Semiconductor Lithography: Principles, Practices, and Materials
Gespeichert in:
1. Verfasser: | |
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Format: | Elektronisch E-Book |
Sprache: | English |
Veröffentlicht: |
Boston, MA
Springer US
1988
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Schriftenreihe: | Microdevices, Physics and Fabrication Technologies
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Schlagworte: | |
Online-Zugang: | Volltext |
Beschreibung: | Semiconductor lithography is one of the key steps in the manufacturing of integrated silicon-based circuits. In fabricating a semiconductor device such as a transistor, a series of hot processes consisting of vacuum film deposition, oxidations, and dopant implantation are all patterned into microscopic circuits by the wet processes of lithography. Lithography, as adopted by the semiconductor industry, is the process of drawing or printing the pattern of an integrated circuit in a resist material. The pattern is formed and overlayed to a previous circuit layer as many as 30 times in the manufacture of logic and memory devices. With the resist pattern acting as a mask, a permanent device structure is formed by subtractive (removal) etching or by additive deposition of metals or insulators. Each process step in lithography uses inorganic or organic materials to physically transform semiconductors of silicon, insulators of oxides, nitrides, and organic polymers, and metals, into useful electronic devices. All forms of electromagnetic radiation are used in the processing. Lithography is a mUltidisciplinary science of materials, processes, and equipment, interacting to produce three-dimensional structures. Many aspects of chemistry, electrical engineering, materials science, and physics are involved. The purpose of this book is to bring together the work of many scientists and engineers over the last 10 years and focus upon the basic resist materials, the lithographic processes, and the fundamental principles behind each lithographic process |
Beschreibung: | 1 Online-Ressource (952p) |
ISBN: | 9781461308850 9781461282280 |
DOI: | 10.1007/978-1-4613-0885-0 |
Internformat
MARC
LEADER | 00000nmm a2200000zc 4500 | ||
---|---|---|---|
001 | BV042411244 | ||
003 | DE-604 | ||
005 | 00000000000000.0 | ||
007 | cr|uuu---uuuuu | ||
008 | 150316s1988 |||| o||u| ||||||eng d | ||
020 | |a 9781461308850 |c Online |9 978-1-4613-0885-0 | ||
020 | |a 9781461282280 |c Print |9 978-1-4612-8228-0 | ||
024 | 7 | |a 10.1007/978-1-4613-0885-0 |2 doi | |
035 | |a (OCoLC)863807674 | ||
035 | |a (DE-599)BVBBV042411244 | ||
040 | |a DE-604 |b ger |e aacr | ||
041 | 0 | |a eng | |
049 | |a DE-91 |a DE-83 | ||
082 | 0 | |a 621.3 |2 23 | |
084 | |a PHY 000 |2 stub | ||
100 | 1 | |a Moreau, Wayne M. |e Verfasser |4 aut | |
245 | 1 | 0 | |a Semiconductor Lithography |b Principles, Practices, and Materials |c by Wayne M. Moreau |
264 | 1 | |a Boston, MA |b Springer US |c 1988 | |
300 | |a 1 Online-Ressource (952p) | ||
336 | |b txt |2 rdacontent | ||
337 | |b c |2 rdamedia | ||
338 | |b cr |2 rdacarrier | ||
490 | 0 | |a Microdevices, Physics and Fabrication Technologies | |
500 | |a Semiconductor lithography is one of the key steps in the manufacturing of integrated silicon-based circuits. In fabricating a semiconductor device such as a transistor, a series of hot processes consisting of vacuum film deposition, oxidations, and dopant implantation are all patterned into microscopic circuits by the wet processes of lithography. Lithography, as adopted by the semiconductor industry, is the process of drawing or printing the pattern of an integrated circuit in a resist material. The pattern is formed and overlayed to a previous circuit layer as many as 30 times in the manufacture of logic and memory devices. With the resist pattern acting as a mask, a permanent device structure is formed by subtractive (removal) etching or by additive deposition of metals or insulators. Each process step in lithography uses inorganic or organic materials to physically transform semiconductors of silicon, insulators of oxides, nitrides, and organic polymers, and metals, into useful electronic devices. All forms of electromagnetic radiation are used in the processing. Lithography is a mUltidisciplinary science of materials, processes, and equipment, interacting to produce three-dimensional structures. Many aspects of chemistry, electrical engineering, materials science, and physics are involved. The purpose of this book is to bring together the work of many scientists and engineers over the last 10 years and focus upon the basic resist materials, the lithographic processes, and the fundamental principles behind each lithographic process | ||
