Adaptive cooling of integrated circuits using digital microfluidics:
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Norwood, Mass.
Artech House
©2007
|
| Schriftenreihe: | Artech House integrated microsystems series
|
| Schlagworte: | |
| Online-Zugang: | FAW01 FAW02 Volltext |
| Beschreibung: | Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002 Includes bibliographical references and index Adaptive Cooling of Integrated Circuits Using Digital Microfluidics; Contents 5; Preface 11; Chapter 1 Thermal Management of Integrated Circuits 15; Chapter 2 Cooling Devices for Integrated Circuits 33; Chapter 3 Adaptive Hot-Spot Cooling Principles and Design 49; Chapter 4 Technology Development 77; Chapter 5 Thermal Effects of Digital Microfluidic Devices 105; Chapter 6 Flow-Through-Based Adaptive Cooling 117; Chapter 7 Programmable Thermal Switch-Based Adaptive Cooling 145; Chapter 8 Concluding Remarks 161; Appendix A Image Analysis Software Using MATLAB 167 Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling |
| Beschreibung: | 1 Online-Ressource (203 pages) |
| ISBN: | 1596931388 1596931396 9781596931381 9781596931398 |
Internformat
MARC
| LEADER | 00000nmm a2200000zc 4500 | ||
|---|---|---|---|
| 001 | BV043170545 | ||
| 003 | DE-604 | ||
| 005 | 00000000000000.0 | ||
| 007 | cr|uuu---uuuuu | ||
| 008 | 151126s2007 |||| o||u| ||||||eng d | ||
| 020 | |a 1596931388 |9 1-59693-138-8 | ||
| 020 | |a 1596931396 |c electronic bk. |9 1-59693-139-6 | ||
| 020 | |a 9781596931381 |9 978-1-59693-138-1 | ||
| 020 | |a 9781596931398 |c electronic bk. |9 978-1-59693-139-8 | ||
| 035 | |a (OCoLC)250588022 | ||
| 035 | |a (DE-599)BVBBV043170545 | ||
| 040 | |a DE-604 |b ger |e aacr | ||
| 041 | 0 | |a eng | |
| 049 | |a DE-1046 |a DE-1047 | ||
| 082 | 0 | |a 620.106 |2 22 | |
| 100 | 1 | |a Paik, Philip Y. |e Verfasser |4 aut | |
| 245 | 1 | 0 | |a Adaptive cooling of integrated circuits using digital microfluidics |c Philip Y. Paik, Krishnendu Chakrabarty, Vamsee K. Pamula |
| 264 | 1 | |a Norwood, Mass. |b Artech House |c ©2007 | |
| 300 | |a 1 Online-Ressource (203 pages) | ||
| 336 | |b txt |2 rdacontent | ||
| 337 | |b c |2 rdamedia | ||
| 338 | |b cr |2 rdacarrier | ||
| 490 | 0 | |a Artech House integrated microsystems series | |
| 500 | |a Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002 | ||
| 500 | |a Includes bibliographical references and index | ||
| 500 | |a Adaptive Cooling of Integrated Circuits Using Digital Microfluidics; Contents 5; Preface 11; Chapter 1 Thermal Management of Integrated Circuits 15; Chapter 2 Cooling Devices for Integrated Circuits 33; Chapter 3 Adaptive Hot-Spot Cooling Principles and Design 49; Chapter 4 Technology Development 77; Chapter 5 Thermal Effects of Digital Microfluidic Devices 105; Chapter 6 Flow-Through-Based Adaptive Cooling 117; Chapter 7 Programmable Thermal Switch-Based Adaptive Cooling 145; Chapter 8 Concluding Remarks 161; Appendix A Image Analysis Software Using MATLAB 167 | ||
| 500 | |a Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling | ||
| 650 | 4 | |a Integrated circuits | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING / Material Science |2 bisacsh | |
| 650 | 7 | |a Integrated circuits / Cooling |2 fast | |
| 650 | 7 | |a Integrated circuits / Design and construction |2 fast | |
| 650 | 7 | |a Microfluidics |2 fast | |
| 650 | 7 | |a Circuits intégrés / Refroidissement |2 ram | |
| 650 | 7 | |a Microfluidique / Applications industrielles |2 ram | |
| 650 | 4 | |a Integrated circuits |x Cooling | |
| 650 | 4 | |a Microfluidics | |
| 650 | 4 | |a Integrated circuits |x Design and construction | |
| 700 | 1 | |a Chakrabarty, Krishnendu |e Sonstige |4 oth | |
| 700 | 1 | |a Pamula, Vamsee K. |e Sonstige |4 oth | |
| 856 | 4 | 0 | |u http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=225189 |x Aggregator |3 Volltext |
| 912 | |a ZDB-4-EBA | ||
| 999 | |a oai:aleph.bib-bvb.de:BVB01-028594736 | ||
| 966 | e | |u http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=225189 |l FAW01 |p ZDB-4-EBA |q FAW_PDA_EBA |x Aggregator |3 Volltext | |
| 966 | e | |u http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=225189 |l FAW02 |p ZDB-4-EBA |q FAW_PDA_EBA |x Aggregator |3 Volltext | |
Datensatz im Suchindex
| _version_ | 1804175650275196928 |
|---|---|
| any_adam_object | |
| author | Paik, Philip Y. |
| author_facet | Paik, Philip Y. |
| author_role | aut |
| author_sort | Paik, Philip Y. |
| author_variant | p y p py pyp |
| building | Verbundindex |
| bvnumber | BV043170545 |
| collection | ZDB-4-EBA |
| ctrlnum | (OCoLC)250588022 (DE-599)BVBBV043170545 |
| dewey-full | 620.106 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 620 - Engineering and allied operations |
