Materials for high-density electronic packaging and interconnection:
Gespeichert in:
| Körperschaft: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Washington, D.C.
National Academy Press
1990
|
| Schlagworte: | |
| Online-Zugang: | FAW01 FAW02 Volltext |
| Beschreibung: | Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. - Available from Defense Technical Information Center, Cameron Station. - "NMAB-449." Includes bibliographical references |
| Beschreibung: | 1 Online-Ressource (xiv, 139 pages) |
| ISBN: | 030904233X 0585143951 9780309042338 9780585143958 |
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Datensatz im Suchindex
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| author_corporate | National Research Council (U.S.) Committee on Materials for High-Density Electronic Packaging |
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| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
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| indexdate | 2024-07-10T07:18:53Z |
| institution | BVB |
| isbn | 030904233X 0585143951 9780309042338 9780585143958 |
| language | English |
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| spelling | National Research Council (U.S.) Committee on Materials for High-Density Electronic Packaging Verfasser aut Materials for high-density electronic packaging and interconnection Washington, D.C. National Academy Press 1990 1 Online-Ressource (xiv, 139 pages) txt rdacontent c rdamedia cr rdacarrier Report of the Committee on Materials for High-Density Electronic Packaging, National Materials Advisory Board, Commission on Engineering and Technical Systems, National Research Council. - Available from Defense Technical Information Center, Cameron Station. - "NMAB-449." Includes bibliographical references TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Electronic packaging / Materials fast Electronic packaging Materials http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=14491 Aggregator Volltext |
| spellingShingle | Materials for high-density electronic packaging and interconnection TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Electronic packaging / Materials fast Electronic packaging Materials |
| title | Materials for high-density electronic packaging and interconnection |
| title_auth | Materials for high-density electronic packaging and interconnection |
| title_exact_search | Materials for high-density electronic packaging and interconnection |
| title_full | Materials for high-density electronic packaging and interconnection |
| title_fullStr | Materials for high-density electronic packaging and interconnection |
| title_full_unstemmed | Materials for high-density electronic packaging and interconnection |
| title_short | Materials for high-density electronic packaging and interconnection |
| title_sort | materials for high density electronic packaging and interconnection |
| topic | TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Electronic packaging / Materials fast Electronic packaging Materials |
| topic_facet | TECHNOLOGY & ENGINEERING / Electronics / Microelectronics TECHNOLOGY & ENGINEERING / Electronics / Digital Electronic packaging / Materials Electronic packaging Materials |
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