Microelectronic packaging in the 21st century: honorary volume on the occasion of Klaus-Dieter Lang's 60th birthday
Gespeichert in:
| Weitere Verfasser: | , |
|---|---|
| Format: | Buch |
| Sprache: | German English |
| Veröffentlicht: |
Stuttgart
Fraunhofer-Verl.
2015
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| Schlagworte: | |
| Online-Zugang: | Inhaltsverzeichnis |
| Beschreibung: | Beitr. teilw. dt., teilw. engl. - Literaturangaben |
| Beschreibung: | 411 S. Ill., graph. Darst. 25 cm |
| ISBN: | 9783839608265 3839608260 |
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| 245 | 1 | 0 | |a Microelectronic packaging in the 21st century |b honorary volume on the occasion of Klaus-Dieter Lang's 60th birthday |c [Fraunhofer IZM]. Rolf Aschenbrenner ; Martin Schneider-Ramelow (eds.) |
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Datensatz im Suchindex
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| adam_text | TABLE OF CONTENTS
CHAPTER I: OVERVIEW ARTICLES
PACKAGING IN THE LOT ERA 16
HERBERT REICHL
PACKAGING FOR ADVANCED MICROSYSTEMS 25
GUIDO SPINOLA DURANTE, MARK FRETZ,
EDITH RUTZ-INNERHOFER, RONY JOSE JAMES,
SANDRA GIUDICE, STEFAN MOHRDIEK, PHILIPPE NIEDERMANN,
JOERG PIERER,
CHRISTIAN BOSSHARD
SMART SYSTEMS INTEGRATION - SHORT REVIEW AND FURTHER DEVELOPMENT 32
OF SMART SYSTEMS
THOMAS GESSNER, MARTINA
VOGEL, KARLA
HILLER, THOMAS OTTO, STEFFEN KURTH,
JOERG NESTLER, THOMAS KOEHLER
3D WAFER LEVEL INTEGRATION - STATUS AND REQUIREMENTS 39
M. JUERGEN WOLF, KLAUS-DIETER LANG
THE TAO OF PACKAGING DNA - WIREBOND, FLIP CHIP AND WAFER LEVEL 45
PACKAGING
WILLIAM CHEN, JOHN HUNT
PLASTIC ENCAPSULATED DEVICES FOR HIGH-REL, WHERE HERMETICS FAIL 50
NIHAL SINNADURAI
ELECTROSTATIC SELF-ASSEMBLY ON A LIQUID FILM FOR THE HIGH-PRECISION 57
MOUNTING OF MEMS
MARCEL TONDORF, YIFEI GAN,
JUERGEN WILDE
ON THE APPLICATION OF THE M3-APPROACH FOR OPTIMIZATION OF INTEGRATED 64
ANTENNAS AND HIGH-SPEED SYSTEM PACKAGES
MICHA BIERWIRTH, BRIAN CURRAN, XIAOMIN DUAN, GERHARD FOTHERINGHAM,
KLAUS-DIETER LANG, UWE MAASS, IVAN NDIP, CHRISTIAN TSCHOBAN
* CHAPTER II: ADVANCED PCB PACKAGING
DAS MULTI-FUNKTIONALE BOARD - HETEROGENE SYSTEMINTEGRATION AUF 74
LEITERPLATTENBASIS
JAN KOSTELNIK
AKTUELLE ANFORDERUNGEN UND NEUE LOESUNGSANSAETZE IM MICROELECTRONIC 79
PACKAGING
LUTZ MATTHEIER, WERNER SCHNEIDER
