Integrated interconnect technologies for 3D nanoelectronic systems:
Gespeichert in:
| Format: | Elektronisch E-Book |
|---|---|
| Sprache: | English |
| Veröffentlicht: |
Boston, Mass.
Artech House
©2009
|
| Schriftenreihe: | Artech House integrated microsystems series
|
| Schlagworte: | |
| Online-Zugang: | FAW01 FAW02 Volltext |
| Beschreibung: | Includes bibliographical references and index Integrated Interconnect Technologies for 3D Nanoelectronic Systems; Contents; Foreword; Preface; Chapter 1: Revolutionary Silicon AncillaryTechnologies for the Next Era of Gigascale Integration; Chapter 2: Chip-Package Interaction and Reliability Impact on Cu/Low-k Interconnects; Chapter 3: Mechanically Compliant I/O Interconnects and Packaging; Chapter 4: Power Delivery to Silicon; Chapter 5: On-Chip Power Supply Noise Modeling for Gigascale 2D and 3D Systems; Chapter 6: Off-Chip Signaling; Chapter 7: Optical Interconnects for Chip-to-Chip Signaling This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source |
| Beschreibung: | 1 Online-Ressource (xx, 528 pages) |
| ISBN: | 1596932465 1596932473 9781596932463 9781596932470 |
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| id | DE-604.BV043091370 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T07:17:09Z |
| institution | BVB |
| isbn | 1596932465 1596932473 9781596932463 9781596932470 |
| language | English |
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| physical | 1 Online-Ressource (xx, 528 pages) |
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| publishDate | 2009 |
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| series2 | Artech House integrated microsystems series |
| spelling | Integrated interconnect technologies for 3D nanoelectronic systems Muhannad S. Bakir, James D. Meindl, editors Boston, Mass. Artech House ©2009 1 Online-Ressource (xx, 528 pages) txt rdacontent c rdamedia cr rdacarrier Artech House integrated microsystems series Includes bibliographical references and index Integrated Interconnect Technologies for 3D Nanoelectronic Systems; Contents; Foreword; Preface; Chapter 1: Revolutionary Silicon AncillaryTechnologies for the Next Era of Gigascale Integration; Chapter 2: Chip-Package Interaction and Reliability Impact on Cu/Low-k Interconnects; Chapter 3: Mechanically Compliant I/O Interconnects and Packaging; Chapter 4: Power Delivery to Silicon; Chapter 5: On-Chip Power Supply Noise Modeling for Gigascale 2D and 3D Systems; Chapter 6: Off-Chip Signaling; Chapter 7: Optical Interconnects for Chip-to-Chip Signaling This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source Engineering Electrical engineering TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Interconnects (Integrated circuit technology) fast Nanoelectronics fast Telecommunication systems fast Ingenieurwissenschaften Interconnects (Integrated circuit technology) Telecommunication systems Nanoelectronics Bakir, Muhannad S. Sonstige oth Meindl, James D. Sonstige oth http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=284231 Aggregator Volltext |
| spellingShingle | Integrated interconnect technologies for 3D nanoelectronic systems Engineering Electrical engineering TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Interconnects (Integrated circuit technology) fast Nanoelectronics fast Telecommunication systems fast Ingenieurwissenschaften Interconnects (Integrated circuit technology) Telecommunication systems Nanoelectronics |
| title | Integrated interconnect technologies for 3D nanoelectronic systems |
| title_auth | Integrated interconnect technologies for 3D nanoelectronic systems |
| title_exact_search | Integrated interconnect technologies for 3D nanoelectronic systems |
| title_full | Integrated interconnect technologies for 3D nanoelectronic systems Muhannad S. Bakir, James D. Meindl, editors |
| title_fullStr | Integrated interconnect technologies for 3D nanoelectronic systems Muhannad S. Bakir, James D. Meindl, editors |
| title_full_unstemmed | Integrated interconnect technologies for 3D nanoelectronic systems Muhannad S. Bakir, James D. Meindl, editors |
| title_short | Integrated interconnect technologies for 3D nanoelectronic systems |
| title_sort | integrated interconnect technologies for 3d nanoelectronic systems |
| topic | Engineering Electrical engineering TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Interconnects (Integrated circuit technology) fast Nanoelectronics fast Telecommunication systems fast Ingenieurwissenschaften Interconnects (Integrated circuit technology) Telecommunication systems Nanoelectronics |
| topic_facet | Engineering Electrical engineering TECHNOLOGY & ENGINEERING / Electronics / Microelectronics TECHNOLOGY & ENGINEERING / Electronics / Digital Interconnects (Integrated circuit technology) Nanoelectronics Telecommunication systems Ingenieurwissenschaften |
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