Materials science Materials / Surfaces Thin films Structural Mechanics Surfaces and Interfaces, Thin Films Characterization and Evaluation of Materials Ingenieurwissenschaften |
| topic_facet | Engineering Mechanics Structural mechanics Materials science Materials / Surfaces Thin films Structural Mechanics Surfaces and Interfaces, Thin Films Characterization and Evaluation of Materials Ingenieurwissenschaften Hochschulschrift |
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