Adhesive Chemistry: Developments and Trends
Gespeichert in:
Weitere Verfasser: | |
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Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
Boston, MA
Springer US
1984
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Schriftenreihe: | Polymer Science and Technology
29 |
Schlagworte: | |
Online-Zugang: | Volltext |
Beschreibung: | Since the first symposium on Recent Advances in Adhesion, held September, 1971 in Washington, D. C. , this Division of the American Chemical Society has continuously sponsored several symposia on adhesion and adhesives. The chemists have gradually realized the importance of adhesion in various fields of science and technology. During these years, the science of adhesion has steadily grown along with progress in surface science and fracture mechanics. Moreover, new adhesives have been invented and applied in actual structures, for example, structural and aerospace adhesives. In response to socio-economic demands, new forms of adhesives have been introduced to combat the problems of pollution and to promote energy-conservation. The developments of hot-melt adhesives, waterborne adhesives, and radiation-curable adhesives are vivid examples of successes in solving some of the problems. As chemists, our hatural desire is to understand how those new adhesives and new forms of adhesives are made. Thus, we are interested in learning about the chemistry of adhesives so that we may create new generations of materials to satisfy future needs. It was based on this common interest that we set forth to organize this Symposium on Recent Developments in Adhesive Chemistry. It was held from March 21 through 23, 1983 in the Westin Hotel, Seattle, Washington. The Symposium was very well attended. As a matter of fact, for the first two sessions, we had to move from the smaller Mt. St |
Beschreibung: | 1 Online-Ressource (871p) |
ISBN: | 9781461324355 9781461294818 |
ISSN: | 0093-6286 |
DOI: | 10.1007/978-1-4613-2435-5 |
Internformat
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Datensatz im Suchindex
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discipline | Chemie / Pharmazie Physik |
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format | Electronic eBook |
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spelling | Adhesive Chemistry Developments and Trends edited by Lieng-Huang Lee Proceedings of a Symposium on Recent Developments in Adhesive Chemistry, sponsored by the Divsion of Organic Coatings and Plastics Chemistry of the American Chemical Society, held March 21-23, 1983, in Seattle, Washington Boston, MA Springer US 1984 1 Online-Ressource (871p) txt rdacontent c rdamedia cr rdacarrier Polymer Science and Technology 29 0093-6286 Since the first symposium on Recent Advances in Adhesion, held September, 1971 in Washington, D. C. , this Division of the American Chemical Society has continuously sponsored several symposia on adhesion and adhesives. The chemists have gradually realized the importance of adhesion in various fields of science and technology. During these years, the science of adhesion has steadily grown along with progress in surface science and fracture mechanics. Moreover, new adhesives have been invented and applied in actual structures, for example, structural and aerospace adhesives. In response to socio-economic demands, new forms of adhesives have been introduced to combat the problems of pollution and to promote energy-conservation. The developments of hot-melt adhesives, waterborne adhesives, and radiation-curable adhesives are vivid examples of successes in solving some of the problems. As chemists, our hatural desire is to understand how those new adhesives and new forms of adhesives are made. Thus, we are interested in learning about the chemistry of adhesives so that we may create new generations of materials to satisfy future needs. It was based on this common interest that we set forth to organize this Symposium on Recent Developments in Adhesive Chemistry. It was held from March 21 through 23, 1983 in the Westin Hotel, Seattle, Washington. The Symposium was very well attended. As a matter of fact, for the first two sessions, we had to move from the smaller Mt. St Chemistry Chemistry, Organic Polymers Chemical engineering Organic Chemistry Polymer Sciences Industrial Chemistry/Chemical Engineering Chemie Adhäsion (DE-588)4000493-4 gnd rswk-swf 1\p (DE-588)1071861417 Konferenzschrift 1983 Seattle Wash. gnd-content Adhäsion (DE-588)4000493-4 s 2\p DE-604 Lee, Lieng-Huang 1924- (DE-588)1053744641 edt Polymer Science and Technology 29 (DE-604)BV000010662 29 https://doi.org/10.1007/978-1-4613-2435-5 Verlag Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 2\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
spellingShingle | Adhesive Chemistry Developments and Trends Polymer Science and Technology Chemistry Chemistry, Organic Polymers Chemical engineering Organic Chemistry Polymer Sciences Industrial Chemistry/Chemical Engineering Chemie Adhäsion (DE-588)4000493-4 gnd |
subject_GND | (DE-588)4000493-4 (DE-588)1071861417 |
title | Adhesive Chemistry Developments and Trends |
title_alt | Proceedings of a Symposium on Recent Developments in Adhesive Chemistry, sponsored by the Divsion of Organic Coatings and Plastics Chemistry of the American Chemical Society, held March 21-23, 1983, in Seattle, Washington |
title_auth | Adhesive Chemistry Developments and Trends |
title_exact_search | Adhesive Chemistry Developments and Trends |
title_full | Adhesive Chemistry Developments and Trends edited by Lieng-Huang Lee |
title_fullStr | Adhesive Chemistry Developments and Trends edited by Lieng-Huang Lee |
title_full_unstemmed | Adhesive Chemistry Developments and Trends edited by Lieng-Huang Lee |
title_short | Adhesive Chemistry |
title_sort | adhesive chemistry developments and trends |
title_sub | Developments and Trends |
topic | Chemistry Chemistry, Organic Polymers Chemical engineering Organic Chemistry Polymer Sciences Industrial Chemistry/Chemical Engineering Chemie Adhäsion (DE-588)4000493-4 gnd |
topic_facet | Chemistry Chemistry, Organic Polymers Chemical engineering Organic Chemistry Polymer Sciences Industrial Chemistry/Chemical Engineering Chemie Adhäsion Konferenzschrift 1983 Seattle Wash. |
url | https://doi.org/10.1007/978-1-4613-2435-5 |
volume_link | (DE-604)BV000010662 |
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