HTTP://D-NB.INFO/1064340849
GLASS BASED ELECTRO-OPTICAL PCB TECHNOLOGY WITH GRADIENT-INDEX 84
MULTIMODE WAVEGUIDES
HENNING SCHROEDER, LARS
BRUSBERG
FAN-OUT PANEL LEVEL PACKING FOR SYSTEM INTEGRATION 88
TANJA BRAUN, KARL-FRIEDRICH
BECKER, STEVE VOGES,
JOERG BAUER, RUEBEN
KAHLE, VOLKER
BADER, TINA THOMAS, ROLF
ASCHENBRENNER, KLAUS-DIETER LANG
LEAD-FREE SOLDER ALLOY OPTIMIZATION FOR IMPROVED RELIABILITY - INTERFACE
97
CHARACTERIZATION
HANS-JUERGEN ALBRECHT
DIE INDUSTRIALISIERUNG DER CHIPEMBEDDINGTECHNOLOGIE 108
HANNES STAHR
QUO VADIS DEUTSCHE LEITERPLATTEN-INDUSTRIE? 116
UDO BECHTLOFF
* CHAPTER III: MATERIAL & PROCESS DEVELOPMENT
NEUE MATERIALIEN FUER DAS THERMISCHE MANAGEMENT ELEKTRONISCHER 120
BAUGRUPPEN
MATHIAS NOWOTTNICK, ANDREJ NOVIKOV, FELIX BREMERKAMP,
DANIEL LEXOW
UNTERSUCHUNGEN ZUR TRAGKRAFT DES LOTES 125
HANS BELL, SEBASTIAN STEGMAIER
ASSEMBLY MATERIALS FOR HIGH TEMPERATURE APPLICATION 131
JOERG TROEDLER
AUFBAU- UND VERBINDUNGSTECHNIK FUER HOCHTEMPERATURSENSORIK 137
PETER SAETTLER,
KATHARINA SCHULZ,
KLAUS-JUERGEN WOLTER, UWE PARTSCH
INVESTIGATION OF LOCAL MATERIALS PROPERTIES OF THERMAL CYDED 143
CU PLATED-THROUGH-HOLES (PTHS)
HANS WALTER, MARIAN BROLL, SASKIA HUBER, ASTRID GOLLHARDT, OLAF WITTLER
DEVELOPMENT OF ORGANIC FIELD-EFFECT TRANSISTORS BASED ON
SEMICONDUCTING LIQUID-CRYSTAL POLYMERS
KORNELIUS TETZNER, KARLHEINZ BOCK
149
* CHAPTER IV: POWER ELECTRONICS
INTERCONNECTION TECHNOLOGIES FOR HIGHLY RELIABLE POWER MODULES WITH 158
HIGH CURRENT CARRYING CAPABILITY AND EXCELLENT THERMAL PROPERTIES
MARTIN BECKER, RONALD EISELE,
FRANK OSTERWALD, JACEK
RUDZKI
SMART POWER MODULE MOLDING FOR HIGH TEMPERATURES 162
TINA THOMAS, KARL-FRIEDRICH
BECKER, MARIUS VAN DIJK, OLAF
WITTLER, TANJA BRAUN,
JOERG BAUER,
KLAUS-DIETER LANG
SMART POWER MECHANICS - DIE ZUKUNFT ELEKTRISCHER 172
ANSCHLUSSTECHNOLOGIEN
THOMAS SCHREIER-ALT, FRANK ANSORGE, CHRISTIAN
BAAR, TONY AMENDE
PACKAGES FOR FAST SWITCHING HV GAN POWER DEVICES 178
KIRILL KLEIN, ECKART
HOENE, KLAUS-DIETER LANG
DRAHTBONDS JENSEITS DER MIKROELEKTRONIK: DAS GEGENTEIL 185
VON MINIATURISIERUNG
FARHAD FARASSAT, UWE NACKE, JOSEF
SEDLMAIR
AL-CLAD CU WIRE BONDS MULTIPLY POWER CYDING LIFETIME OF 188
ADVANCED POWER MODULES
RALF SCHMIDT,
UWE SCHEUERMANN, EUGEN MILKE
VERBINDUNGSTECHNOLOGIEN FUER ERHOEHTE EINSATZTEMPERATUREN 194