650 | 4 | |a Engineering | |
650 | 4 | |a Computer engineering | |
650 | 4 | |a Optical materials | |
650 | 4 | |a Electrical Engineering | |
650 | 4 | |a Optical and Electronic Materials | |
650 | 4 | |a Ingenieurwissenschaften | |
650 | 0 | 7 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Lithografie |g Halbleitertechnologie |0 (DE-588)4191584-7 |2 gnd |9 rswk-swf |
650 | 0 | 7 | |a Fotolithografie |g Halbleitertechnologie |0 (DE-588)4174516-4 |2 gnd |9 rswk-swf |
689 | 0 | 0 | |a Fotolithografie |g Halbleitertechnologie |0 (DE-588)4174516-4 |D s |
689 | 0 | 1 | |a Integrierte Schaltung |0 (DE-588)4027242-4 |D s |
689 | 0 | |8 1\p |5 DE-604 | |
689 | 1 | 0 | |a Lithografie |g Halbleitertechnologie |0 (DE-588)4191584-7 |D s |
689 | 1 | |8 2\p |5 DE-604 | |
856 | 4 | 0 | |u https://doi.org/10.1007/978-1-4613-0885-0 |x Verlag |3 Volltext |
912 | |a ZDB-2-PHA |a ZDB-2-BAE | ||
940 | 1 | |q ZDB-2-PHA_Archive | |
999 | |a oai:aleph.bib-bvb.de:BVB01-027846737 | ||
883 | 1 | |8 1\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk | |
883 | 1 | |8 2\p |a cgwrk |d 20201028 |q DE-101 |u https://d-nb.info/provenance/plan#cgwrk |
Datensatz im Suchindex
_version_ | 1804153072430088192 |
---|---|
any_adam_object | |
author | Moreau, Wayne M. |
author_facet | Moreau, Wayne M. |
author_role | aut |
author_sort | Moreau, Wayne M. |
author_variant | w m m wm wmm |
building | Verbundindex |
bvnumber | BV042411244 |
classification_tum | PHY 000 |
collection | ZDB-2-PHA ZDB-2-BAE |
ctrlnum | (OCoLC)863807674 (DE-599)BVBBV042411244 |
dewey-full | 621.3 |
dewey-hundreds | 600 - Technology (Applied sciences) |
dewey-ones | 621 - Applied physics |
dewey-raw | 621.3 |
dewey-search | 621.3 |
dewey-sort | 3621.3 |
dewey-tens | 620 - Engineering and allied operations |
discipline | Physik Elektrotechnik / Elektronik / Nachrichtentechnik |
doi_str_mv | 10.1007/978-1-4613-0885-0 |
format | Electronic eBook |
fullrecord | <?xml version="1.0" encoding="UTF-8"?><collection xmlns="http://www.loc.gov/MARC21/slim"><record><leader>03633nmm a2200553zc 4500</leader><controlfield tag="001">BV042411244</controlfield><controlfield tag="003">DE-604</controlfield><controlfield tag="005">00000000000000.0</controlfield><controlfield tag="007">cr|uuu---uuuuu</controlfield><controlfield tag="008">150316s1988 |||| o||u| ||||||eng d</controlfield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781461308850</subfield><subfield code="c">Online</subfield><subfield code="9">978-1-4613-0885-0</subfield></datafield><datafield tag="020" ind1=" " ind2=" "><subfield code="a">9781461282280</subfield><subfield code="c">Print</subfield><subfield code="9">978-1-4612-8228-0</subfield></datafield><datafield tag="024" ind1="7" ind2=" "><subfield code="a">10.1007/978-1-4613-0885-0</subfield><subfield code="2">doi</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(OCoLC)863807674</subfield></datafield><datafield tag="035" ind1=" " ind2=" "><subfield code="a">(DE-599)BVBBV042411244</subfield></datafield><datafield tag="040" ind1=" " ind2=" "><subfield code="a">DE-604</subfield><subfield code="b">ger</subfield><subfield code="e">aacr</subfield></datafield><datafield tag="041" ind1="0" ind2=" "><subfield code="a">eng</subfield></datafield><datafield tag="049" ind1=" " ind2=" "><subfield code="a">DE-91</subfield><subfield code="a">DE-83</subfield></datafield><datafield tag="082" ind1="0" ind2=" "><subfield code="a">621.3</subfield><subfield code="2">23</subfield></datafield><datafield tag="084" ind1=" " ind2=" "><subfield code="a">PHY 000</subfield><subfield code="2">stub</subfield></datafield><datafield tag="100" ind1="1" ind2=" "><subfield code="a">Moreau, Wayne M.</subfield><subfield code="e">Verfasser</subfield><subfield code="4">aut</subfield></datafield><datafield tag="245" ind1="1" ind2="0"><subfield code="a">Semiconductor Lithography</subfield><subfield code="b">Principles, Practices, and Materials</subfield><subfield code="c">by Wayne M. Moreau</subfield></datafield><datafield tag="264" ind1=" " ind2="1"><subfield code="a">Boston, MA</subfield><subfield code="b">Springer US</subfield><subfield code="c">1988</subfield></datafield><datafield tag="300" ind1=" " ind2=" "><subfield code="a">1 Online-Ressource (952p)</subfield></datafield><datafield tag="336" ind1=" " ind2=" "><subfield code="b">txt</subfield><subfield code="2">rdacontent</subfield></datafield><datafield tag="337" ind1=" " ind2=" "><subfield code="b">c</subfield><subfield code="2">rdamedia</subfield></datafield><datafield tag="338" ind1=" " ind2=" "><subfield