| dewey-raw | 620.106 |
| dewey-search | 620.106 |
| dewey-sort | 3620.106 |
| dewey-tens | 620 - Engineering and allied operations |
| format | Electronic eBook |
| fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03629nmm a2200553zc 4500</leader><controlfield tag="001">BV043170545</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">151126s2007 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">1596931388</subfield><subfield code="9">1-59693-138-8</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">1596931396</subfield><subfield code="c">electronic bk.</subfield><subfield code="9">1-59693-139-6</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781596931381</subfield><subfield code="9">978-1-59693-138-1</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781596931398</subfield><subfield code="c">electronic bk.</subfield><subfield code="9">978-1-59693-139-8</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)250588022</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV043170545</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-1046</subfield><subfield code="a">DE-1047</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">620.106</subfield><subfield code="2">22</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Paik, Philip Y.</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Adaptive cooling of integrated circuits using digital microfluidics</subfield><subfield code="c">Philip Y. Paik, Krishnendu Chakrabarty, Vamsee K. Pamula</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Norwood, Mass.</subfield><subfield code="b">Artech House</subfield><subfield code="c">©2007</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (203 pages)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Artech House integrated microsystems series</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Includes bibliographical references and index</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Adaptive Cooling of Integrated Circuits Using Digital Microfluidics; Contents 5; Preface 11; Chapter 1 Thermal Management of Integrated Circuits 15; Chapter 2 Cooling Devices for Integrated Circuits 33; Chapter 3 Adaptive Hot-Spot Cooling Principles and Design 49; Chapter 4 Technology Development 77; Chapter 5 Thermal Effects of Digital Microfluidic Devices 105; Chapter 6 Flow-Through-Based Adaptive Cooling 117; Chapter 7 Programmable Thermal Switch-Based Adaptive Cooling 145; Chapter 8 Concluding Remarks 161; Appendix A Image Analysis Software Using MATLAB 167</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Integrated circuits</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">TECHNOLOGY & ENGINEERING / Material Science</subfield><subfield code="2">bisacsh</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Integrated circuits / Cooling</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Integrated circuits / Design and construction</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Microfluidics</subfield><subfield code="2">fast</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Circuits intégrés / Refroidissement</subfield><subfield code="2">ram</subfield></datafield><datafield tag="650" ind1=" " ind2="7"><subfield code="a">Microfluidique / Applications industrielles</subfield><subfield code="2">ram</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Integrated circuits</subfield><subfield code="x">Cooling</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Microfluidics</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Integrated circuits</subfield><subfield code="x">Design and construction</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Chakrabarty, Krishnendu</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="700" ind1="1" ind2=" "><subfield code="a">Pamula, Vamsee K.</subfield><subfield code="e">Sonstige</subfield><subfield code="4">oth</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=225189</subfield><subfield code="x">Aggregator</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-4-EBA</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-028594736</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=225189</subfield><subfield code="l">FAW01</subfield><subfield code="p">ZDB-4-EBA</subfield><subfield code="q">FAW_PDA_EBA</subfield><subfield code="x">Aggregator</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="966" ind1="e" ind2=" "><subfield code="u">http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=225189</subfield><subfield code="l">FAW02</subfield><subfield code="p">ZDB-4-EBA</subfield><subfield code="q">FAW_PDA_EBA</subfield><subfield code="x">Aggregator</subfield><subfield code="3">Volltext</subfield></datafield></record></collection> |