MIKROELEKTRONISCHER ANWENDUNGEN
CHRISTIAN EHRHARDT, MATTHIAS HUTTER, CONSTANZE WEBER, LENA GOULLON,
HERMANN OPPERMANN
EMBEDDING TECHNOLOGY FOR THE REALIZATION OF POWER MODULES 200
LARS BOETTCHER, ANDREAS OSTMANN, STEFAN KARASZKIEWICZ,
DIONYSIOS MANESSIS,
KLAUS-DIETER LANG
* CHAPTER V: WAFER LEVEL SYSTEM INTEGRATION
ASSEMBLY AND PACKAGING MAKES THE DIFFERENCE - THE EWLB TECHNOLOGY 210
KLAUS PRESSEL, GOTTFRIED BEER,
BERND ROEMER
COMING CHALLENGES FOR SILICON INTERPOSERS 216
GILLES POUPON, CHARLES FORT
CHALLENGES IN 3D INTEGRATION, ASSEMBLY AND TEST TECHNOLOGIES 220
JUERGEN GRAEFE, CATHARINA RUDOLPH, IRENE BARTUSSECK, STEPHAN DOBRITZ,
WIELAND WAHRMUND, ALEXANDER WOLLANKE, KEVIN WAGENITZ, MARIO SCHIMA,
STEFFEN MIMIETZ, MICHAEL LORENZ, ROBERT WENDLING, HOLGER WACHMUTH
HETEROGENEOUS 3D WAFER LEVEL INTEGRATION BASED ON TSV SILICON 227
INTERPOSER TECHNOLOGY
KAI ZOSCHKE, CHARLES-ALIX MANIER,
MARTIN WILKE
APPLICATION OF THIN FILM POLYMERS FOR PACKAGING ELECTRONIC SYSTEMS 234
MICHAEL TOEPPER, THORSTEN FISCHER, ROBERT
GERNHARDT, KARIN HAUCK,
CHRISTINA LOPPER, MARTIN WILKE,
MARKUS WOEHRMANN
WAFER-LEVEL INTEGRATION OF INP DHBT AND SI BICMOS FOR 237
HIGH-PERFORMANCE MM-WAVE ELECTRONIC CIRCUITS
NILS WEIMANN, VIKTOR KROZER,
WOLFGANG HEINRICH, GUENTHER TRAENKLE, MARCO LISKER,
CHAFIK MELIANI, BERND TILLACK
THIN CHIP ASSEMBLY FOR HYBRID PIXEL DETECTORS 245
THOMAS FRITZSCH, KAI ZOSCHKE, MARKUS WOEHRMANN, MARIO ROTHERMUND, FABIAN
HUEGGING, OSWIN EHRMANN, HERMANN
OPPERMANN
VACUUM PACKAGING AT WAFER LEVEL FOR MEMS USING GOLD-TIN METALLURGY 251
CHARLES-ALIX MANIER, KAI ZOSCHKE,
HERMANN OPPERMANN, DAVID RUFFIEUX, SILVIO
DALLA PIAZZA, TOMMI
SUNI, JAMES DEKKER, GIORGIO ALLEGATO
* CHAPTER VI: RELIABILITY, QUALITY, TEST & CONDITION MONITORING
MULTI-SCALE CHARACTERIZATION OF COPPER TSV STRUCTURES IN 3D IC STACKS
262
EHRENFRIED ZSCHECH, MARTIN GALL,
SVEN NIESE, MARKUS LOEFFLER
INNOVATIVE MATERIAL DIAGNOSTICS METHODS FOR THROUGH SILICON VIA 266
TECHNOLOGIES
FRANK ALTMANN, SEBASTIAN BRAND,
THOMAS HOECHE, MICHAEL KRAUSE,
MATTHIAS PETZOLD
ADVANCED MECHANICAL STRESS MEASUREMENT FOR BEOL STACKS 272
AND 3D IC INTEGRATION
DIETMAR VOGEL, ELLEN
AUERSWALD, BERND MICHEL,
SVEN RZEPKA
ADVANCED APPROACH OF CALCULATING WIRE BOND PULL TEST CORRECTION 277
FACTORS
STEFAN SCHMITZ, JOHANNES KRIPFGANS, MARTIN
SCHNEIDER-RAMELOW, WOLFGANG H.