code="b">cr</subfield><subfield code="2">rdacarrier</subfield></datafield><datafield tag="490" ind1="0" ind2=" "><subfield code="a">Microdevices, Physics and Fabrication Technologies</subfield></datafield><datafield tag="500" ind1=" " ind2=" "><subfield code="a">Semiconductor lithography is one of the key steps in the manufacturing of integrated silicon-based circuits. In fabricating a semiconductor device such as a transistor, a series of hot processes consisting of vacuum film deposition, oxidations, and dopant implantation are all patterned into microscopic circuits by the wet processes of lithography. Lithography, as adopted by the semiconductor industry, is the process of drawing or printing the pattern of an integrated circuit in a resist material. The pattern is formed and overlayed to a previous circuit layer as many as 30 times in the manufacture of logic and memory devices. With the resist pattern acting as a mask, a permanent device structure is formed by subtractive (removal) etching or by additive deposition of metals or insulators. Each process step in lithography uses inorganic or organic materials to physically transform semiconductors of silicon, insulators of oxides, nitrides, and organic polymers, and metals, into useful electronic devices. All forms of electromagnetic radiation are used in the processing. Lithography is a mUltidisciplinary science of materials, processes, and equipment, interacting to produce three-dimensional structures. Many aspects of chemistry, electrical engineering, materials science, and physics are involved. The purpose of this book is to bring together the work of many scientists and engineers over the last 10 years and focus upon the basic resist materials, the lithographic processes, and the fundamental principles behind each lithographic process</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Computer engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Electrical Engineering</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Optical and Electronic Materials</subfield></datafield><datafield tag="650" ind1=" " ind2="4"><subfield code="a">Ingenieurwissenschaften</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Lithografie</subfield><subfield code="g">Halbleitertechnologie</subfield><subfield code="0">(DE-588)4191584-7</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="650" ind1="0" ind2="7"><subfield code="a">Fotolithografie</subfield><subfield code="g">Halbleitertechnologie</subfield><subfield code="0">(DE-588)4174516-4</subfield><subfield code="2">gnd</subfield><subfield code="9">rswk-swf</subfield></datafield><datafield tag="689" ind1="0" ind2="0"><subfield code="a">Fotolithografie</subfield><subfield code="g">Halbleitertechnologie</subfield><subfield code="0">(DE-588)4174516-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2="1"><subfield code="a">Integrierte Schaltung</subfield><subfield code="0">(DE-588)4027242-4</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="0" ind2=" "><subfield code="8">1\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="689" ind1="1" ind2="0"><subfield code="a">Lithografie</subfield><subfield code="g">Halbleitertechnologie</subfield><subfield code="0">(DE-588)4191584-7</subfield><subfield code="D">s</subfield></datafield><datafield tag="689" ind1="1" ind2=" "><subfield code="8">2\p</subfield><subfield code="5">DE-604</subfield></datafield><datafield tag="856" ind1="4" ind2="0"><subfield code="u">https://doi.org/10.1007/978-1-4613-0885-0</subfield><subfield code="x">Verlag</subfield><subfield code="3">Volltext</subfield></datafield><datafield tag="912" ind1=" " ind2=" "><subfield code="a">ZDB-2-PHA</subfield><subfield code="a">ZDB-2-BAE</subfield></datafield><datafield tag="940" ind1="1" ind2=" "><subfield code="q">ZDB-2-PHA_Archive</subfield></datafield><datafield tag="999" ind1=" " ind2=" "><subfield code="a">oai:aleph.bib-bvb.de:BVB01-027846737</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">1\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield><datafield tag="883" ind1="1" ind2=" "><subfield code="8">2\p</subfield><subfield code="a">cgwrk</subfield><subfield code="d">20201028</subfield><subfield code="q">DE-101</subfield><subfield code="u">https://d-nb.info/provenance/plan#cgwrk</subfield></datafield></record></collection> |
id | DE-604.BV042411244 |
illustrated | Not Illustrated |
indexdate | 2024-07-10T01:20:47Z |
institution | BVB |
isbn | 9781461308850 9781461282280 |
language | English |
oai_aleph_id | oai:aleph.bib-bvb.de:BVB01-027846737 |
oclc_num | 863807674 |
open_access_boolean | |
owner | DE-91 DE-BY-TUM DE-83 |
