APA (7th ed.) Citation

Rosine, L. L. (1965). Advances in Electronic Circuit Packaging: Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, held at Boulder, Colorado, August 19–21, 1964. Springer US. https://doi.org/10.1007/978-1-4899-7307-8

Chicago Style (17th ed.) Citation

Rosine, Lawrence L. Advances in Electronic Circuit Packaging: Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium Sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, Held at Boulder, Colorado, August 19–21, 1964. Boston, MA: Springer US, 1965. https://doi.org/10.1007/978-1-4899-7307-8.

MLA (9th ed.) Citation

Rosine, Lawrence L. Advances in Electronic Circuit Packaging: Volume 5 Proceedings of the Fifth International Electronic Circuit Packaging Symposium Sponsored by the University of Colorado, EDN (Electrical Design News), and Design News, Held at Boulder, Colorado, August 19–21, 1964. Springer US, 1965. https://doi.org/10.1007/978-1-4899-7307-8.