| id | DE-604.BV043170545 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T07:19:39Z |
| institution | BVB |
| isbn | 1596931388 1596931396 9781596931381 9781596931398 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-028594736 |
| oclc_num | 250588022 |
| open_access_boolean | |
| owner | DE-1046 DE-1047 |
| owner_facet | DE-1046 DE-1047 |
| physical | 1 Online-Ressource (203 pages) |
| psigel | ZDB-4-EBA ZDB-4-EBA FAW_PDA_EBA |
| publishDate | 2007 |
| publishDateSearch | 2007 |
| publishDateSort | 2007 |
| publisher | Artech House |
| record_format | marc |
| series2 | Artech House integrated microsystems series |
| spelling | Paik, Philip Y. Verfasser aut Adaptive cooling of integrated circuits using digital microfluidics Philip Y. Paik, Krishnendu Chakrabarty, Vamsee K. Pamula Norwood, Mass. Artech House ©2007 1 Online-Ressource (203 pages) txt rdacontent c rdamedia cr rdacarrier Artech House integrated microsystems series Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002 Includes bibliographical references and index Adaptive Cooling of Integrated Circuits Using Digital Microfluidics; Contents 5; Preface 11; Chapter 1 Thermal Management of Integrated Circuits 15; Chapter 2 Cooling Devices for Integrated Circuits 33; Chapter 3 Adaptive Hot-Spot Cooling Principles and Design 49; Chapter 4 Technology Development 77; Chapter 5 Thermal Effects of Digital Microfluidic Devices 105; Chapter 6 Flow-Through-Based Adaptive Cooling 117; Chapter 7 Programmable Thermal Switch-Based Adaptive Cooling 145; Chapter 8 Concluding Remarks 161; Appendix A Image Analysis Software Using MATLAB 167 Thanks to increasing power consumption and component density, localized?hot spots? are becoming a serious challenge in IC (integrated circuit) chip design? so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling Integrated circuits TECHNOLOGY & ENGINEERING / Material Science bisacsh Integrated circuits / Cooling fast Integrated circuits / Design and construction fast Microfluidics fast Circuits intégrés / Refroidissement ram Microfluidique / Applications industrielles ram Integrated circuits Cooling Microfluidics Integrated circuits Design and construction Chakrabarty, Krishnendu Sonstige oth Pamula, Vamsee K. Sonstige oth http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=225189 Aggregator Volltext |
| spellingShingle | Paik, Philip Y. Adaptive cooling of integrated circuits using digital microfluidics Integrated circuits TECHNOLOGY & ENGINEERING / Material Science bisacsh Integrated circuits / Cooling fast Integrated circuits / Design and construction fast Microfluidics fast Circuits intégrés / Refroidissement ram Microfluidique / Applications industrielles ram Integrated circuits Cooling Microfluidics Integrated circuits Design and construction |
| title | Adaptive cooling of integrated circuits using digital microfluidics |
| title_auth | Adaptive cooling of integrated circuits using digital microfluidics |
| title_exact_search | Adaptive cooling of integrated circuits using digital microfluidics |
| title_full | Adaptive cooling of integrated circuits using digital microfluidics Philip Y. Paik, Krishnendu Chakrabarty, Vamsee K. Pamula |
| title_fullStr | Adaptive cooling of integrated circuits using digital microfluidics Philip Y. Paik, Krishnendu Chakrabarty, Vamsee K. Pamula |
| title_full_unstemmed | Adaptive cooling of integrated circuits using digital microfluidics Philip Y. Paik, Krishnendu Chakrabarty, Vamsee K. Pamula |
| title_short | Adaptive cooling of integrated circuits using digital microfluidics |
| title_sort | adaptive cooling of integrated circuits using digital microfluidics |
| topic | Integrated circuits TECHNOLOGY & ENGINEERING / Material Science bisacsh Integrated circuits / Cooling fast Integrated circuits / Design and construction fast Microfluidics fast Circuits intégrés / Refroidissement ram Microfluidique / Applications industrielles ram Integrated circuits Cooling Microfluidics Integrated circuits Design and construction |
| topic_facet | Integrated circuits TECHNOLOGY & ENGINEERING / Material Science Integrated circuits / Cooling Integrated circuits / Design and construction Microfluidics Circuits intégrés / Refroidissement Microfluidique / Applications industrielles Integrated circuits Cooling Integrated circuits Design and construction |
| url | http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=225189 |
| work_keys_str_mv | AT paikphilipy adaptivecoolingofintegratedcircuitsusingdigitalmicrofluidics AT chakrabartykrishnendu adaptivecoolingofintegratedcircuitsusingdigitalmicrofluidics AT pamulavamseek adaptivecoolingofintegratedcircuitsusingdigitalmicrofluidics |