Robust design of microelectronics assemblies against mechanical shock, temperature and moisture:
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
Amsterdam [u.a.]
Elsevier
2015
|
Schriftenreihe: | Woodhead publishing series in electronic and optical materials
81 |
Online-Zugang: | Volltext |
Beschreibung: | 1 Online-Ressource (XVIII, 457 S.) Ill., graph. Darst. |
ISBN: | 9780857099112 9781845695286 |
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id | DE-604.BV042881590 |
illustrated | Illustrated |
indexdate | 2024-07-31T01:10:29Z |
institution | BVB |
isbn | 9780857099112 9781845695286 |
language | English |
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physical | 1 Online-Ressource (XVIII, 457 S.) Ill., graph. Darst. |
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publishDate | 2015 |
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publisher | Elsevier |
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series | Woodhead publishing series in electronic and optical materials |
series2 | Woodhead publishing series in electronic and optical materials |
spelling | Wong, E.-H. Verfasser aut Robust design of microelectronics assemblies against mechanical shock, temperature and moisture E.-H. Wong and Y.-W. Mai Amsterdam [u.a.] Elsevier 2015 1 Online-Ressource (XVIII, 457 S.) Ill., graph. Darst. txt rdacontent c rdamedia cr rdacarrier Woodhead publishing series in electronic and optical materials 81 Mai, Yiu-Wing 1946- Verfasser (DE-588)172246105 aut Woodhead publishing series in electronic and optical materials 81 (DE-604)BV042543615 81 http://app.knovel.com/web/toc.v/cid:kpRDMAAMS1/viewerType:toc/root_slug:robust-design-microelectronics Aggregator Volltext |
spellingShingle | Wong, E.-H Mai, Yiu-Wing 1946- Robust design of microelectronics assemblies against mechanical shock, temperature and moisture Woodhead publishing series in electronic and optical materials |
title | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture |
title_auth | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture |
title_exact_search | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture |
title_full | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture E.-H. Wong and Y.-W. Mai |
title_fullStr | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture E.-H. Wong and Y.-W. Mai |
title_full_unstemmed | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture E.-H. Wong and Y.-W. Mai |
title_short | Robust design of microelectronics assemblies against mechanical shock, temperature and moisture |
title_sort | robust design of microelectronics assemblies against mechanical shock temperature and moisture |
url | http://app.knovel.com/web/toc.v/cid:kpRDMAAMS1/viewerType:toc/root_slug:robust-design-microelectronics |
volume_link | (DE-604)BV042543615 |
work_keys_str_mv | AT wongeh robustdesignofmicroelectronicsassembliesagainstmechanicalshocktemperatureandmoisture AT maiyiuwing robustdesignofmicroelectronicsassembliesagainstmechanicalshocktemperatureandmoisture |