MUELLER, KLAUS-DIETER LANG
RELIABILITY IMPROVEMENTS IN ELECTRONIC SYSTEMS BY COMBINING CONDITION
284
MONITORING APPROACHES
KATHLEEN JERCHEL, MICHAEL KRUEGER, ANDREAS
MIDDENDORF, NILS F. NISSEN,
KLAUS-DIETER LANG
CLOUD-BASED SENSOR-NETWORKS FOR WIRELESS CONDITION MONITORING
MICHAEL NIEDERMAYER, CARSTEN HOHERZ,
DENIS REINHARDT, HENDRIK SCHOLTZ,
STEPHAN BENECKE, ANDREAS MIDDENDORF
291
FRAUNHOFER-INNOVATIONSDUSTER: MAINTENANCE, REPAIR AND OVERHAUL 295
ECKART UHLMANN, MARTIN BILZ
* CHAPTER VII: MODELING & SIMULATION
APPROACHES FOR SYSTEM RELIABILITY IN CONSIDERATION OF APPLICATION 300
ORIENTED LOADS AS WELL AS PHYSICS-OF-FAILURE
STEFAN STRAUBE, DANIEL HAHN,
KATHLEEN JERCHEL, ANDREAS
MIDDENDORF,
KLAUS-DIETER LANG
VARIATION OF PLASTIC MATERIALS DATA OF COPPER AND ITS IMPACT ON THE 305
DURABILITY OF CU-VIA INTERCONNECTS
B. EMEK
ABALI, PAUL LOFINK, WOLFGANG H. MUELLER
ERHOEHUNG DER ZUVERLAESSIGKEIT VON MIKRO- UND NANOKOMPONENTEN 309
UND SYSTEMEN DURCH MODERNE RISSVERMEIDUNGSSTRATEGIEN
BERND MICHEL, THOMAS WINKLER, MOHAMAD ABO RAS
DOUBLE-SIDED COOLING AND TRANSIENT THERMO-ELECTRICAL MANAGEMENT OF 313
SILICON ON DCB SUBSTRATES FOR POWER CONVERTERS: DESIGN, TECHNOLOGY
AND TEST
BERNHARD WUNDERLE, MARTIN SPRINGBORN, DANIEL MAY, CHARLES-ALIX MANIER,
MOHAMAD ABO RAS, RAUL MROSSKO, HERMANN OPPERMANN, TOBIAS XHONNEUX,
TRISTAN CAROFF, WILHELM MAURER, RADOSLAVA MITOVA
PARAMETRISCHES TRANSIENTES THERMO-ELEKTRISCHES PSPICE MODELL 325
FUER EIN STROMKABEL
RALPH SCHACHT
OPTIMIZATION OF LIFE CYDE COST AND SELECTION OF LAMINATE MATERIAL 332
FOR OPTIMUM THERMAL CYDING RESISTANCE
VIKTOR TIEDERLE
FINITE ELEMENT SIMULATIONS - A WELL-SUITED TOOL FOR THE DEVELOPMENT 337
OF ADVANCED POWER ELECTRONIC SYSTEMS
JOHANN-PETER SOMMER,
RAINER DUDEK, RALF DOERING
MODELLING THE LIFETIME OF ALUMINUM HEAVY WIRE BOND JOINTS WITH A 342
CRACK PROPAGATION LAW
ARIAN GRAMS, TOBIAS
PREWITZ, OLAF WITTLER, STEFAN SCHMITZ,
ANDREAS MIDDENDORF, KLAUS-DIETER LANG
RAFFUNGSMODELLE FUER DIE QUALIFIKATION VON EINPRESSKONTAKTEN FUER 349
LEITERPLATTEN
THOMAS SCHREIER-ALT, DANIEL HEIMERLE, KARL RING, ANGELIKA MOEHLER,
CHRISTIAN BAAR, FRANK ANSORGE, MICHAEL SCHWAB
* CHAPTER VIII: SELECTED APPLICATION HIGHLIGHTS
APPROACHES FOR SYSTEM RELIABILITY IN CONSIDERATION OF APPLICATION 360
ORIENTED LOADS AS WELL AS PHYSICS-OF-FAILURE
STEFAN STRAUBE, DANIEL HAHN, KATHLEEN
JERCHEL, ANDREAS MIDDENDORF,
KLAUS-DIETER LANG
IMPLANTABLE MICRO AND NANODEVICES: OPPORTUNITIES AND CHALLENGES 369
IN REVOLUTIONIZING HEALTH CARE
FLORIAN SOLZBACHER
INNOVATIVE MEDICAL ENGINEERING - CHALLENGES FOR ELECTRONICS PACKAGING
373
DAVID WAGNER, BERTRAM SCHMIDT, MARKUS DETERT
AEMTEC - EIN EMS, JETZT AUCH FUER IMPLANTATE