owner_facet | DE-91 DE-BY-TUM DE-83 |
physical | 1 Online-Ressource (952p) |
psigel | ZDB-2-PHA ZDB-2-BAE ZDB-2-PHA_Archive |
publishDate | 1988 |
publishDateSearch | 1988 |
publishDateSort | 1988 |
publisher | Springer US |
record_format | marc |
series2 | Microdevices, Physics and Fabrication Technologies |
spelling | Moreau, Wayne M. Verfasser aut Semiconductor Lithography Principles, Practices, and Materials by Wayne M. Moreau Boston, MA Springer US 1988 1 Online-Ressource (952p) txt rdacontent c rdamedia cr rdacarrier Microdevices, Physics and Fabrication Technologies Semiconductor lithography is one of the key steps in the manufacturing of integrated silicon-based circuits. In fabricating a semiconductor device such as a transistor, a series of hot processes consisting of vacuum film deposition, oxidations, and dopant implantation are all patterned into microscopic circuits by the wet processes of lithography. Lithography, as adopted by the semiconductor industry, is the process of drawing or printing the pattern of an integrated circuit in a resist material. The pattern is formed and overlayed to a previous circuit layer as many as 30 times in the manufacture of logic and memory devices. With the resist pattern acting as a mask, a permanent device structure is formed by subtractive (removal) etching or by additive deposition of metals or insulators. Each process step in lithography uses inorganic or organic materials to physically transform semiconductors of silicon, insulators of oxides, nitrides, and organic polymers, and metals, into useful electronic devices. All forms of electromagnetic radiation are used in the processing. Lithography is a mUltidisciplinary science of materials, processes, and equipment, interacting to produce three-dimensional structures. Many aspects of chemistry, electrical engineering, materials science, and physics are involved. The purpose of this book is to bring together the work of many scientists and engineers over the last 10 years and focus upon the basic resist materials, the lithographic processes, and the fundamental principles behind each lithographic process Engineering Computer engineering Optical materials Electrical Engineering Optical and Electronic Materials Ingenieurwissenschaften Integrierte Schaltung (DE-588)4027242-4 gnd rswk-swf Lithografie Halbleitertechnologie (DE-588)4191584-7 gnd rswk-swf Fotolithografie Halbleitertechnologie (DE-588)4174516-4 gnd rswk-swf Fotolithografie Halbleitertechnologie (DE-588)4174516-4 s Integrierte Schaltung (DE-588)4027242-4 s 1\p DE-604 Lithografie Halbleitertechnologie (DE-588)4191584-7 s 2\p DE-604 https://doi.org/10.1007/978-1-4613-0885-0 Verlag Volltext 1\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk 2\p cgwrk 20201028 DE-101 https://d-nb.info/provenance/plan#cgwrk |
spellingShingle | Moreau, Wayne M. Semiconductor Lithography Principles, Practices, and Materials Engineering Computer engineering Optical materials Electrical Engineering Optical and Electronic Materials Ingenieurwissenschaften Integrierte Schaltung (DE-588)4027242-4 gnd Lithografie Halbleitertechnologie (DE-588)4191584-7 gnd Fotolithografie Halbleitertechnologie (DE-588)4174516-4 gnd |
subject_GND | (DE-588)4027242-4 (DE-588)4191584-7 (DE-588)4174516-4 |
title | Semiconductor Lithography Principles, Practices, and Materials |
title_auth | Semiconductor Lithography Principles, Practices, and Materials |
title_exact_search | Semiconductor Lithography Principles, Practices, and Materials |
title_full | Semiconductor Lithography Principles, Practices, and Materials by Wayne M. Moreau |
title_fullStr | Semiconductor Lithography Principles, Practices, and Materials by Wayne M. Moreau |
title_full_unstemmed | Semiconductor Lithography Principles, Practices, and Materials by Wayne M. Moreau |
title_short | Semiconductor Lithography |
title_sort | semiconductor lithography principles practices and materials |
title_sub | Principles, Practices, and Materials |
topic | Engineering Computer engineering Optical materials Electrical Engineering Optical and Electronic Materials Ingenieurwissenschaften Integrierte Schaltung (DE-588)4027242-4 gnd Lithografie Halbleitertechnologie (DE-588)4191584-7 gnd Fotolithografie Halbleitertechnologie (DE-588)4174516-4 gnd |
topic_facet | Engineering Computer engineering Optical materials Electrical Engineering Optical and Electronic Materials Ingenieurwissenschaften Integrierte Schaltung Lithografie Halbleitertechnologie Fotolithografie Halbleitertechnologie |
url | https://doi.org/10.1007/978-1-4613-0885-0 |
work_keys_str_mv | AT moreauwaynem semiconductorlithographyprinciplespracticesandmaterials |