Reflow soldering processes: SMT, BGA, CSP and flip chip technologies
Gespeichert in:
| 1. Verfasser: | |
|---|---|
| Format: | Elektronisch E-Book |
| Sprache: | English |
| Veröffentlicht: |
Boston
Newnes
c2002
|
| Schlagworte: | |
| Online-Zugang: | FAW01 FAW02 Volltext |
| Beschreibung: | Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002 Includes bibliographical references and index Introduction to Surface Mount Electronic Packaging Technology; Fundamentals of Solders and Soldering (includes Soldering Theory, Effect of Elemental Constituents on Wetting, Phase Diagram and Soldering, Microstructure and Soldering, Effect of Impurities on Soldering); Solder Paste Technology (includes Fluxing Reactions, Flux Chemistry, Solder Powder, Solder Paste Composition and Manufacturing, Solder Paste Rheology); Surface Mount Assembly Processes (includes Solder Paste Materials, Printer Level Consideration, Effect of Reflow Atmosphere on Soldering, Solder Joint Inspection, In-Circuit Testing); SMT Problems Prior to Reflow (includes Flux Separation, Crusting, Paste Hardening, Poor Stencil Life, Poor Print Thickness, Squeegee Hanging, Slump, Poor Print Quality, Needle Clogging, Low Tack); SMT Problems During Reflow; SMT Problems After Reflow; BGA and CSP Solder Bumping BGA, CSP, and Flip Chip Solder Bumping; BGA and CSP Board Level Assembly (including ; Problems Occurred at Assembly Stage and Rework); BGA and CSP Rework; Flip Chip Reflow Soldering; Optimizing Reflow Profile via Defect Mechanisms Analysis; Lead-Free Soldering Trends of Solder Paste and Flux Technology; How to Select Solder Pastes or Fluxes; Conclusions; Appendix; References; Index Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process, --and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process |
| Beschreibung: | 1 Online-Ressource (ix, 270 p.) |
| ISBN: | 008049224X 0750672188 9780080492247 9780750672184 |
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| 500 | |a Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process, --and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process | ||
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Datensatz im Suchindex
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| any_adam_object | |
| author | Lee, Ning-Cheng |
| author_facet | Lee, Ning-Cheng |
| author_role | aut |
| author_sort | Lee, Ning-Cheng |
| author_variant | n c l ncl |
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| dewey-search | 621.381/046 |
| dewey-sort | 3621.381 246 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Electronic eBook |
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| id | DE-604.BV043044547 |
| illustrated | Not Illustrated |
| indexdate | 2024-07-10T07:15:51Z |
| institution | BVB |
| isbn | 008049224X 0750672188 9780080492247 9780750672184 |
| language | English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-028469084 |
| oclc_num | 159936926 |
| open_access_boolean | |
| owner | DE-1046 DE-1047 |
| owner_facet | DE-1046 DE-1047 |
| physical | 1 Online-Ressource (ix, 270 p.) |
| psigel | ZDB-4-EBA ZDB-4-EBA FAW_PDA_EBA |
| publishDate | 2002 |
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| publisher | Newnes |
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| spelling | Lee, Ning-Cheng Verfasser aut Reflow soldering processes SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee Boston Newnes c2002 1 Online-Ressource (ix, 270 p.) txt rdacontent c rdamedia cr rdacarrier Master and use copy. Digital master created according to Benchmark for Faithful Digital Reproductions of Monographs and Serials, Version 1. Digital Library Federation, December 2002 Includes bibliographical references and index Introduction to Surface Mount Electronic Packaging Technology; Fundamentals of Solders and Soldering (includes Soldering Theory, Effect of Elemental Constituents on Wetting, Phase Diagram and Soldering, Microstructure and Soldering, Effect of Impurities on Soldering); Solder Paste Technology (includes Fluxing Reactions, Flux Chemistry, Solder Powder, Solder Paste Composition and Manufacturing, Solder Paste Rheology); Surface Mount Assembly Processes (includes Solder Paste Materials, Printer Level Consideration, Effect of Reflow Atmosphere on Soldering, Solder Joint Inspection, In-Circuit Testing); SMT Problems Prior to Reflow (includes Flux Separation, Crusting, Paste Hardening, Poor Stencil Life, Poor Print Thickness, Squeegee Hanging, Slump, Poor Print Quality, Needle Clogging, Low Tack); SMT Problems During Reflow; SMT Problems After Reflow; BGA and CSP Solder Bumping BGA, CSP, and Flip Chip Solder Bumping; BGA and CSP Board Level Assembly (including ; Problems Occurred at Assembly Stage and Rework); BGA and CSP Rework; Flip Chip Reflow Soldering; Optimizing Reflow Profile via Defect Mechanisms Analysis; Lead-Free Soldering Trends of Solder Paste and Flux Technology; How to Select Solder Pastes or Fluxes; Conclusions; Appendix; References; Index Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process, --and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Electric connectors fast Electronic apparatus and appliances / Design and construction fast Electronic packaging fast Solder and soldering fast Electronic apparatus and appliances Design and construction Solder and soldering Electronic packaging Electric connectors http://search.ebscohost.com/login.aspx?direct=true&scope=site&db=nlebk&db=nlabk&AN=195116 Aggregator Volltext |
| spellingShingle | Lee, Ning-Cheng Reflow soldering processes SMT, BGA, CSP and flip chip technologies TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Electric connectors fast Electronic apparatus and appliances / Design and construction fast Electronic packaging fast Solder and soldering fast Electronic apparatus and appliances Design and construction Solder and soldering Electronic packaging Electric connectors |
| title | Reflow soldering processes SMT, BGA, CSP and flip chip technologies |
| title_auth | Reflow soldering processes SMT, BGA, CSP and flip chip technologies |
| title_exact_search | Reflow soldering processes SMT, BGA, CSP and flip chip technologies |
| title_full | Reflow soldering processes SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee |
| title_fullStr | Reflow soldering processes SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee |
| title_full_unstemmed | Reflow soldering processes SMT, BGA, CSP and flip chip technologies Ning-Cheng Lee |
| title_short | Reflow soldering processes |
| title_sort | reflow soldering processes smt bga csp and flip chip technologies |
| title_sub | SMT, BGA, CSP and flip chip technologies |
| topic | TECHNOLOGY & ENGINEERING / Electronics / Microelectronics bisacsh TECHNOLOGY & ENGINEERING / Electronics / Digital bisacsh Electric connectors fast Electronic apparatus and appliances / Design and construction fast Electronic packaging fast Solder and soldering fast Electronic apparatus and appliances Design and construction Solder and soldering Electronic packaging Electric connectors |
| topic_facet | TECHNOLOGY & ENGINEERING / Electronics / Microelectronics TECHNOLOGY & ENGINEERING / Electronics / Digital Electric connectors Electronic apparatus and appliances / Design and construction Electronic packaging Solder and soldering Electronic apparatus and appliances Design and construction |
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