INGOLF SCHLOSSER
LENSLESS MICROSCOPY OF CELL CULTURES - HOLOGRAPHIE LIVE CELL IMAGING 377
IN NEW DIMENSIONS
MORITZ HUBL, MARTIN BLECHERT, MAIK
ENGELHARDT, ANETA ZIOLKOWSKA,
ERIK JUNG,
LEOPOLD GEORGI
FUTURE HIGH SECURITY ID DOCUMENTS BASED ON INNOVATIVE MICROSYSTEM 381
TECHNOLOGIES
JOACHIM KLOESER
ET AL.
ADVANCED LIQUID-FREE, PIEZORESISTIVE, SOI-BASED PRESSURE SENSOR 387
CONCEPTS FOR MEASUREMENTS IN HARSH ENVIRONMENTS
HA-DUONG NGO, BISWAIJIT MUKHOPADHYAY, OSWIN
EHRMANN, KLAUS-DIETER LANG
DEVELOPMENT OF INTEGRATED LITHIUM ION MICRO BATTERIES 392
ROBERT HAHN, KATRIN HOEPPNER,
MARC FERCH, KRYSTAN
MARQUARDT,
KLAUS-DIETER LANG
LARGE AREA SENSOR INTEGRATION IN TEXTILES 400
CHRISTINE KAILMAYER, ERIK SIMON
SOPRO - SELBSTORGANISIERENDE PRODUKTION
ECKART UHLMANN, ECKHARD HOHWIELER, MANFRED KRAFT
406
|
| any_adam_object | 1 |
| author2 | Aschenbrenner, Rolf Schneider-Ramelow, Martin |
| author2_role | edt edt |
| author2_variant | r a ra m s r msr |
| author_GND | (DE-588)1070288225 |
| author_facet | Aschenbrenner, Rolf Schneider-Ramelow, Martin |
| building | Verbundindex |
| bvnumber | BV042814382 |
| classification_rvk | ZN 4192 |
| ctrlnum | (OCoLC)924396426 (DE-599)DNB1064340849 |
| dewey-full | 621.381046 |
| dewey-hundreds | 600 - Technology (Applied sciences) |
| dewey-ones | 621 - Applied physics |
| dewey-raw | 621.381046 |
| dewey-search | 621.381046 |
| dewey-sort | 3621.381046 |
| dewey-tens | 620 - Engineering and allied operations |
| discipline | Elektrotechnik / Elektronik / Nachrichtentechnik |
| format | Book |
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| genre | (DE-588)4143413-4 Aufsatzsammlung gnd-content (DE-588)4016928-5 Festschrift gnd-content |
| genre_facet | Aufsatzsammlung Festschrift |
| id | DE-604.BV042814382 |
| illustrated | Illustrated |
| indexdate | 2024-07-10T07:10:14Z |
| institution | BVB |
| institution_GND | (DE-588)10023208-5 |
| isbn | 9783839608265 3839608260 |
| language | German English |
| oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-028243831 |
| oclc_num | 924396426 |
| open_access_boolean | |
| owner | DE-83 DE-703 |
| owner_facet | DE-83 DE-703 |
| physical | 411 S. Ill., graph. Darst. 25 cm |
| publishDate | 2015 |
| publishDateSearch | 2015 |
| publishDateSort | 2015 |
| publisher | Fraunhofer-Verl. |
| record_format | marc |
| spelling | Microelectronic packaging in the 21st century honorary volume on the occasion of Klaus-Dieter Lang's 60th birthday [Fraunhofer IZM]. Rolf Aschenbrenner ; Martin Schneider-Ramelow (eds.) Stuttgart Fraunhofer-Verl. 2015 411 S. Ill., graph. Darst. 25 cm txt rdacontent n rdamedia nc rdacarrier Beitr. teilw. dt., teilw. engl. - Literaturangaben Verbindungstechnik (DE-588)4129183-9 gnd rswk-swf TJ Fraunhofer IZM Zuverlässigkeit von Mikroelektronik Systemintegration auf Board- und Waferebene Zuverlässigkeit Test und Simulation für die AVT (DE-588)4143413-4 Aufsatzsammlung gnd-content (DE-588)4016928-5 Festschrift gnd-content Verbindungstechnik (DE-588)4129183-9 s DNB Aschenbrenner, Rolf edt Schneider-Ramelow, Martin edt Lang, Klaus-Dieter 1954- (DE-588)1070288225 hnr Fraunhofer-Institut für Zuverlässigkeit und Mikrointegration Sonstige (DE-588)10023208-5 oth DNB Datenaustausch application/pdf http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028243831&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA Inhaltsverzeichnis |
| spellingShingle | Microelectronic packaging in the 21st century honorary volume on the occasion of Klaus-Dieter Lang's 60th birthday Verbindungstechnik (DE-588)4129183-9 gnd |
| subject_GND | (DE-588)4129183-9 (DE-588)4143413-4 (DE-588)4016928-5 |
| title | Microelectronic packaging in the 21st century honorary volume on the occasion of Klaus-Dieter Lang's 60th birthday |
| title_auth | Microelectronic packaging in the 21st century honorary volume on the occasion of Klaus-Dieter Lang's 60th birthday |
| title_exact_search | Microelectronic packaging in the 21st century honorary volume on the occasion of Klaus-Dieter Lang's 60th birthday |
| title_full | Microelectronic packaging in the 21st century honorary volume on the occasion of Klaus-Dieter Lang's 60th birthday [Fraunhofer IZM]. Rolf Aschenbrenner ; Martin Schneider-Ramelow (eds.) |
| title_fullStr | Microelectronic packaging in the 21st century honorary volume on the occasion of Klaus-Dieter Lang's 60th birthday [Fraunhofer IZM]. Rolf Aschenbrenner ; Martin Schneider-Ramelow (eds.) |
| title_full_unstemmed | Microelectronic packaging in the 21st century honorary volume on the occasion of Klaus-Dieter Lang's 60th birthday [Fraunhofer IZM]. Rolf Aschenbrenner ; Martin Schneider-Ramelow (eds.) |
| title_short | Microelectronic packaging in the 21st century |
| title_sort | microelectronic packaging in the 21st century honorary volume on the occasion of klaus dieter lang s 60th birthday |
| title_sub | honorary volume on the occasion of Klaus-Dieter Lang's 60th birthday |
| topic | Verbindungstechnik (DE-588)4129183-9 gnd |
| topic_facet | Verbindungstechnik Aufsatzsammlung Festschrift |
| url | http://bvbr.bib-bvb.de:8991/F?func=service&doc_library=BVB01&local_base=BVB01&doc_number=028243831&sequence=000001&line_number=0001&func_code=DB_RECORDS&service_type=MEDIA |
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